ALD Equipment Market worth $6.0 billion by 2027

1. MarketsandMarkets Presents ALD Equipment Market worth $6.0 billion by 2027 ALD Equipment Market is projected reach USD 6.0 billion by 2027 from USD 4.1 billion in 2021, at a CAGR of 8.2% during forecast period, according to a new report by MarketsandMarkets™ https://www.marketsandmarkets.com/Market-Reports/atomic-layer-deposition-ald-equipment-market-96683066.html

2. The ALD Equipment Market is projected reach USD 6.0 billion by 2027 from USD 4.1 billion in 2021, at a CAGR of 8.2% during forecast period,according to a new report by MarketsandMarkets™. Constantly developing semiconductor industry, proliferation of 3D NAND SSDs, and the advantages offered by ALD are some of the major factors driving the market growing during the forecast period. Browse 165 market data Tables and 62 Figures spread through 192 Pages and in-depth TOC on "ALD Equipment Market by Film Type (Oxide, Metal, Sulfide, Nitride), Deposition Method, Application (Semiconductor) (More-than-Moore, Research & Development Facilities, More Moore), Application (Non-semiconductor) and Region - Global Forecast to 2027"

3. Plasma-enhanced ALD to account for the largest share of the ALD equipment market during the forecast period The growing demand for logic and memory devices for various applications is expected to create opportunities for the adoption of ALD. Plasma-enhanced ALD is highly suited for thin film encapsulation of OLED displays and wafer processing for manufacturing logic and memory devices. In recent years, there has been a significant rise in demand for plasma-enhanced ALD due to the advantages it offers, such as facilitating the deposition of thin films at low temperatures and a higher growth rate compared to conventional deposition methods such as thermal ALD. Ask PDF Brochure: https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=96683066 More-than-Moore applications to register highest growth in the ALD equipment market during the forecast period The emergence of advanced technologies such as the Internet of Things (IoT), artificial intelligence (AI), and 5G has significantly increased the demand for semiconductor devices. To meet this increasing demand, market players are manufacturing various More-than-Moore devices such as MEMs and sensors, RF devices, advanced packaging, power devices, photonics, and CMOS image sensors. The adoption of these devices facilitates higher device scaling and cost reduction. For More-than-Moore applications, ALD can be used for various front-end processes such as surface passivation, wafer level encapsulation, nucleation layers, and gate dielectric deposition.

4. Asia Pacific to account for the largest share of the ALD equipment market during forecast period Financial support by various governments is a major factor driving the market growth in Asia Pacific. For instance, the South Korean government announced an expenditure of USD 451 billion by 2030 to strengthen the country's domestic semiconductor production capabilities. Moreover, the growing number of research facilities and growing advancements related to the semiconductor industry in Asia Pacific are expected to provide growth opportunities for market players offering ALD equipment. The availability of inexpensive skilled workforce in Asia Pacific is also a major factor driving the market growth. Request Free Sample Pages: https://www.marketsandmarkets.com/requestsampleNew.asp?id=96683066 The report profiles key players such as ASM International N.V. (Netherlands), Tokyo Electron Limited (Japan), Applied Materials, Inc. (US), Lam Research Corporation (US), Veeco Instruments Inc. (US), Kurt J. Lesker Company (US), Optorun Co., Ltd. (Japan), CVD Equipment Corporation (US), Eugene Technology Co. Ltd. (South Korea), and Beneq (Finland)

5. Recent Developments • In June 2022, Applied Materials announced the acquisition of Picosun Oy, a global leader in ALD based in Finland. With this acquisition, Applied Materials aims to harness Picosun’s capabilities to provide innovative solutions for the IoT, communications, automotive, sensor, and power markets. This acquisition would broaden Applied Materials’ portfolio related to specialty chips • In March 2022, ASM International N.V. acquired Reno Sub-Systems Inc. (Reno), a company that offers RF matching sub-systems for equipment used to manufacture semiconductors. With this acquisition, ASMI aims to enhance its portfolio of plasma products with the help of Reno’s RF generators and matching networks • In September 2020, Lam Research Corporation launched the Striker FE ALD system that is highly suited for manufacturing high aspect-ratio chip architectures. The system uses ICEFill technology for filling structures in 3D NAND, logic devices, and DRAM chips • In September 2019, Tokyo Electron Limited announced the merger of TEL FSI, Inc. and TEL Epion Inc., subsidiaries of Tokyo Electron U.S. Holdings, Inc. (US). With the merger of these subsidiaries, the company optimized and enhanced manufacturing processes and improved operational efficiency • In May 2017, Veeco Instruments Inc. announced the acquisition of Ultratech, Inc., a leading supplier of lithography, laser processing, and inspection systems used in the production of LEDs and other semiconductor devices. With this acquisition, Veeco strengthened its product portfolio of advanced packaging lithography systems

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