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CIRTEK ELECTRONICS CORPORATION Company Presentation

CIRTEK ELECTRONICS CORPORATION Company Presentation. Outline. Company overview and organization. Services and CEC BOM. Product Portfolio and Special Capabilities. Company strengths. Plans and programs. Package Technology Roadmap. Final Test, Finishing and FAREL. Outline.

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CIRTEK ELECTRONICS CORPORATION Company Presentation

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  1. CIRTEK ELECTRONICS CORPORATION Company Presentation

  2. Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation

  3. Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation

  4. Cirtek Electronics Corporation

  5. Company overview Company Structure Cirtek Holdings Philippines Corporation Cirtek Electronics Corporation (“CEC”) Primary purpose is to engage as an independent subcontractor for semiconductor assembly, test and packaging services Cirtek Electronics International Corporation (“CEIC”) A BVI company which provides marketing, logistical and administrative support, including collection to CEC. Cirtek Electronics Corporation

  6. Company overview CIRTEK TODAY History 25 years experience outsourced assembly & testing solution provider • Established in 1984 as independent Subcontract Assembly & Test Provider • Accredited by International Quality institutions • CIRTEK has grown to provide world class turnkey solutions that include services from packagedesign development, wafer probe, wafer • back grinding, assembly packaging and final testing of semiconductor devices up to drop shipments to Customer's end users. • Competitive pricing and easily adaptable to customers needs High quality products, while providing production flexibility Competitive pricing and adaptable to customers’ needs. Profitable despite several economic downturns, debt free company Growing client base composed of companies located around the world Cirtek Electronics Corporation

  7. Company overview Cirtek assembles and tests semiconductor devices at its manufacturing complex located on a 20,000 square meter property in Biñan, Laguna. Its manufacturing facility is composed of two buildings, with a total floor area of 14,100 square meters. 1800SQM of clean room environment @ Class 10K. We offer general line and captive line assembly models A Philippine Economic Zone Authority (PEZA) registered company as an ecozone export enterprise at the Laguna Technopark for the manufacture of standard integrated circuits, discrete, hybrid and potential new packages. Cirtek Electronics Corporation

  8. Company overview Business Strategies 1 To develop partnership with its existing and potential customers to provide world class quality solutionsthrough management expertisefocused on specific applications to meet customers specification, high reliability and multi chips products. • Partnership with Customer to grow business together 2 • Captive Line Development To offer dedicated or captive line models for assembly and test services in order to efficiently produce the customer’s mature and stable products through shared investment 3 • Technology Development To continuously focus on Innovations and re-Engineering in its production and assembly techniques and capabilities, and to co-develop new technologies with customers 4 • Mergers and Acquisitions To actively seek strategic investments opportunities such as, alliances, joint ventures, and/or acquisitions that will be consistent with the Company’s overall business strategies Cirtek Electronics Corporation

  9. QA DIRECTOR Luz Veril QA / FAREL SECTION MANAGER Zeny Puedan QC/QA SEC.MANAGER Jacqueline Blancaflor MULTICHIPS BUS. MANAGER MeAnn Canoza IC BUS. MANAGER Miles Besana DISCRETE BUS. MANAGER Medy Chua QFN /DFN BUS. MANAGER Wilson Padre NEW PRODUCT BUS. MANAGER Rosendo Cerezo HERMETICS BUS. MANAGER Laarni Arnesto Organizational Structure PRESIDENT & CEO Jerry Liu CFO Tony Buyawe EXECUTIVE VP/ GENMANAGER Jorge Aguilar VP- Global Business Development Norman Chang HUMAN RESOURCE DIRECTOR Milet Cruzada ACCOUNTING MANAGER Susan Lumba SENIOR DIRECTOR SALES & MKTG-CS Antonio Callueng FINAL TEST MANAGER Walter Alegarme VP FOR ENG’G & PURCH, IND’L MGMT, Raul Santiano DEVELOPMENT ENG’G. Raymond Tecson FINAL TEST SUPERVISOR Manny Olandria CUST SERVICE TEAM SUSTAINING ENG’G Chona Morales PROBE TEST SUPERVISOR Roderich Ignacio MULTI DIE TEST SUPERVISOR Rey Reyes Cirtek Electronics Corporation

