Materials of Engineering

1. Engineering 45 Materials of Engineering Lecture 1 - Introduction to MS&E - Carlos Casillas, PE 19-Jan-12 Licensed Chemical Engineer Spring 2012 CCasillas@ChabotCollege.eduHayward, CA

2. Engr 45 - Materials of Engineering Lecture Notes • Course No: Engineering 45 • Instructor: Mr. Casillas • Email: ccasillas@chabotcollege.edu • Lecture No: 1 • Lecture Title: Chp1: Introduction to MS&E • Date: 19-Jan-12

3. Engineering 45Materials of Engineering - Outline - • R1: Background • Roll Call • Course Syllabus • Goals • Labs, Field Trips • VSME • R2: Course Overview – Materials Science & Engineering • Next Week: Chp 2: Atomic Structure & Bonding • C&R Chp 3: Structure of Crystalline Solids

4. Instructor’s Background

5. Instructor’s Background, con’t (Engr-45 day-1 roll-call/class distribution)

6. Welcome to the Wide World of MS&E! • ALL of Engineering is impacted by Materials!

7. Instructor’s Background, con’t • Some items for show and tell (later on): • Nanostructured Materials • Au Nanoparticles, Si Nanowires (Gecko effect) • II-VI Nanocrystals (Fluorescent), Flat-Panel LCDs • Flash-Memory (Nano), Nano-Transistor • Nano-Aerogels (JPL/NASA) • Semiconductor Thin Film – Si, III-V • Magnetic Data Storage, Thin-Film R/W Head, HDD • Advanced Thermal Insulators & Conductors • Cu Heat Pins – PECVD Al Showerhead • Specialty Ceramics, Ferromagnetic Fluids • Polymer MembranesGas Separation • Spiral-wound, hollow-fiber modules • Smart Materials – Shape Memory NiTinol Wire

8. Engr 45 Course Logistics- Syllabus Review • Text: • “Materials Science and Engineering –An Introduction” 8th Edition, William D. Callister and David G. Rethwisch, John Wiley & Sons (2010) • 3.0 Units: • 2-hr Lec (Th 1-2:50pm), Rm 3902 • 3-hr Lab/Field Trip (M 4:30-7:20pm), Rm 1612 • Lab teams 2-3 students, switch teams every two labs, switch roles every lab • PreReq’s: • Chemistry 1A • Physics 4A • Engineering 25

9. Engr 45 Course Syllabus Review, con’t • Lecture notes, homework solutions, etc will be sent by email and posted at the Chabot Engineering webpage: http://www.chabotcollege.edu/faculty/bmayer/ • Communication will be mainly by e-mail, through the CLPCCD GroupWise/Novell Web Access e-mail system. • Office hours will preferably be right after lecture or lab. Other times can also be arranged if needed.

10. Syllabus Review, con’t • Grading - Weight Function & Policy * * Instructor reserves prerogative to adjust based solely on his professional judgment of class performance • Exams: During class, dates shown in schedule in Syllabus • Open-text & single, hand-written SRS allowed, TB turned in • Academic honesty is expected (assigned seating)

11. Engr-45 Lecture Tentative Schedule • HW Assignments are due at the beginning of class on due date in Syllabus • Lowest-score two HWs will be thrown out. All problems will be graded.

12. Engr-45 Labs & Field Trips Tentative Schedule • Sixth Lab Report and Sixth Field Trip Report are both extra-credit • Attendance to all Labs and Field Trips is mandatory

13. Engr-45 Course Goals • Understand the fundamental concept of Materials Science & Engineering: • “There is a direct relationship between a material’s synthesis & processing (post-manufacture), and its internal microstructure and observable physical properties and engineering performance” • Materials are ENGINEERED Structures • NOT Black Boxes

14. Investigating the Structures & Properties of Materials and Correlating these with the Design or Engineering or Technology Objectives • Class Q: Materials Engineering & Technology → What is it? • Basic Material Structure Has Many Dimensions

15. Classes of Materials From Chem1A Recall The Periodic Table of Elements Polymers Ceramics SemiConductors Metals

16. Metals May be Pure or Compounds (Alloys) Along with Polymers The Most Common Everyday Material Typically from the 1st Row of Transition Metals in Periodic Table (Fe, Cu, Ni, etc.) Have LARGE Numbers of NonBound Electrons Makes them Good Electrical & Thermal CONDUCTORS Strong but Deformable (Ductile)

17. Ceramics cont. Some Typical Properties HARD & BRITTLE HIGHEST Temperature Resistance Thoria (Thorium Oxide) Max Temp  3000 K Llttle Temperature-SHOCK Resistance Corrosion Resistant Electrically Resistive (Insulative) Difficult to Join Do Not Weld

