EML 4561 Introduction to Electronic Packaging

1. EML 4561Introduction to Electronic Packaging W. Kinzy Jones, Professor MME MWF 11:00-11:50 Jones@fiu.edu 305-393-0506(mobile) 305-348-4663 (office)

2. Notes on the field • I am Past President and Fellow, IMAPS, The Microelectronics and Packaging Society • Research in advanced packaging, 1st Level Assembly, Thermal Management, Components and Electronic Materials- Funded over $7MM in past 15 years • Electronic packaging is a application field that crosses over many disciplines. There are 80,000 ME working in the field. Conferences/journals by ASME, IEEE, ASM, IMAPS, etc. • All former graduate student hired prior to graduation!

3. Outline • Technological Drivers • Design Process • Electrical Consideration • Mechanical Constraints • Thermal Management • Material Science Fundamentals • Interconnect Technology • Laminate technology • Ceramic Processes ( thick film, cofire ceramic) • Thin Film Deposited

4. Outline (Cont.) • Components • Active components technologies • Passive Components technologies • IC Packaging ( from DIP to System-on-package (SOP)) • Assembly • First Level Assembly ( wire bonding, flip chip) • Soldering • Manufacturing Processes • Reliability • MIL Standards • Reliability Projections

5. Introduction to Microsystems Packaging

6. Definition of Packaging IC Board Packaging is a Bridge from IC to System • It Controls: • >90% size • Performance • Cost • Reliability

7. Packaging Hierarchy

8. Microsystems Technologies

9. System Packaging Involves Electrical, Mechanical and Materials Technologies

10. Analogy Between Human and Electronics

11. Trend to Convergent Microsystems Packaging Photonics Microelectronics Convergent Microsystems Discrete Systems RF MEMS Bioelectronics Past Future

12. Building Block of Microsystems Packaging

13. Trend to Convergent Systems Convergent Systems Transistors / chip WW S/C Revenue ($B) 10000 • All businesses, people, objects • Network computing • Wide area / bandwidth • Graphical, voice, multimedia, etc. • Many vendors / platforms 100B 10B 1000 1B • Wireless • Wired PCs / Servers 100M Internet 100 10M Mainframes • Businesses & some people • Client-server computing • Local area connection • Text/graphical interface • Many vendors / few architectures 1M 10 PCs 100K • Businesses • Host-based computing • Mainframe • Dumb terminal • Few vendors / architecture 10K 1 1K 2015 1975 1995 Today Year Source: Russ Lange, IBM Microelectronics

14. What are Convergent Microminiaturized Microsystems (CMM)? • Convergent: Two or more functions • Microminiaturized: >1000x volume reductions • Microsystems: systems with micro-scale technologies

15. CONSUMER ELECTRONICS MEDICAL Medical Implant/ Diagnostic Monitor/ Communicator Video Cell Phone Trend to Convergent Microminiaturized Systems (CMM) • Functional • Data and Voice • Technology • Digital, RF, Analog and Optical • Product • Computer, consumer and telecom

16. The Invention of the First IC

17. Moore ’s Law: Doubles Every 18 Months

18. Moore’s Law Cu - low K SOC Advances SiGe SOI

19. Integration RF Limits Fundamental Digital Limits SOC Challenges Major Delay Problems Summary • Fundamental • Design & Verification Complexity • Test Complexity • Process Complexity • Mixed Function Costs • Wafer Fab Costs • Legal Problems • Time-to-market

20. SOC: Integration of Two or More Mixed Functions in a Single IC (a) (b)

21. What is Wrong with Current Packaging for Tomorrow’s Needs? Bulky Size Higher Cost Cellular Phone Weight Trend • Active ICs 10% • Passives: 90% Lower Performance Poorer Reliability • IC: PPB • Systems Pkg: PPM Barrier to all future systems

