1. Thermal Resistance of Heat Sink Interface Material Testing Device (TIM Tester) Progress Report 3/8/2004

2. Re-Introduction • Thermal interface materials (TIMs) fill gaps between electronic devices and heat sinks. • TIMs are now being designed with very small thermal resistances. • Current standard does not test modern TIMs with high certainty [1],[2].

3. Re-Introduction • Team will design and build the structure, plumbing, and force application systems. • Dr. Recktenwald and John Farley will design thermal data acquisition and data reduction systems.

4. Product Design Specifications • Supports the Transient Method • Test Several Types of TIMs • Variable Pressure • Removable Pucks • High Repeatability

5. Final Design Progress • Overall concept has been established • Analysis of components and Assemblies has begun

6. Plumbing System • Heater and Chiller with circulating loops

7. Plumbing System Progress • Heater and Chiller are being researched • Several possible valves have been identified • Cross-Linked Polyethylene hose for the pipes • Closed loop system including puck with cavity

8. Aluminum Pucks Teflon Guide Rails Load Cell Force Actuator

9. Alignment • Rotational • Center on Center • Parallelism

10. Aluminum Pucks Wet Puck Dry Puck

11. Force Actuator • Requirements • Up to 250 lbs • 12-24 Volts DC • 4-8 inches of stroke • Low backlash • Not self-locking • Ball Screw Driven

12. Force Actuator [3] http://www.duffnorton.com/emact.htm

13. Load Cell • Requirements • 250 lbs • Fits within puck guide rails • As short as possible (column stability) • Compression Only

14. Candidate Load Cell • Button type (load button) • Compressive only • 250 lb capacity • Dimensions • Diameter = 1.25 inches • Height = 0.4 inches • Easily mounted [4] www.TransducerTechniques.com

15. Aluminum Pucks Teflon Guide Rails Load Cell Force Actuator

16. References • [1] Kearns, Don, “Improving Accuracy and Flexibility of ASTM D 5470 for High Performance Thermal Interface Materials,” 19th IEEE SEMI-THERM Symposium, pg 129-33, 2003. • [2] Lasance, Clemens J.M., Electronics Cooling, vol. 9, no. 4, 2003. • [3] http://www.duffnorton.com/emact.htm, 3/8/2004. • [4]http://www.transducertechniques.com/LBC-Load-Cell.cfm, 3/8/2004.