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T1 Electronic status

Electronics Cards: A node F ront E nd C ard C athode F ront E nd C ard R ead- O ut C ontrol card VFAT hybrids T 1 T rigger M ezzanine Other development: 16chs preamplifier. Cabling and Power Supplies: Platform to T1 cabling High Voltage Low Voltage Patch panels Conclusions.

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T1 Electronic status

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  1. Electronics Cards: Anode Front End Card Cathode Front End Card Read-Out Control card VFAT hybrids T1 Trigger Mezzanine Other development: 16chs preamplifier. Cabling and Power Supplies: Platform to T1 cabling High Voltage Low Voltage Patch panels Conclusions T1 Electronic status CERN Collab. Meeting 3 - 6 Dec. 2007

  2. Electronics Cards

  3. VFAT hybrid input ground isolation new feature. 5 pieces of 1P and 5G already produced. Waiting for the components loading. Mass production launched. PCBs ready within Dec. 2007. Decision on passive components networks within ½ Jan. 08 Components mounting within ½ Feb.08 End tests, validation and CSCs soldering March 08 AFEC

  4. Final layout routing in progress. Ten PCBs ready ½ Jan. 08 PCBs mounted within end Jan. 08 Decision on passive components networks within end Jan. 08 Mass production ready within ½ Feb.08 End tests and validation March 08. CFEC (1)

  5. Upgrade to high resolution. New layout Feb. 08 Few prototypes ready March 08. End tests and validation April 08. Mass production frozen. CFEC (2)

  6. Some delays due to CERN custom components procurement. Needed to avoid wrong components packages association. Several features implemented: DOHM and CCUM emulation. DOHM I2C lines handling (follow the CCUM-SCR redundancy scheme). Trigger VFAT Mezzanine GOHs mezzanines input pattern generator. Several Data GOH DAV sources available. Several Trigger GOHs DAV sources (BC0, Static, Timed by CCUM) Foreseen a SPY Mezzanine based on T1 Digital Mezzanine. The layout is done. 5 PCB ready Dec.07 3 Circuits mounted and (fully??) tested Jan.08 PCBs mass production Feb. 08 Full ROCs ready within March 08. ROC (1)

  7. ROC (2)

  8. ROC (3) I/O CCUM Has been tested ??? BC0b TR_GOH_DAV TRIGGER DAV MUX IDLEb/ON I/O CCUM I/O CCUM A CSC1 MUX DATA DAV K DATA_GOH_DAV K MUX A CSC2 MUX K

  9. The installation of 1 arm (30 CSCs) involve 200 VFAT hybrids. This number is equivalent to the full T1 anode VFATS hybrids production including spares. In this installation 60 will be dedicates for the anodes and 80 for the cathodes (CFEC VFAT only based). Hybrids production (PCBs and components mounting) at CERN. 200 VFAT hybrids production must end Feb. 08 (Ruy). Bonding may be made in Genoa. Needs agreement with the people in Genoa lab. Needs to know all the rules and material used by the CERN bonding lab. Needs some VFAT dummy chips in order to test all the procedures. Could be useful a training period at CERN of our bonding technician. Validation of the first hybrids in agreement with the CERN people (W.S.- P.A.). Hybrids bonding and test time schedule TTP dependent. VFAT hybrids

  10. T1 detector have 15 trigger fibers per each ¼ while each OptoRx mezzanine accept up to 12 fibers. In order to merge and manipulate with a dedicate algorithm all the trigger bits (30 fibers in total), we will need the custom TTM mezzanine to add to the Trigger TOT-FED. The trigger system is not completely fixed, need some more iterations within the trigger group. TTM not needed at the beginning (March 08). Expected to be available in June 08. T1 Trigger Mezzanine

  11. This small boards use the same FE preamplifier device integrated inside the VFAT chip (see Jan Kaplon). Needed for final studies on T1 CSC detector. PCBs ready. Components mounting 3rd w/Dec.07 16 channels preamplifier (1)

  12. 16 channels preamplifier (2) BOTTOM TOP

  13. Cabling and Power Supplies

  14. OLD Section

  15. Platform to 6th T1 Frame cable tray NEW Section Who is responsible for this cables ?? (Putting in work and purchase)

  16. Platform Service Racks

  17. Placed order at CERN for WIENER MARATON low voltages system. Two simple VME crates are also purchased for the MARATON remote control cards. Delivery expected within March 2008 T2 spares as back-up solution in case of longer delay Placed an order to CAEN for HV modules A1550P, and one mainframe SY1527. Delivery expected March/April 2008. Low Voltage and High Voltage components.

  18. Hosted on the platform racks: High Voltage  to be done, but ok for March 08. Connectors procurement done. Hosted on the 6th T1 Frame: Low voltage  prototype almost ready, ok March 08. High Voltage  all boxes made, one cabled prototype almost ready, ok March 08. Optic fiber  to be done, need a fiber cable fan-out and MPO connector for the dimensioning of the box (see W.S.). Patch panels

  19. Dear Santa: In order to debug the ROC optic sections and the slow control ring we need a dedicated DAQ (H8 style) system for us either in Genova or in Bld188 already now. We need a user friendly TTP based test-setup beginning Feb. 08 to do and test hybrid bonding. Need a DAQ system able to test all the ROC features towards end of Jan.08 . Christmas wish list.

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