370 likes | 485 Vues
This document outlines the procedure and applications of Thermogravimetric Analysis (TGA) for material characterization. TGA measures weight loss as samples are heated or cooled, using a platinum microbalancer and aluminum crucibles for sample preparation. The technique is used to evaluate thermal stability, identify decomposition products, and analyze absorption/desorption of gases. Key concepts, such as solvates and pseudopolymorphism, are introduced, along with an overview of Differential Scanning Calorimetry (DSC) for understanding thermal transitions in materials.
E N D
Thermogravimeteric Analyzer • Measures weight loss upon heating, cooling, or when held at a constant temperature. • The machine is basically a furnace with a microbalancer that is used to characterize materials with regard to their composition.
Procedure Cut out piece of polymer with hole punch and put in aluminum crucible. 2. Place in platinum microbalancer.
Procedure (Continued) 3. Set the computer for rate of heating (10⁰/min). 4. Set computer for type of gas (air for nylon 6,6 and nitrogen for PETE and PP)
Thermal events and processes that can be determined by TGA • Absorption/desorption of gases/moisture. • Thermal stability. • Identification of decomposition products, solvents, solvates. • Pseudopolymorphism. • VOCABULARY • Solvate- an aggregate that consists of a solute ion or molecule with one or more solvent molecules. • Pseudopolymorphism-different crystal types are the result of hydration or solvation.
TGA degradation for two different HDPE bottles due to filler material.
Decomposition kinetics- changes in maximum temperature of decomposition due to changes in heating rate.
DSC - Differential Scanning Calorimeter measures temperatures and heat flows associated with thermal transitions in a material Glass Transition Temperature - Tg the temperature at which a solid, such as glass or a polymer, becomes brittle (crystalline) on cooling, or soft (amorphous) on heating
Cooling Heating
Cooling Heating
Glass Blowing with Ron Kemp
Acknowledgments Anthony Condo Ivan Keresztes Ron Kemp NevjinderSinghota Kevin Dilley Jane Earle Cornell Center for Materials Research National Science Foundation