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CubeSat for Ions, Neutrals, Electrons and Magnetic Fields

CINEMA. CubeSat for Ions, Neutrals, Electrons and Magnetic Fields. PI Robert Lin, SSL Project Manager Thomas Immel , SSL Systems Engineer Chris Pasma , SSL Mechanical Engineer David Glaser, SSL STEIN Scientist Davin Larson, UCB MAGIC Scientist Tim Horbury , ICL.

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CubeSat for Ions, Neutrals, Electrons and Magnetic Fields

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  1. CINEMA CubeSat for Ions, Neutrals, Electronsand Magnetic Fields PI Robert Lin, SSL Project Manager Thomas Immel, SSL Systems Engineer Chris Pasma, SSL Mechanical Engineer David Glaser, SSL STEIN Scientist Davin Larson, UCB MAGIC Scientist Tim Horbury, ICL Imperial College London

  2. GENERAL NOTES 11 UCB students currently on CINEMA team, 3 visiting students from Puerto Rico Collaborating Institutions Imperial College London (ICL) Kyung Hee University, South Korea (KHU) Interamerican University of Puerto Rico (IAUPR) Puerto Rico Space Grant Consortium Saclay Magnetometer from Imperial College London ASIC for STEIN particle detector from Saclay, France Started a seminar class in ME department devoted to CINEMA Current Mass Budget: Currently 2.8 kg, harnessing mass TBD Launch Provider: NASA: Still backup on NPP launch, other alternatives possible

  3. SUBSYSTEMS • Electrical Power • Progress • Building Flight Panels • 1 Vibration test of a Solar Panel, RBSP spec (Atlas V 401) • Thermal Cycling of ETU panels • Testing of Battery/ EPS • Issues • Solar Panel interference with torque coils • Possible Cracked Solar Cell during Thermal Cycle • Recall of Clyde Space EPS • Next Steps • Finish Flight Panels • Determine action in response toClyde Space recall

  4. SUBSYSTEMS • Spacecraft Structure • Progress • ETU built, being used for harnessing, stack integration • Mockup of the Avionics Stack complete • Issues • None • Next Steps • Build flight model

  5. SUBSYSTEMS • STEIN (SupraThermal Electrons, Ions and Neutrals) Particle Detector • Progress • New 32 pixel detector chosen, still needs to be made • ASIC from Saclay, France • Parts ordered for HVPS breadboard • Layout for STEIN Boards in progress • Issues • Changes caused by the new hardware: FPGA code, size, etc. • Next Steps • Breadboard the HVPS • Build STEIN circuit boards

  6. SUBSYSTEMS • MAGIC (MAGnetometer from Imperial College) • Progress • Boom Mechanism Flight Parts in Fabrication • Single axis ETU complete, being sent from ICL • Triple axis ETU still in testing at ICL • Issues • First time with instrument, there will probably be somecompatibility issues • Next Steps • Integrate with flight software • Send readings to ACS

  7. SUBSYSTEMS • C & DH • Progress • Reviewing Commands sent from Ground Station • FSW 70-80% done • Actively working on MAG module, Commands • Issues • Too many Ground Station commands, need to be pareddown • Next Steps • Finish the definition of the command set • Finish last modules of flight software • Testing of Flight Software

  8. SUBSYSTEMS • Radio Communication • Progress • S-band science downlink patch antenna ETU made with circular polarization • UHF antenna and deployment mechanism ETUs in progress • NTIA Application to NSF • Issues • NTIA Application difficult for thescale of our Mission • Problems connecting Coaxial Cable to Whip Antenna • Next Steps • Finish NTIA Frequency Assignment • Purchase Radios/ Test with Antennas • Finish UHF Whip Antenna Design and build ETU

  9. SUBSYSTEMS • ACS • Progress • Torque Coils tested, adjusting current draw • Sun Sensors tested , refabricating of flight parts • Finishing simulation • Issues • Satellite Attitude: Varying settling times in simulation • Settling times can speed up • Next Steps • Integration of ACS and Flight Software • Fix settling time issue to maximize science • Fabricate and Assemble Flight Parts

  10. SUBSYSTEMS • Thermal Analysis • Progress • 2 Thermal Models: Analytical at SSL, FEA from KHU • Issues • Disagreement on minimum solar panel temperatures • Next Steps • Validation with 3rd model in Solidworks Simulation • Other Components • Instrument Interface Board is being assembled. • FPGA code fully simulated, waiting to run on the board. • Harnessing done in Solidworks, working with the mockup chassis

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