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LCFI Collaboration Status Report

LCUK Meeting Oxford, 29/1/2004 Joel Goldstein for the LCFI Collaboration Bristol, Lancaster, Liverpool, Oxford, QMUL, RAL. LCFI Collaboration Status Report. R&D for a vertex detector at NLC or TESLA Physics Studies Algorithm development and implementation Detector optimisation

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LCFI Collaboration Status Report

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  1. LCUK Meeting Oxford, 29/1/2004 Joel Goldstein for the LCFI Collaboration Bristol, Lancaster, Liverpool, Oxford, QMUL, RAL LCFI CollaborationStatus Report

  2. R&D for a vertex detector at NLC or TESLA Physics Studies Algorithm development and implementation Detector optimisation Mechanical Development Ultra low-mass ladders FEA/physical models Detector Development Fast CCD technology (50 MHz for TESLA) Custom CMOS readout chips LCFI Research Programme

  3. LC Vertex Detector • 800 Mchannels of 2020 m pixels in 5 layers • Optimisation: • Inner radius (1.5 cm?) • Readout time (50 s?) • Ladder thickness (0.1% X0?)

  4. Physics Studies • Implement flavour tagging algorithms in LC software • Quantify physics impact of different configurations • Preparing framework • Many different options • Short term: SGV • Long term: JAS3 • ZVTOP (SLD) • Benchmarking starting

  5. Target of 0.1% X0 per layer (100m silicon equivalent) Unsupported Silicon Longitudinal tensioning provides stiffness No lateral stability Not believed to be promising Semi-supported Ultra-thin Silicon Detector thinned to epitaxial layer (20m) Silicon glued to low mass substrate for lateral stability Beryllium has best specific stiffness Composites, ceramics, foams... Novel Structures Mechanical Options

  6. FEA Simulations PhysicalPrototyping Laser survey system Adhesive 0.2mm Beryllium substrate (250 μm) Mechanical Studies of Be-Si Thinned CCD (  20 μm) ~160 μm ripples at -60°C • Good qualitative agreement

  7. New Approaches • Be-Si unstable when cooled due to CTE mismatch • Choose substrate with closer CTE match • 100 μm carbon fibre • ceramic foam • Micromechanical techniques.... Microstages replace glue pillars Sandwich UV lithography on dummy

  8. Separate amplifier and readout for each column N+1 Column Parallel CCD Readout time = (N+1)/Fout Column Parallel CCD

  9. Prototype CP CCD CPC1 produced by E2V • Two phase operation • Metal strapping for clock • 2 different gate shapes • 3 different types of output • 2 different implant levels • Clock with highest frequency at lowest voltage

  10. CPC1 Results • Noise ~ 100 electrons • Minimum clock ~1.9 V • Maximum frequency ~ 10 MHz • inherent clock asymmetry

  11. CP Readout ASIC CPR1 designed by RAL ME Group • IBM 0.25 μm process • 250 parallel channels with 20μm pitch • Designed for 50 MHz • Data multiplexed out through 2 pads

  12. CPR1 Testing Voltage injection into ADC • Flash ADCs tested • Voltage and charge amplifiers tested • Voltage gain ~40 • Very sensitive to timing and bias values • Outstanding digital problems

  13. Wirebonded Combination

  14. Last Tuesday: Success! 4 channels with test signal Single channel histogrammed over 200 frames 4 channels wirebonded to CCD

  15. Wirebonded Results • Noise ~130 electrons • Noise from preamps negligible • Direct connections will be tested next

  16. Bump Bonding Currently underway with VTT Expect assemblies in March/April Test Programme Radiation effects on fast CCDs (Liverpool/Lancaster) High frequency clock propagation (Oxford) Next Generation ASIC Cluster finding logic Design work almost finished Waiting for CPR1 results and final review Next Generation CCD Design work starting in next few weeks Detector scale device Future Plans

  17. LCFI is on schedule and making good progress Physics tools ready for detector optimisation Semi-supported option studied in detail New mechanical ideas discussed CCD+ASIC operation achieved CP CCDs are viable technology for linear collider Next generation will be full-scale prototype CCDs Accelerator technology choice will determine path Summary

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