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Developing an In-Situ Inspection Technique for Superconducting Wire

Developing an In-Situ Inspection Technique for Superconducting Wire. Phase 1: Design of a Stud Pull Testing Device. By Cory Spicer Advised by Professor Bucinell. Modern Power Transmission: Trouble Ahead. Aging equipment and increasing populations are stretching power grids to their limits.

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Developing an In-Situ Inspection Technique for Superconducting Wire

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  1. Developing an In-Situ Inspection Technique for Superconducting Wire Phase 1: Design of a Stud Pull Testing Device By Cory Spicer Advised by Professor Bucinell

  2. Modern Power Transmission:Trouble Ahead • Aging equipment and increasing populations are stretching power grids to their limits. • More disasters like the 2003 blackout will occur unless something is changed. http://www.beggingtodiffer.com/archives/blackout%202003.jpg

  3. A Possible Solution:Superconductivity • Provides no resistance to electrical flow. • Allows for transmission of power with virtually no loss and much less cable material. Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

  4. Background:Summer Internship at Superpower, Inc • Mainly tested critical current of HTS samples. • Also tested thickness, mechanical properties.

  5. Senior Project:Testing Lamination Strength • Performance of HTS device depends highly on quality of adhesion between layers on tape. • A method of testing the strength of the lamination is needed. • The aim of this project is to work with Superpower and NIST to develop a testing apparatus.

  6. Stud Pull Testing Device • This instrument is fixed to the top of the tape, and the strength required to delaminate the layers is considered. Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

  7. Stud Pull Testing Device • Lamination failure Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

  8. 8 samples Preliminary Data • Early testing gives an estimate for internal strength. • Much more testing needs to be performed to yield statistically accurate results. Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

  9. Stud Pull Tester:Important Features • Device is bi-axially gimbaled, so force is directed straight up. • Capable of testing internal strength and slit edge strength. Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

  10. Stud Pull Tester:Current Problems • Samples must be cooled in a stress-free manner, which is difficult. • Epoxy is needed to attach tape to stud puller, which creates a thermal stress boundary layer. • There is no previous data to compare and/or verify results.

  11. This Term’s Activities • Met with associates from Superpower to select appropriate goals for this phase of the project. • Established communications with Jack Ekin at NIST. • Familiarized myself with the current status and use of the stud pull tester prototype. • Researched some epoxies, such as PEEK.

  12. Planned Activities • Work with Superpower, Inc. and NIST to improve functionality of device. • Select an appropriate epoxy for cryogenic testing. • Possibly investigate numerical modeling of delamination testing.

  13. Acknowledgements • Dr. Ronald Bucinell, Union College • Dr. Jody Reeves, IGC-Superpower, Inc • Dr. Jack Ekin, NIST Questions?

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