Bridging Theory in Practice

1. Bridging Theory in Practice Transferring Technical Knowledge to Practical Applications

2. Semiconductor Reliability

3. Semiconductor Reliability

4. Semiconductor Reliability Intended Audience: • Electrical engineers desiring a brief overview of the various semiconductor reliability tests Topics Covered: • What is semiconductor reliability? • What stress tests exist for semiconductors? • What are the stress tests actually testing for? Expected Time: • Approximately 30 minutes

5. Semiconductor Reliability • What Is Semiconductor Reliability? • Overview of Semiconductor Stress Tests

6. Semiconductor Reliability • What Is Semiconductor Reliability? • Overview of Semiconductor Stress Tests

7. What Is Reliability? From Merriam-Webster: reliability (noun) 1 : the quality or state of being reliable 2 : the extent to which an experiment, test or measuring procedure yields the same results on repeated trials reliable (adjective) 1 : suitable or fit to be relied on : dependable 2 : giving the same result on successive trials

8. A Reliable Dependable Semiconductor Device… “…is capable of passing the specified stress tests and thus can be expected to give a certain level of quality...”

9. What Is Needed to Specify a Reliable Semiconductor Device? An expected quality level Stress tests which provide a level of confidence to meeting the expected quality level

10. Semiconductor Reliability • What Is Semiconductor Reliability? • Overview of Semiconductor Stress Tests

11. Overview of Semiconductor Stress Tests Sources of Semiconductor Stress Tests Categories of Semiconductor Stress Tests Specific Stress Tests

12. JEDEC (Joint Electron Device Engineering Council) • EIAJ (Electronic Industries Association of Japan) • MIL-883-STD (Department of Defense) • Underwriters Laboratories • IPC (Formerly Institute of Interconnecting and Packaging Electronic Circuits) • AEC (Automotive Electronics Council) All of these are referenced by AEC-Q100 Sources of Semiconductor Stress Tests • JEDEC (Joint Electron Device Engineering Council) • EIAJ (Electronic Industries Association of Japan) • MIL-883-STD (Department of Defense) • Underwriters Laboratories • IPC (Formerly Institute of Interconnecting and Packaging Electronic Circuits) • AEC (Automotive Electronics Council)

13. Categories of SemiconductorQualification Tests (AEC-Q100) Accelerated Environment Stress Tests Accelerated Lifetime Simulation Tests Package Assembly Integrity Tests Electrical Verification Tests

14. Accelerated Environment Stress Tests Preconditioning (JESD22-A113) Represents typical industry multiple solder reflow operation Temperature Humidity Bias (JESD22-A101,A110) Evaluates penetration of moisture while device is biased Failures include metal corrosion Autoclave (JESD22-A102,A118) Evaluates penetration of moisture under high temperature and pressure Failures include metal corrosion and mobile contaminant collection Temperature Cycling (JESD22-A104) Evaluates ability to withstand stresses due to temperature changes Failures include die/package cracks, wire breaks, bond lifts Power Temperature Cycling (JA105) Very rigorous evaluation of temperature changes while device is biased Failures include die/package cracks, wire breaks, bond lifts High Temperature Storage (JA103) Evaluates effect of long term affects of temperature without bias applied Failures include oxidation of metal and inter-metallic shorts

15. Accelerated Lifetime Simulation Tests High Temperature Operating Life(JESD22-A108) Evaluates reliability over extended period of time Failures include dielectric breakdown, electromigration, ion contamination Early Life Failure Rate (AEC-Q100-008) Evaluates infant mortality rate Failures include dielectric breakdown, electromigration, ion contamination NVM Endurance and Data Retention (AEC-Q100-005) Evaluates memory ability to retain data and sustain data changes Failure due to data bit(s) retention

16. Package Assembly Integrity Tests Wire Bond Shear (AEC-Q100-001) Evaluates ability to withstand a horizontal push (shear) to the wire bond Wire Bond Pull (MIL-883-STD Method 2011) Evaluates ability to withstand a vertical pull to the wire bond Solderability (JESD22-B102) Evaluates ability of package to be soldered to another surface Physical Dimensions (JESD22-B100,B108) Evaluates ability to meet package drawing Solder Ball Shear (AEC-Q100-010) Evaluates ability to withstand a horizontal push (shear) to solder ball Lead Integrity (JESD22-B105) Evaluates ability of leads to withstand bending during assembly or rework

17. Electrical Verification Tests Electrostatic Discharge Human Body Model (AEC-Q100-002) Evaluates ability to withstand high voltage through a resistance Electrostatic Discharge Machine Model (AEC-Q100-003) Evaluates ability to withstand high voltage directly Latch-Up (AEC-Q100-004) Evaluates ability to withstand high current injection Electromagnetic Compatability Determines if electromagnetic radiations might be excessive

18. Semiconductor Reliability • What Is Semiconductor Reliability? • Overview of Semiconductor Stress Tests

19. References AEC Q-100 MIL-883-STD Semicon Far East (www.semiconfareast.com/rel.html) JEDEC (www.jedec.org)

20. Semiconductor Reliability Graphic

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