1 / 20

Advancing Optics with Physical & Link Layer Interoperability

Advancing Optics with Physical & Link Layer Interoperability. Steve Joiner OIF Technical Committee Chair Ignis Optics steve.joiner@ignisoptics.com. Agenda. Mission of the Optical Internetworking Forum OIF’s Strategy to advance optics What are Implementation Agreements?

crete
Télécharger la présentation

Advancing Optics with Physical & Link Layer Interoperability

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Advancing Optics with Physical & Link Layer Interoperability Steve Joiner OIF Technical Committee Chair Ignis Optics steve.joiner@ignisoptics.com

  2. Agenda • Mission of the Optical Internetworking Forum • OIF’s Strategy to advance optics • What are Implementation Agreements? • Published Implementation Agreements • Work in Progress • OIF at Supercomm2003

  3. OIF’s Mission • Foster the development and deployment of interoperable products and services for data switching and routing using optical networking technologies. • Requires addressing multiple issues related to optical internetworking for • Carrier • System vendor • Component vendor Integrated approach strengthens the OIF’s ability to fulfill its mission.

  4. Strategy to Achieve Mission • Industry Driven Focus • Carrier Voice in the technical committee • Membership driven • Develop Implementation Agreements • Rapid Development controlled by a rigorous standards-like process • Working Group Organization • Carrier • Architecture • Signaling • OAM&P (security) • Physical and Link Layer (PLL) • Interoperability

  5. Implementation Agreements • Narrowing the choices to a single profile • Create the “Glue Logic” that enables the commercial implementation of standards • Create new standards when needed

  6. Do IAs advance the optics industry? • Improves development efficiency • Collective wisdom prevails • Reduces development mis-steps • Results driven process required • Technology providers make first solution selection • Improves adoption rate by industry • Interoperability tests reduce risk • Improves confidence in new technology • Improves system cost • Creates competition • Competitive edge driven by factors other than basic performance; i.e. price, efficiency, etc. • Improves time to market

  7. Published IAs • Network control and signaling • Electrical interfaces • Optical interfaces • Optical multi-source agreement • Security • Critical non-IAs driving the industry • Carrier Requirement Documents • Liaisons to ITU, IETF, T1X1…

  8. OIF Electrical Specifications

  9. OIF Electrical Specifications • SFI = SERDES to Framer Interface • SPI = System Packet Interface • TFI = TDM Fabric Interface • CEI = Common Electrical Specification Electrical Interface Architecture for the Data Path

  10. TransmitLink Layer Device SERDES Framer Interface (SFI) SERDES Framer Interface (SFI) Optical Interface System Packet Interface (SPI) Receive Link Layer Device PHY Device SERDES Device and Optics FEC Data Status Data Data Data Clock Clock Status T F I Data Data Data Clock Clock Data TDM Fabric to Framer Interface (TFI) OIF Electrical Specifications OR

  11. S y s t e m t o O p t i c s System Packet Interface (SPI) Transmit Interface TransmitLink Layer Device PHY Device Data Status Receive Link Layer Device Data Status Receive Interface O p t i c s t o S y s t e m System Packet Interface (SPI-n) OC-48 SPI3-1 16 lane path OC-192 SPI4-1 16 lane path SPI4-2 4 lane path OC-768 SPI5-1 16 lane path

  12. OIF-SFI-4 phase 1 Electrical Interface REFCLK REFCLK REFCLK TXDATA [15:0] TXDATA [15:0] Framer FEC Processor C D Serdes C D TXCLK TXCLK TXCLKSRC TXCLKSRC B A B A RXDATA [15:0] RXDATA [15:0] RXCLK RXCLK A B B A S y s t e m t o O p t i c s O p t i c s t o S y s t e m The 300 pin MSA data interface

  13. OIF-SFI-4 phase 1  OIF-SFI-4 phase 2 Phase 1 Phase 1 REFCLK REFCLK REFCLK TXDATA [15:0] TXDATA [15:0] Framer FEC Processor C D Serdes C D TXCLK TXCLK TXCLKSRC TXCLKSRC B A B A RXDATA [15:0] RXDATA [15:0] RXCLK RXCLK A B B A Phase 1 Phase 1 S y s t e m t o O p t i c s O p t i c s t o S y s t e m

  14. OIF-SFI-4 phase 1  OIF-SFI-4 phase 2 Phase 2 Phase 2 REFCLK REFCLK REFCLK TXDATA [3:0] TXDATA [3:0] Framer FEC Processor C D Serdes C D TXCLK TXCLK TXCLKSRC TXCLKSRC B A B A RXDATA [3:0] RXDATA [3:0] RXCLK RXCLK A B B A Phase 2 Phase 2 S y s t e m t o O p t i c s O p t i c s t o S y s t e m

  15. REFCK REFCK REFCK TXDATA [3:0] TXDATA [3:0] C D C D TXCKSRC TXCKSRC B A B A RXDATA [3:0] RXDATA [3:0] B A B A OIF-SFI-4 phase 2 Electrical Interface S y s t e m t o O p t i c s Framer FEC Processor Serdes 8" 8" O p t i c s t o S y s t e m Capable of driving at least 8” of FR4 interconnect with one connector

  16. SFI-5 OC-768 SERDES to Framer Interface S y s t e m t o O p t i c s TXREFCK TXREFCK TXREFCK C D C D Framer FEC Processor Serdes TXDATA [15:0] TXDATA [15:0] TXDSC TXDSC TXDCK TXDCK TXCKSRC TXCKSRC EFEC GFEC B A B A RXDATA [15:0] RXDATA [15:0] RXDSC RXDSC RXDCK RXDCK B B A A RXS RXS RXREFCK RXREFCK O p t i c s t o S y s t e m Supports Forward Error Correction (FEC).

  17. TDM Fabric to Framer (TFI-5)Reference Diagram SONET Framer SONET Signals SONET/SDH OC 3/12/48/192/768 SONET Framer FEC Processor G.709 OTN OTM 1/2/3 TDM Switch Fabric Non-SONET Signals SONET Framer 10GE LAN PH Processor 10GE LAN PHY TFI - 5

  18. Tunable Laser IAs • Tuneable Laser IA • Classify Tunable lasers by application and features • Protocol for Command; multiple interfaces • Multiple mechanical feature options • Tuneable Laser MSA IA • Specific set of choices from Tuneable Laser IA

  19. Common Electrical I/0 (CEI) • Supercomm2003 – Introduction to market • Under Development by OIF • 4 physical link interfaces • 6+ Gbs Short Reach Long Reach • 11+ Gbs Short Reach Long reach • Short reach • Chip to chip • Chip to module across one connector • Long Reach • Backplane with two connectors • Data signaling for future interfaces • Future SPI4 and SPI5 interfaces • Future SFI4 and SFI5 interfaces • Future TFI5 interface

  20. OIF at Supercomm 2003 • Superdemo Area • See interoperability demonstrations • CEI 6+ G Long reach • CEI 11+ G Short reach • CEI 11+ G Long reach • SPI-4.2 • SFI-4.1 • Tuneable Laser MSA • UNI/NNI

More Related