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Thermal Analysis of Chip Design for Heat Dissipation Optimization

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  1. Outer Dimensions

  2. Weight of Components

  3. Heat Analysis – Hand Calculations • Conduction caused by air: • Section of chip 0.1” x 0.1” • A=6.45*10-6 m2 • Q= -KA (dT/dx) • QTotal=1.6W • QPart =1.6W/210 = 0.00762W • K= (about) 0.0257 Wm-1K-1 • dT/dx = Q/(-KA) • dT/dx = 0.00762/(0.0257*6.45*10-6) = 45969 degC/m =649 degF/in =64.9 degF/0.1in Air Chip

  4. Heat – Experimental Results Null hypothesis: Average temperature < 120 deg F 95% Confidence Alpha = 0.05 Mean=113.9 P-Value=1.00 Fail to reject null hypothesis

  5. Heat – Analytical Analysis Case thermal conductivity = 0.2 Wm-1K-1 Outside case temp set to 20 deg F Top of chip set to 130 deg F Bottom of chip insulated

  6. Schematic of Build (outer case)

  7. Schematic of Build (Battery)

  8. Schematic of Build (RFID)

  9. Schematic of Build (PCB)

  10. Schematic of Build (Keypad)

  11. Schematic of Build (Cover)

  12. Schematic of Build (Motor Case)

  13. P12015: Bill of Materials

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