  10. Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation

  11. Cirtek Services Sort + Assy + Test + Drop shipment • Wafer backgrinding (8” maximum diameter / 4 mils thick capability) • Wafer mapping (8” maximum diameter / ASCII format) • Wafer probing (6” & 8” wafer diameter) • Die sales inspection (Commercial / Military / Medical level of inspection) • Full assembly (Refer to package portfolio) • Marking (ink / laser) • Final test (Refer to test capabilities) • Tape and reel (SOT, 150 / 300 mil SOIC, QFN / DFN) • Tape and Ammo (TO-92 straight / spread leads) • Drop shipment (To any point as required) • Ship to Stock Serve as your HUB/Distribution center Cirtek Electronics Corporation

  12. Molding Compound Plating –SnPB (85/15) Build of Materials Cirtek Standard Materials Gold Wire ( Mils) DA Epoxy Leadframe • 84-1LMI/SR4 • 8900- NC • 8600 - • 2600AT - HT • QMI 529HLV • CRM 1076NS • Eutectic DA • Solder paste • Sn5Pb95 • Sn10Pb90 • Stamped LF • Copper A194 • PPF -NiPdAu • Etched LF • Plating – Spot Ag • Configuration: • Matrix • HDLF • Single/Dual 0.80, 0.90, 1.0 mils • Sumitomo – G600, G770 1.2, 1.3, 1.5, 2.0 mils • Hitachi 9220HF10 Copper Wire ( Mils) • NittoG300LC 1.0 , 1.65, 2.0 • Sumitomo 6710/6600 Aluminum Wire ( Mils) • Cookson3200LS 1.25, 5.0, 10 • Toshiba KE955WY-white Copper Clip Attach Plating – 100% Tin Cirtek Electronics Corporation

  13. Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation

  14. Product Portfolio • 0.50 x 0.25 x 0.30 / 02L • 1.00 x 0.60 x 0.46 / 02L • 1.10 x 1.60 x 0.46/ 02L • 1.27 x 0.76 x 0.76/ 02L • 2.20 X 1.78 x 0.76/ 02L • 2.50 X 1.70 x 0.76/ 03L • Customer Specific • 6.00 X 6.00 x 0.90/ 02L QFN/DFN Packages DFN Body Size QFN Body Size Small Body Size • 2.00 x 2.00 / 08L • 3.00 x 3.00 / 08L • 3.00 x 3.00 / 16L • 3.50 x 3.50 / 20L • 4.00 x 4.00 / 24L • 5.00 x 5.00 / 28L • 7.00 x 7.00 / 32L • 8.00 x 8.00 / 52L • 2.90 x 1.80 / 04L • 1.70 x 1.35 / 08L • 2.00 x 2.00 / 08L • 2.50 x 1.35 / 12L • 3.00 x 1.35 / 12L • 3.30 x 1.35 / 16L • 3.00 x 3.00 / 10L • 4.00 x 1.60 / 16L Cirtek Holdings Philippines Corporation

  15. Product Portfolio SOIC Packages TSOC 6L– 150 x 150 x 55 mils 150 Mils Body Packages 300 Mils Body Packages 18L 08L- Stand 20L 16L Standard – Clip Attach 14L - Stand 24/28L 16L - Stand Exposed Pad Version 08L- 150 Mils 16L – 300 Mils 16L – QSOP Cirtek Electronics Corporation

  16. Product Portfolio Plastic Dual In Line Package Single In Package 300 Mils Body Package 600 Mils Body Package 08L 8L, 9L 18L 20L 14L 24/28L 16L Cirtek Electronics Corporation

  17. Product Portfolio SOT Packages SOT 23 Packages SOT Packages TO 92 Packages 03L TO 92 -Stand SOT223 05L SOT 143 06L TO 92 - Flat SOT89 Cirtek Electronics Corporation

  18. SMT/COB Assy • Materials • Customer Specific • Consignment • Flexible Arrangement Product Portfolio Hermetic Packages Metal Can ( TO 3- TO 5) T-Hole Oscillator Hybrid Assembly Build of Materials Small Metal Cans Cirtek Electronics Corporation

