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VLSI-SoC 2013 Conference Organization Updates and Progress in Istanbul

This document provides an overview of the organizational progress for the VLSI-SoC 2013 conference in Istanbul. Key updates include website setup via EasyChair, submission acceptance, and successful IEEE filing. Agreements with gold sponsors, a hotel contract ensuring guaranteed accommodations, and outreach efforts to a wide audience have been completed. The Call for Papers (CfPs) has been disseminated, and communication is ongoing with potential sponsors. Finalization of the technical program and social events is underway, ensuring an engaging conference experience.

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VLSI-SoC 2013 Conference Organization Updates and Progress in Istanbul

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  1. VLSI-SOC 2013 in ISTANBUL by H. Fatih Ugurdag

  2. Done • Web site up • EasyChair set up • Submissions being accepted • IEEE filings done • MOU modified for IEEE • ACM-SIGDA initial attempt • TPC Track Chairs posted • TPC almost done (70/72) • Agreement w/ 2 gold sponsors (stands, etc.) • CfPs sent to DATE

  3. Done – cont’d • Payu.com only signatures needed • Event firm signed a contract with the hotel • 50 rooms guaranteed • Ricardo emailed 25,000 people • I mailed 2,500 people in nearby countries • Synopsys no go • Posters sent to about 40 profs in Turkey • We are on Twitter

  4. In Progress • MOU needs to be printed by IEEE • ACM-SIGDA spon. needs to be finalized • Payu.com contract needs to be signed • Searching for more sponsors • Need to finalize the social program • Conf. Prog. beyond reg. papers (SS/P/ET/KN/PF) • Need to decide on extension (also abs. issue) • TPC needs to be posted (Reviewers?) • Beautifying and populating the web page

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