18. Ceramics cont. Some Typical Properties HARD & BRITTLE HIGHEST Temperature Resistance Thoria (Thorium Oxide) Max Temp  3000 K Llttle Temperature-SHOCK Resistance Corrosion Resistant Electrically Resistive (Insulative) Difficult to Join Do Not Weld

19. Polymers cont. Some Typical Properties Very LightWeight Very Corrosion Resistant Best of ANY Class of Material Little, if any, Hi/Lo Temperature Resistance Little Structural Strength Very Deformable (ductile/flexible) Lowest $-Cost:Volume Ratio for Any Class of Material

20. SemiConductors May be made CONDUCTIVE or INSULATIVE (or Something in-between) by the Addition of Miniscule Amounts of IMPURITIES Current Techniques Allow Precise Control over the AMOUNT and LOCATION of the Impurities Semiconductors are Very Important Electronic Device Materials

21. Semiconductors cont. Most SOLID STATE (no moving parts) Electronic Devices are Semiconductors Major applications for Semi Transistors Voltage Amplifiers On/Off switches Additional Advantage: Semiconductor Electronic Devices can be constructed at Extremely SMALL Scales SILICON is the Most Widely Used

22. Composites • Materials that Consist of More than One Material Type • Goal is to Combine the Best Features of Multiple Materials • Some Examples • FiberGlass = Glass (ceramic) + Polymer • Strength + Flexibilty • ReInforced Concrete = Steel + Concrete • Tension-Strength + Compression-Strength

23. BioMaterials Defined as Those Materials Which Are compatible with Human Tissue Classic Example = Stainless Steels used For Bone repair (Screws, Staples, Plates, Hip-Joints) At least a few of ALL other Classes of Materials are BioCompatible Including Silicon

24. Smart Materials Smart Materials  Materials That Can Sense Changes in the Environment and Respond with a Material Shape/Property Change Example: "smart" materials that can be attached to, or embedded in, structural systems enable the structure to sense disturbances, process the information and through commands to actuators, to accomplish some beneficial reaction

25. Ceramics Basic Composition is the MINERAL Form of a Metal Very Few Metals Exist in PURE Form in Nature Most That Do are Very Rare, e.g., Gold Ceramics are Compounds of Metals and Oxygen → Oxides (most Ceramics) Carbon → Carbides Nitrogen → Nitrides

26. Ductile materials Elastic limit, Stress  Young’s modulus, E Strain Strain Thermal strain  Brittle materials Expansion coefficient,  Tensile (fracture) strength,  Temperature, T Stress   To T1 Young’s modulus, E Q joules/sec Area A Heat flux, Q/A Thermal conductivity,  (T1 -T0)/x Basic Material Properties Mechanical properties Thermal expansion General Weight: Density , kg/m3 Expense: Cost/kg Cm, $/kg Mechanical Stiffness: Young’s modulus E, GPa Strength: Elastic limit y , MPa Fracture strength: Tensile strength ts , MPa Brittleness: Fracture toughness KIc , MPa·m1/2 Thermal Expansion: Expansion coeff. , 1/K Conduction: Thermal conductivity , W/m·K Specific Heat (Capacity), cp or cv, J/kg·K Electrical Conductor? Insulator? Conductivity σ, S/m Dielectric Capacity, F/m Thermal conduction x

27. Material Properties Property Stimulus Result Terms • Material performance depends on material properties

28. Material Properties • Density (g/cm3)

29. Mechanical Properties, con’t • Tensile Strength (MPa)

30. Mechanical Properties, con’t • Stiffness or Elastic Modulus E (GPa)

31. Mechanical Properties, con’t • Fracture Toughness [MPa*(m)E0.5]

32. Electrical Properties • Conductivity (1/Ohm-m)

33. Electrical Properties • Increase resistivity of Cu • by adding impurities • by mechanical deformation

34. Hardness (BHN) Processing  Structure  Properties (con’t) • PROPERTIES depend on STRUCTURE • e.g.; The HARDNESS vs STRUCTURE of Steel UNtemperedMartensite G10380 +w/ Pearlite Ferrite +Cementite PROCESSING can change STRUCTURE • e.g., STRUCTURE vs Cooling-Rate for Steel TemperedMartensite

35. Processing  Structure  Properties • Recrystallization Strength versus Structure of Brass and changes in microstructure

36. low from ceramic oxide (structure and conduction properties) • changes due to alloying in metals (even though same structure) • Thermal Properties

37. Processing  Structure  Properties (con’t) • Optical Properties

38. Effect of Temperature

39. Course Goals, con’t • Materials are ENGINEERED Structures • NOT Black Boxes