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Enhancing Manufacturing Efficiency and Cost-Effectiveness in Electronics Division

This document outlines strategies and practices implemented by the Electronics Division's Advisory Committee as of May 2006, aimed at enhancing manufacturing efficiency. It includes plans for in-house production, such as training staff for module assembly, minimizing storage problems, and improving design for manufacturability. Key initiatives involve ESD protections, inventory control via PeopleSoft software, and the use of cost-effective board vendors. The goal is to produce reliable and consistent electronics components, achieving high-quality standards with an eye towards long-term sustainability and cost savings.

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Enhancing Manufacturing Efficiency and Cost-Effectiveness in Electronics Division

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  1. Production & Maintenance Steven J. Durand May 2006 Advisory Committee May 2006

  2. Electronics DivisionManufacturing Goals Out-source board assemblies Build modules in-house as needed Ready the facility for manufacturing ESD protected facility Production success stories Advisory Committee May 2006

  3. Outsource Circuit Cards- Board Vendor Provides: • Fully assembled boards/cables • Some assemblies tested • Flying probe tests – NRAO test fixtures • ESD packaged and labeled • Scheduled deliveries • Hazardous chemical handling Advisory Committee May 2006

  4. In-house Module Assembly Preparation • Trained staff • Same team that built the prototypes • Complete assembly drawings • New soldering stations • Test equipment & computers in place Advisory Committee May 2006

  5. Planning for Small Production Runs • Goal is to produce 28 identical antennas • Small quantity builds, 5-10 at a time • In-house module assembly and test • VLBA cable and small parts assembly Advisory Committee May 2006

  6. Inventory Control • New and old warehouse managed by Skip Lagoyda, Business Manager • Control of high dollar items • PeopleSoft software re-order mechanisms Advisory Committee May 2006

  7. CDL / EVLA Coordination Advisory Committee May 2006

  8. Attributes of In-house Module Assembly • Minimize module storage problems • Tight engineering control • Improve the design • Fast turn-around time • Distributed parts inventory Advisory Committee May 2006

  9. ESD Preparation • 12 ESD stations including floor mats • ESD totes and parts bins • ESD shoes and wrist straps • Humidity controlled facility Advisory Committee May 2006

  10. Trained staff Some components only available in lead-free. Can be used with ‘leaded’ solder. May require higher soldering temperatures, 20 to 30 degrees higher (Fahrenheit). Solder & Flux Compatibility, and Quality Issues Advisory Committee May 2006

  11. Mother Board Approach • More robust design • Easy to assemble Advisory Committee May 2006

  12. MIB Quality • 1400 MIBs required for the project • 34 in each antenna - in every type of module • Turn-key solution • Large quantity buys lowered price per board • 100% flying probe – 100% electrical test • 99% yield (last run of 100 boards) Advisory Committee May 2006

  13. Design for Manufacturability • 300 pin transponder • Easy assembly • 10GHz circuits Changed vendor to save $400K without a design change Advisory Committee May 2006

  14. Conclusion • Ready to maintain production schedule • Looking for cost savings • Utilized every NRAO asset • Manufactured for a 20 year life Advisory Committee May 2006

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