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This document addresses bonding errors encountered on both sides of the Forward Inner Module due to swapped bonds. Corrections were made by swapping bonds at the chip to fan-in and back at the fan-in to detector for link 1. Unfortunately, errors were noticed too late for link 0, resulting in swapped channels. Both unbonded detector strips are present at one end of link 0. High voltage (HV) bonding via fan-in to the front side was established, with bond wire glued to the detector's back side. Measured current characteristics show consistency at 150V, with an unexplained high current above this voltage. The module's current state is slightly dirty due to prior opto-testing treatments.
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Bonding • Bonding errors on both sides - swapped bonds • Corrected for on link 1 by swapping bonds at chip to fan-in and swapping them back at fan-in to detector • Noticed too late for link 0 and every other channel swapped. Also both unbonded detector strips at one end on link 0 • HV bonded via fan-in to front side. Bond wire from fan-in glued to detector back side
Current characteristics • IV characteristic measured 20C • Consistent with data in database at 150V • High current above 150V, reason not know • Note: Module now slightly dirty due to treatment (e.g. opto tests at liverpool/oxford)