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Updates on FACET Experimental Area Changes and Equipment Adjustments (October 2013)

Significant modifications have been made in the FACET experimental area as of October 3, 2013. The ion pump is now located in the IP1 area to maintain vacuum when valve 3160 is closed. The E-202 chamber has been removed to create space for the EOS chamber, which will support laser-e-beam timing. Additionally, an oven design is being implemented, and two BPMs have been installed in the IP Area. Unfortunately, the wirescanner has been lost, and only beryllium windows remain in the beamline. Further controls information will be provided.

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Updates on FACET Experimental Area Changes and Equipment Adjustments (October 2013)

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  1. FACET Exp Area Christine Clarke 3rd October 2013

  2. Notable changes: Ion pump now in IP1 area to maintain vacuum when valve 3160 is closed E-202 chamber removed – space now exists for EOS chamber for laser-e-beam timing Space/support made for long oven design due to be installed this run Lost wirescanner 4  2 BPMs installed in the IP Area (controls information to follow) No Stainless Steel 50um window – only windows in beamline are 75um and 50um beryllium https://portal.slac.stanford.edu/sites/ard_public/facet/Documents/FACETExperimentalAreaDevicesLocation.xlsx

  3. 7:30am 30th September… what lies at the end of the rainbow?

  4. IP1 table upstream end. No changes until after wirescanner. Be window moved upstream. E202 chamber removed. Space created for EOS chamber. BPM installed.

  5. Downstream end of IP1 table. Oven table mover is now extended by 1 m…

  6. … creating space for the new 140 cm lithium oven currently being built in UCLA. There is also a BPM installed in the bypass line.

  7. Elements after the oven moved slightly downstream and some nipples/spool pieces were removed.

  8. Unfortunately particularly cramped downstream and it was necessary to remove the fourth wirescanner from the IP Area. The stainless steel vacuum tight window was also removed and a valve installed to enable us to continue to vent this area and pump down again quickly.

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