22. What is SOP, SIP, or Board? Package Flash RAM IC mP Stacked IC (Amkor) Package (Fujitsu) Super IC Stack (ASET) RF IC Digital IC Optical IC Substrate A.) Today’s Board: Interconnect Components B.) SIP: Stacked Chip/Package for Reduced Form Factors 3-D ICs IC RF IC Opto IC Digital IC RF Opto Electrical Package with Opto, RF, Digital Functions C.) SOP: Optimizes Functions Between ICs and Package

23. What are SOC, SIP, and SOP? • SOC: System on Chip • Highly integrated and mixed signal IC with partial system functions in one component • SIP: System in Package • 3-D IC or Package Assembly • Requires Systems Board • SOP: System on Package • Microminiaturized system-level board with two or more embedded RF, digital, analog and optical functions • Best of on-chip and package integration for cost, performance, size and reliability • Similar to SOC but total system function in a microminiaturized board

24. SOP: SIP + SOC+Systems Board SIP SOP • 3 -D Stacking of ICS or Package Structures, Similar to PWB • Macro dimensions • Vertical stack up • Testable • 3 -D Build up, similar to IC Fabrication • Micro to Nano dimensions • Sequential build up and test similar to MCM-D and IC • Wafer to IC concept for high yield MEMS SIP Ga-As SOC MEMS Ga-As SOC SIP

25. Why SOP? • SOC is complex to design and test, expensive to Fabricate, long time-to-market and presents fundamental limits. • IC company’s dream for decades. No complete system has been shipped to date. • SOP optimizes the best of IC and package integration for cost, performance, size and reliability. • Faster turn-around and faster time-to-market. • Provides full system solution today that SOC provides tomorrow. • SIP is a 3-D IC or package, not a complete system

26. Information Technology is a Trillion $ Industry Microsystems & Packaging is 25% of IT Industrial & Medical 11% $105B Automotive 5% $ 48B Military 9% $ 8.7B Consumer 26% $112B Business Equip 38% $ 383B Communications 26% $ 259B Source: Prismark

27. MSP Market ($320 B) Opto & MEMS ($30B) Microelectronics ($165B) Systems Packaging ($125B)

28. Information Technology and Microsystem Markets Billion $/Year

29. Hardware and Software Markets

30. Functions of Packaging

31. Package Interconnections

32. Core Technologies • Substrates, circuit boards • Interconnect • Passive components • Active components • Packaging • Traditionally these were treated as discrete elements • Advanced applications require integrated approach of System Level Packaging

33. Substrates and Circuit Boards • Printed Circuit Board (PCB), Printed Wiring Board (PWB) • Epoxy-glass composite, copper • FR-4, FR = fire retardant • Advanced Resins • Polyimide • BT = bismaleimide traizine • CE = cyanate ester • Ceramic substrates • Aluminum oxide, aluminum nitride, beryllium oxide, glass-ceramic • Interconnect metals - W, Mo, Au, Cu, Ag • Multichip Modules • MCM-D,C,L • Platform • Support interconnect and components • Thermal path away from ICs • Withstand mechanical stresses and vibrations

34. Packaging Evolution ?

35. Microelectronic Density Trends microprocessors logic

36. Rent’s Rule

37. Packaging Evolution

38. I/O Density Trends Chip

39. Package Evolution

40. Packaging Trends (Cont.)

41. Assembly Processes • Board Fabrication • Single layer • Multilayer • PCB • Flex • Ceramic • Populating the board • Pick and place • Insertion • Die attach • Soldering • Solder paste reflow • Wave solder • Solder bump reflow • Encapsulation

42. SIA Roadmap for Chip Interconnections, 1995

43. CMOS Device Trends Buda et al, 42 CPMT, pp36-41, 1992

44. NEMI Roadmap, 1996 Packaging trends in Consumer Electronics Packaging trends in Automotive Electronics

45. iNEMI Roadmap, 2009

46. NEMI Roadmap for Packaging Trends in High-Performance Systems

47. High Performance Systems, iNEMI 2009

48. Interconnect Density, Std. PWB .1mm = 4 mils

49. Thermal Cooling Requirements

50. Types of First Level Packages