Download
mems sensors for harsh environment n.
Skip this Video
Loading SlideShow in 5 Seconds..
Mems Sensors For Harsh Environment PowerPoint Presentation
Download Presentation
Mems Sensors For Harsh Environment

Mems Sensors For Harsh Environment

183 Vues Download Presentation
Télécharger la présentation

Mems Sensors For Harsh Environment

- - - - - - - - - - - - - - - - - - - - - - - - - - - E N D - - - - - - - - - - - - - - - - - - - - - - - - - - -
Presentation Transcript

  1. Mems Sensors For Harsh Environment ARUN K M 10MBE0003

  2. Radiation sources in our Environment • Watch and clock faces (radium dial) • Gas lamp mantles(thorium oxide) • Pink glass and jewelry polishing compound • Smoke detectors • Nuclear power reactor losses(JAPAN!!!) • Airplane flights • Radon gas • Gemstones

  3. Ambient Conditions • High temperature • High amount of Vibrations • High pressure

  4. High Temperature Sensors • Normal Si sensors fails at >180°C • Cooling required-more weight • SiC and Group 3 nitrides-smart mems sensor • SiC-Challenges in micromachining • G3 nitrides-piezoelectric functional elements(upto 1500ºC) • MOEMS-better remote sensing application

  5. Sic- Properties • Outstanding material and electronic properties and chemical inertness • hardness of 2480 kg/mm2 • Young’s Modulus of 700 Gpa • SiC has a larger bandgap (2.3-3.4 eV)a higher thermal conductivity (3.2-4.9 W/cm K) • high saturation velocity (cm/s)

  6. Types • Piezoresistive • Capacitive -based sensors • Pressure , force and acceleration • HT applications

  7. MOEMS sensors • Measure pressure,temperature,stress,displacement • Can easily incorporated in sensor arrays • Can be used for gas and liquid measurements • Highly resistant to electromagnetic interference (EMI) and radio frequency interference (RFI) • Eliminate the necessity of onboard electronics

  8. Types • Fibre Optic Sensor • MoemsFabrey Perot Sensor

  9. Fibre Optic Sensors • Robust, highly resistant to EMI and RFI • Detect displacements on a sub-nanometer scale • The fabrication is complicated and expensive. • Misalignments between the sensor and the fiber

  10. MFPD • Do not require alignment and stabilization techniques • a cantilever beam fabricated in low-stress LPCVD silicon nitride forms top mirror of interferometer • silicon substrate below provides the bottom mirror • substrate vibrates, there is a relative deflection of the beam with espectto the substrate and hence a change in the microcavity height. • the amplitude of the substrate motion can be calculated

  11. Polymer Sensor • Design, Fabrication and Optimization of Thermal Radiation Detectors Based on Thin Polymer Membranes , ClaesMattsson2009 • a new application of SU-8 as a closed membrane in a thermal sensor. • Calibrated with bolometer

  12. Reference • New Trends on MEMS Sensor Technology for Harsh Environment Applications Patricia M. Nieva • Design, Fabrication and Optimization of Thermal Radiation Detectors Based on Thin Polymer Membranes , ClaesMattsson 2009