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35 um thick BN-loaded epoxy mounts

200 um thick silicon readout chips. 1). 200 um thick diamond active pixels. 100 um thick CVD support diamond. 35 um thick BN-loaded epoxy mounts. Conductive carbon fiber foam (2 x 6 mm square).

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35 um thick BN-loaded epoxy mounts

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  1. 200 um thick silicon readout chips 1) 200 um thick diamond active pixels 100 um thick CVD support diamond 35 um thick BN-loaded epoxy mounts Conductive carbon fiber foam (2 x 6 mm square) ~200 um wall thickness Al tube (6 mm square), CO2 cooling (1/2 full liquid), thermal grease coat (35 um thick) RVC foam 4 cm 200 um thick silicon readout chips 200 um thick silicon readout chips 2) 200 um thick silicon active pixels 4) 200 um thick diamond active pixels 100 um thick CVD support diamond 200 um thick CVD support diamond 35 um thick BN-loaded epoxy mounts Conductive carbon fiber foam (2 x 6 mm square) ~ Fluorinert FC-87 mist ~ ~200 um wall thickness Al tube (6 mm square), CO2 cooling (1/2 full liquid), thermal grease coat (35 um thick) RVC foam 4 cm 200 um thick silicon readout chips 3) 200 um thick diamond active pixels [Same as 1) but with all the diamond CVD bonded to Be tube, no glue or thermal grease] 100 um thick CVD support diamond CVD bonded, NO epoxy mounts Conductive carbon fiber foam (2 x 6 mm square) ~200 um wall thickness Be tube (6 mm square), CO2 cooling (1/2 full liquid), CVD bonded -- NO thermal grease coat RVC foam

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