  19. Other Special Assembly Capabilities Multichip on Standard Package Standard silicon die attach cylindrical crystal through resistance welding LF design by Cirtek 300 mil (SOIC) Pack. Multi die on standard 150 mil 2 die up to 32 die, Custom LF design by Cirtek (SOIC) package Cylindrical Crystal Control IC Copper Clip attach on SOIC/QFN ESD and Power Devices Die to Die Bonding • Multi die embedded ceramic crystal Mounted die in PCB • NC and conductive epoxy • Transfer over mold process • 300 mil (SOIC) package Copper clip Cirtek Electronics Corporation

  20. Hermetic Module Assembly Metal lid Non-hermetically sealed using conductive epoxy PCB Passive component attached with solder GaAs dice attached with conductive epoxy Gold wire Cirtek Electronics Corporation

  21. Prescaler-Static divider Module Assembly LEGEND: CHIP CAPACITOR CHIP RESISTOR 1 2 3 1 1 1 1 1 2 3 PRESCALER DIE Cirtek Electronics Corporation

  22. Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation

  23. Company strengths Certified to the latest quality standards 1 Solid management team and expertise 2 Ability to adapt to customers’ needs 3 Full turnkey solutions 4 Growing customer base of diverse clients 5 Strong brand name and proven track record 6 A PEZA-registered entity 7 Cirtek Electronics Corporation

  24. Company strengths World Class Quality standards 1   Cirtek’s manufacturing practices are designed to be compliant with industry requirements and to exceed customer’s expectation. Manufacturing applies latest quality system standards, which include ISO 9001, ISO 14001, QS-9000/TS-16949, BABT and DSCC, as well as certified facility by UL Cirtek Electronics Corporation

  25. Quality Management System map Internal Quality Auditing – MOP Customer Service - COP Management Review 10 Billing QA /IQA Inspection Warehousing Purchasing Customers Satisfaction Customers Requirements 9 Production Planning Control FA-REL Sales and Marketing Process Control Inst / Doc’n Final Test Process Design and Dev’t Assembly Mfg Delivery 1 2 3 4 6 7 8 5 Process Engineering Maintenance Calibration Support Process Training Facilities HR MIS EMS Main Process NOTE: Support process that has no arrows meaning it will support the whole organization. COP MOP Product Realization Cirtek Electronics Corporation

  26. Continual Improvement Process Cirtek Quality Management System C U S T O M E R S R E Q U I R E M E N T S C U S T O M E R S S A T I S F A C T I O N Information Input Output Cirtek Electronics Corporation

  27. QUALITY MILESTONE IN SYSTEM AUDITS PERFORMED BY CUSTOMERS AND INDEPENDENT AUDITORS ACCREDITTED AS QUALIFIED SUPPLIER BY OEM’s CUSTOMER/END USER SPONSOR YEAR QUALIFIED APPLICATION HUAWEI – CHINA PANASONIC MOBILE COMM–JAPAN CANON INC - JAPAN GE HEALTH CARE MICRONAS AUTOMOTIVE PANASONIC ELECTRONIC-JAPAN HUAWEI – CHINA IBM-JAPAN INTERNATIONAL RECTIFIER ST MICROLECTRONICS CMD EMERSON (ASTEC) MEDTRONICS GENNUM 2009 2009 2008 2007 2007 2006 2006 2006 2006 2006 2006 2005 2003 2002 SEMTECH INC ANALOG DEVICES INC SEMTECH INC SUNPOWER MICRONAS SEMTECH INC DALLAS-MAXIM DALLAS-MAXIM IR DIVISION ST MICRO CMD SILICON LINK MICROSEMI GENNUM-CANADA POWER SUPPLY - CE REPEATER/BASE STATION ELECTRONIC DEVICES CT SCANNER HAL SENSOR FLAT SCREEN TV ENTERPRISE/OFFICES DATA NETWORKING POWER SUPPLY / CHARGERS MOBILE APPLICATION MOBILE APPLICATION POWER SUPPLY - CE MEDICAL IMPLANTABLE HEARING AID Outstanding Quality System Cirtek Electronics Corporation

  28. Company strengths Solid Management Team and Expertise 2     Management team is composed of highly experiencedindividuals from various semiconductor and OSAT companies. The Cirtek Team has over 150 years of combined management andengineering package design expertise specific to semiconductor industry. Lean organizationand prudent decision making. Focused and goal oriented. Cirtek Electronics Corporation

