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Mass Market Wireless Multimedia The Chipset Challenge of Smaller, Faster, Cheaper…

Mass Market Wireless Multimedia The Chipset Challenge of Smaller, Faster, Cheaper…. Tom Pollard Worldwide Chipset Marketing Director Texas Instruments Incorporated. ODMs. Consumer Brand OEMs. Communications OEMs. Service Provider Branded Devices. Smartphone Platform. China Local Brands.

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Mass Market Wireless Multimedia The Chipset Challenge of Smaller, Faster, Cheaper…

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  1. Mass Market Wireless Multimedia The Chipset Challenge of Smaller, Faster, Cheaper… Tom PollardWorldwide Chipset Marketing DirectorTexas Instruments Incorporated

  2. ODMs Consumer Brand OEMs Communications OEMs Service Provider Branded Devices Smartphone Platform China Local Brands PDA/PCOEMs Series60 Emerging Established • Time to market • Product differentiation • Engineering support • Wireless system support Varying needs: Turnkey TI Wireless Technology Custom Flexible Solution Delivery Chipsets & OMAP Application Processors Hardware & Software Reference Designs Third-Party Modules Custom Solutions TI Wireless Technology Evolution in TI Wireless Chipset BusinessDiverse Customers with Varying Product Requirements TI has shipped over 1 Billion cellular digital baseband processors for wireless handsets

  3. Giving Consumers What They WantExpectations derived from 2G Wireless and the Internet Small size, stylish design Handsets as a fashion statement Long battery life Learn from the mistakes of initial WCDMA handsets Rapid reductions in handset cost Consumer market pricing for broad acceptance User choice of applications and content In search of the “killer app” Simplicity and immediate gratification Fully integrated “wireless appliances” The Challenge – Handheld Wireless Multimedia for the Mass Market

  4. Architectural and Technology Solutions for Wireless MultimediaRequired -- A multi-pronged approach to meeting the challenge • Power-efficient applications and communications processing • Open Platforms for SW Innovation • System Integration for Handset Optimization • Integration at the Chipset Level for Power and Size Reduction

  5. Optimized 2.5G and 3G solutions require system expertise and integration of all handset blocks! Complementary Technologies GPS 802.11 Bluetooth OMAP Developer Applications SOFTWARE Protocol Stack OS and Smart Phone SOFTWARE RF Applications Communications SOFTWARE Media engines Analog, Power Management Communications Processor OMAP Applications Processor Hardware and Software Reference Designs System Solutions 2.5G/3G Handset System IntegrationWireless Terminals require “Antenna to Applications” solutions • Communications processing • Digital, Analog, and RF chipsets • Protocol stack software • Applications Processing • OMAPTM Applications Processors • Operating system support and Java • OMAP Developers Network • Additional wireless technologies • Bluetooth, 802.11, and GPS • Complete handset and smartphone reference designs • Modules, handsets, smartphones, PDAs

  6. Integration at the Chipset Level Increased functionality, smaller size, reduced power consumption 2.5G/3G Terminal Functions Why Integrate? • Reduced cost-per-function • Cost reductions at the system level • Increased performance for multimedia features • Longer battery life – better talk and stand-by times • Smaller form factor to enable small, sleek mobile devices • Easier design and test for wireless designers due to new turn-key, ready-to-manufacture solutions • Coming Soon – the Single Chip Cell Phone!

  7. 2.5G & 3G CommunicationsProcessing ComplexityRequirements-- More silicon, More SW, More MIPS Baseband Processing Trends • Increased digital baseband horsepower for higher data rates • Logic migration from SW to HW for performance and power consumption • Higher memory requirements for protocol stack and applications • Support for data standards • TCP/IP • H.263 videoconferencing • SMS / EMS / MMS • Integration of: • Communications and applications • Functions – Bluetooth, USB,802.11, GPS, etc. • Encryption and securityrequirements Digital Baseband Complexity 2G 2.5G 3G Logic Gates 1x 1.5x 10x Comms MIPS 1x 1.5x 5x Comms Memory 1x 2x 6x

  8. Power-efficient Multimedia ProcessingBalancing flexibility, horsepower, and power consumption • Three options for multimedia processing • General purpose RISC processor • Programmable DSP • Dedicated HW accelerators • Optimized wireless multimedia requiresappropriate use of each processor • RISC for maximum flexibility, high-level language and OS support • DSPs provide flexible acceleration with provenpower consumption benefits • HW acceleration trades reduced flexibility for minimum die-size and maximum performance • A multi-processor approach allows moreintelligent power management strategies • Different operational modes use differentprocessor subsets • Processor engines are powered-off when not in use • Parallel processing increases effective MIPS and guarantees QoS • Power-efficient wireless multimedia requires optimal silicon-level and system-level integration of all three types of processing engines TI OMAP Processor (OMAP1610)

  9. 2.5G & 3G Terminals as Open PlatformsApplication SW innovation will drive mobile Internet market growth • 2.5G and 3G must deliver compelling applications and content • Applications SW design and architecturedirectly impact the user experience • Speed and responsiveness • Handset power efficiency and battery life • Handsets are evolving into moreopen platforms • Open software environment atthe handset and chipset level • Flexibility for the handset OEM,wireless operator, and consumer • High-level OS and/or Java willbecome standard for 2.5G & 3G • The search for “killer apps” requiresa thriving SW developer base • ISV diversity ensures the best applications and wireless experience

  10. Announced March 17 WANDA Enables: Integrates unique: First Tri-Wireless PDA Concept DesignGSM/GPRS, Wireless LAN, and Bluetooth • Simultaneous functions with multiple wireless connections • GSM phone calls • Always-on cellular GPRS or high-speed Wireless LAN web browsing and e-mail • Bluetooth file transfer, printing, and headset • DSP-accelerated Multimedia Applications • High performance digital still camera

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