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Semiconductor Fundamentals: Materials, Bonding, and Doping

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Explore the world of semiconductors and their properties. Learn about covalent bonding, the doping process, and how it supports current flow in semiconductor materials like germanium and silicon.

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Semiconductor Fundamentals: Materials, Bonding, and Doping

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  1. Chapter 19 Semiconductor Fundamentals

  2. Objectives • After completing this chapter, you will be able to: • Identify materials that act as semiconductors • Define covalent bonding • Describe the doping process for creating N- and P-type semiconductor materials • Explain how doping supports current flow in a semi-conductor material

  3. Semiconduction in Germanium and Silicon • Semiconductor materials • Possess characteristics that fall between those of insulators and conductors • Pure semiconductor elements • Carbon (C) • Germanium (Ge) • Silicon (Si) • Used for most semiconductor devices

  4. Semiconduction in Germanium and Silicon (cont’d.) Figure 19-1. Atomic structure of silicon.

  5. Figure 19-3. Crystalline structure of silicon with covalent bonding.

  6. Semiconduction in Germanium and Silicon (cont’d.) • Negative temperature coefficient • As temperature increases, resistance decreases • Heat • Potential source of trouble for semiconductors • Electrons break their covalent bonds

  7. Figure 19-4. A hole is created when an electron breaks its covalent bond.

  8. Conduction in Pure Germaniumand Silicon (cont’d.) Figure 19-5. Current flow in pure semiconductor material.

  9. Conduction in Doped Germaniumand Silicon • Doping • Adding impurities to a semiconductor material • Pentavalent • Made of atoms with five valence electrons • Trivalent • Made of atoms with three valence electrons

  10. Conduction in Doped Germaniumand Silicon (cont’d.) • N-type material • Pentavalent materials • Electrons are the majority carrier • Holes are the minority carrier

  11. Figure 19-6. Silicon semiconductor material doped with an arsenic atom.

  12. Conduction in Doped Germaniumand Silicon (cont’d.) Figure 19-7. Current flow in N-type material.

  13. Conduction in Doped Germaniumand Silicon (cont’d.) • P-type material • Trivalent materials • Holes are the majority carrier • Electrons are the minority carrier

  14. Figure 19-8. Silicon semiconductor material doped with an indium atom.

  15. Conduction in Doped Germaniumand Silicon (cont’d.) Figure 19-9. Current flow in P-type material.

  16. Summary • Pure semiconductor materials are germanium, silicon, and carbon • As the temperature increases in a semiconductor material, electrons drift from one atom to another • Current flow in semiconductor materials consists of both electron flow and hole movement

  17. Summary (cont’d.) • Doping is the process of adding impurities to a semiconductor material • In N-type material, electrons are the majority carrier and holes are the minority carrier • In P-type material, holes are the majority carrier and electrons are the minority carrier

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