  29. Company strengths Ability to adapt to customer’s needs 3  Technical abilities which provide customers a full range of turnkey solutions  Customer satisfaction as evidenced by the awards received from several customers • Customer requirements • World class quality standards • Excellence in manufacturing • Clean room (Class 10K) facility and practice 5S (Japanese) Discipline • On-time Delivery • Competitive pricing • Flexibility / Responsiveness Cirtek Electronics Corporation

  30. Company strengths Full Turnkey Solution 4  Provide vertically integrated manufacturing solutionsto its customers. Package Design & Development Assembly & Packaging Test, Pack & drop ship to end Customers + + Higher productivity / efficiency Lower cost Faster time to market Cirtek Electronics Corporation

  31. Company strengths Growing customer base of diverse clients 5   A growing portfolio of customers. CHPI currently has 42 customers around the world The Company’s customers are located in various countries, with the bulk of revenues contributed by customers located in Europe and the USA % Contribution to revenues per region USA Europe Asia Cirtek Electronics Corporation

  32. Company strengths 25 Years Proven Track Record 6    Continuous production growth and generating employment. Financiallystrong. Delivering profit anddividend every year. Cirtek Electronics Corporation

  33. Company savings Company strengths A PEZA-registered entity 7  As a PEZA*-registered entity, the Company enjoys certain incentives like tax holidays, duty free importation of materials and reduced power rate vis-a-vis non-registered entities which enables it to price its products competitively. Tax incentives Ecozone power rate + Ability to price products competitively Entitlement to 5% gross income tax (GIT) incentive. Secure new 4 year income tax holiday (ITH) for new projects Reduction of 12.5% to 13.5% on power cost * The Philippine Economic Zone Authority (PEZA) is an attached agency to the Department of Trade and Industry tasked to promote investments, extend assistance, register, grant incentives to and facilitate the business operations of investors in export-oriented manufacturing and service facilities located inside selected areas throughout the country Cirtek Electronics Corporation

  34. Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation

  35. Plans and Programs Expansion of Manufacturing facility and Capacity Innovation and Re-Engineering Completion of current projects and programs with customers 1 2 3 This will enable us to support 400 Million units of additional new business from existing and potential customers. Sustaining cost reduction program, higher quality product and stable process through automation and re-engineering. To develop new packages through innovation to maximize yield and satisfy or exceed customer expectation. Concluding and enabling Cirtek to realize new potential business in the pipe line worth US$11.8 Million by 2012 and to expand product portfolio. • New Potential business: • Power MOSFET QFN • Open cavity moisture / pressure sensor for automotive • Opto Couplers • Exposed Cavity Power Amplifier – HSOP • Current protection devices Cirtek Electronics Corporation

  36. Outline Company overview and organization Product offerings, Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation

  37. Package and Technology Roadmap • Package Development Roadmap • PCB / LGA / SIP • FLAT TO92 • SMT-COB • FLIP CHIP ASSY • STD TO92 • 0.5X0.25X0.30 DFN PACKAGE • HYBRID ASSY • AIR CAVITY QFN / DFN • CERAMIC ASSY • SMT • COL / CLEAR PACKAGE DFN • POWER QFN USING CU CLIP • 1.0X0.5X0.48 DFN PACKAGE • WLCSP • 1.2X0.76X0.76 DFN PACKAGE • JEDEC STD QFN / DFN • METAL CAN • LED ASSY • SOT223 • SOD323 • SOT23 • TSOC • SOT89 • SOT23 • SOT143 • TO272 • MSOP • OPEN CAVITY SENSOR • 16 QSOP • SOIC W/ CRYSTAL • SOIC NB • SOIC WB • PDIP • SOIC EPAD • HSOP / DSO 2005 2007 2009 2011 2013 2014 Cirtek Electronics Corporation

