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Optimal Heat Sink Selection for TO-220 Packages: Ensuring Thermal Performance

This guide explores the thermal resistance calculations necessary for selecting appropriate clip-on and bond-on heat sinks for TO-220 packages dissipating 5 watts. It details key parameters including junction temperature (TJmax = 150°C) and ambient temperature (TAmax = 50°C), with specific focus on maintaining thermal performance in natural convection. It also discusses the significance of the thermal interface material (Thermalcote) and provides insights into calculating thermal resistances (RJC and RSA), ensuring compliance with required thermal limits for effective device operation.

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Optimal Heat Sink Selection for TO-220 Packages: Ensuring Thermal Performance

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  1. ECE 442

  2. Clip-On Heat Sinks ECE 442

  3. Thermal Resistance for Clip-On ECE 442

  4. Bond-On Extrusions for DIP Packages ECE 442

  5. Thermal Performance ECE 442

  6. Thermal Resistances for Bond-On ECE 442

  7. Example • TO-220 case style dissipating 5 watts • RJC = 3.0 C / Watt (from device spec) • TJmax = 150 C • TAmax = 50 C • Find the proper heat sink to keep the junction temperature from exceeding 150C in natural convection. ECE 442

  8. Need to determine a value for RCS – depends on the mounting technique. If the device is mounted without an insulator, but only with Thermalcote, (silicone grease), check page 57, Figure 9 for TO -220 case style. ECE 442

  9. Use Thermalcote RCS = 1 C/W No Insulator ECE 442

  10. ECE 442

  11. Thermalloy P/N 6030 Temperature rise above ambient@ 5 Watts Power Dissipation = 66 C ECE 442

  12. Thermal Resistance RSA As long as RSA is less than 16 C/W, the requirement is met. ECE 442

  13. Thermalloy P/N 6030 ECE 442

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