  38. AuSn Eutectic die attach Package and Technology Roadmap • Cost Reduction / Development Roadmap • Technology • AuAgwirebond (20% lower than Au) • Copper wirebond (90% lower than Au) • Ribbon bonding • BSOB bonding • Stacked Die attach • Soft solder / Eutectic Die attach • Die attach film • Low loop profile • ( 3% lower Au cost) • Auto Clip attach • Material • Korean Cu wire supplier (21% lower cost) • Chinese leadframe supplier (20% lower cost) • Brass / steel leadframe (10% lower than Cu) • High Density Leadframe • (12% productivity improvement) • Ultra High Density Leadframe • ( High Volume) • Matrix Leadframe • MGP / automold conversion (14% lower cost) • Mold compound selection GE300LC2 (21.8% lower cost) • Ag plating thickness reduction (5% lower cost) 2005 2007 2009 2011 2012 2013 Cirtek Electronics Corporation

  39. Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation

  40. Wafer Probe and Final Test Cirtek Electronics Corporation

  41. Final Test Summary • WAFER PROBE CAPABILITIES • Wafer Prober • EG1034 – 4” and 5” • EG2001 – 6” • EG2080 – 8” • Ink/Inkless less Process • ASCII format Cirtek Electronics Corporation

  42. Final Test Summary • TEST CAPABILITIES • Mixed signal device • CREDENCE ASL-1000, EAGLE ETS 500D, LTX • Discrete device • TESEC 881-TT, FROTHINGHAM CV3000B • Linear device • KEITHLEY, GENESIS • RF / IF device • HP RACK & STACK, HP84000 • Digital /Asic device • FAIRCHILD SENTRY, SIEMENS S725 • OPTO relay device • TESEC, HIPOT • Protection device • TESEC, KEITHLEY • MULTI BIN/POST TEST MARKING • SOT 89, 223 • TO92 Cirtek Electronics Corporation

  43. Final Test Summary • TEST / TAPE & REEL CAPABILITIES • Integrated test and TNR handlers • SRM S248 – SOT • SRM XD16 – SOT • SRM S12 – SOT • VECTOR T20 – SOT • QMT 1500 – SOT • SRM 248XS – TDFN • ASM FT2030 FLEXIPACK – SOIC • SRM 244XS – SOIC • ISMECA –NX16 – DFN ( 0402) • Test handlers (SOIC/PDIP) • MCT 3608/5100 • MT 8305/8588/8704 • AETRIUM 2020 DTS • TNR handlers (SOIC) • G6 Visdynamics • Systemation TO 485 with 3D vision • STI 8028 / ST 60 Cirtek Electronics Corporation

  44. FAREL CAPABILITIES Cirtek Electronics Corporation

  45. Failure Analysis Capability • Internal / external inspection • High / low power microscope • X-RAY • SOFTEX 100 • Decapsulation • DECAP AS2000 • Autoclave • NAPCO 8110-TD test chamber • Open / short test • TEXTRONICS curve tracer • 85% / 85oC moisture soak • ENVIRO SYSTEM chamber • Temperature cycle • ENVIRO SYSTEM chamber • Polisher / grinder (cross sectioning) • SBT–MODEL 900 Cirtek Electronics Corporation

  46. Reliability Test Capability • Die shear • MIL STD 883-2013 • Bond strength • MIL STD 883-2011 • Mark permanency test • MIL STD 883-2015 • 3 mins soaking time using IPA @ 30 strokes • Solderability test • MIL STD 883-2003-7 / JESD22-B102D • 8 hrs steam aging @ 100oC • Temperature cycle • MIL STD 883E-1010.7 /JESD22-104B • 10 cycles minimum @ 10 minutes / cycle • Low temp @ -65oC (+0, -10oC) • High temp @ 150oC (+15oC / -0oC) +150oC (+15,-0oC) • Stability bake • MIL STD 883-1008.2 • 6 hrs @ 175oC Cirtek Electronics Corporation

  47. Reliability Test Capability • High temp storage • JESD22-A103B • 500 hrs min @ 150oC • Auto clave • JEDEC 22A 102-C • 15 PSI for 96 hrs @ 121oC • Fine leak • MIL STD 750D 1071.6 / Test Condition D • 30 secs soaking time @ 125oC • Moisture soak • IPC / JEDEC J-STD-020C • 168 hrs soaking time @ 85% RH / 85oC temp Cirtek Electronics Corporation

  48. WHY CIRTEK as ASSSEMBLY & TEST SUBCONTRACT PARTNER? Cirtek Electronics Corporation

  49. Cirtek Electronics Corporation

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