1 / 15

GEM production facility upgrade II ( RD51 Dec 2012 – RD51 April 2013 )

GEM production facility upgrade II ( RD51 Dec 2012 – RD51 April 2013 ). Piotr Bielówka. RD51, CERN, April 2013. Introduction :. „ Small GEMs ” manufacturing upon CERN licence with ”d ouble mask ”. 10x10cm GEM made with „ SINGLE MASK ” :. Side A. Problems caused by :

mliss
Télécharger la présentation

GEM production facility upgrade II ( RD51 Dec 2012 – RD51 April 2013 )

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. GEM productionfacilityupgradeII ( RD51 Dec 2012 – RD51 April 2013 ) Piotr Bielówka RD51, CERN, April 2013

  2. Introduction: „SmallGEMs” manufacturing upon CERN licencewith”double mask”

  3. 10x10cm GEM madewith„SINGLE MASK”: Side A Problems caused by: - Photorezistadhesion - Reagentsconcentration Side B RD51, CERN, April 2013

  4. TowardsBig GEMs: „Research and development project” – transfer of support from WPT to Techtra RD51, CERN, April 2013

  5. Delivery Schedule ( December 2012) RD51, CERN, April 2013

  6. } Wet processing machines Upgradeschedule: • Alreadydelivered: • Technigraf exposure unit ( workingarea 1,2x2m) • WISE Chemstarresist developer • WISE Chemstarrinser • WISE Chemstarcopperetcher • WISE Chemstarkaptonetcher • Memmertoven • Olympus microscope, diagnostictables, demineralizator, ect. • Scheduled for delivery: • Tanks for electrochemicalcopperetching and resist stripping • Photorezist laminator • ISO class 7 cleanroom unit for lamination and exposure RD51, CERN, April 2013

  7. New workshop for „BIG GEMs” Room 1:cleanroom, lamination and exposure Room 2:resist development Room 3b: Kaptonetcher Room 3a: Cu etcher Room 1 – 48 m2 Room 2 – 48 m2 Room 3 – 96 m2 Total – 192 m2 RD51, CERN, April 2013

  8. Wet processingequipmentfor „BIG GEMs” OldKapton etching machine GEM limitation (30x30cm) New Kapton etching machine GEM limitation (width 65cm) RD51, CERN, April 2013

  9. Wet processingequipmentfor „BIG GEMs” New developer Old developing and etching set New Cuetcher RD51, CERN, April 2013

  10. New machineryfor „BIG GEMs” RD51, CERN, April 2013

  11. Opticalmeasurement stand. Additionaloptic microscope. Current optic microscopes set. RD51, CERN, April 2013

  12. Developed software to measure openings: • To tune copper etching we needed a tool to measure many hole diameters simultaneously. • We have developed software to automatically: • Detect hole borders onimages form microscopes • Fit ellipses to detected contours • Report statistics of hole size and uniformity

  13. Automated hole measurements RD51, CERN, April 2013

  14. Independent AIMS: 1. „Dedicatedline for big GEMsbecomeoperational by theend of March 2013”→June 2013 2. Implementing single masktechnique for: - production of 10x10cm GEMswith old machinery set - production of 20x20cm GEMswith old and new machinery set 3.Automatization of electrical and optical testing position. RD51, CERN, April 2013

  15. Our Core GEM Team MSc Piotr Bielówkapiotr.bielowka@techtra.plphysicist Dr Jan Chorowskijan.chorowski@techtra.plelectrical engineer MScKatarzyna Gutkatarzyna.gut@techtra.plchemist TTA TECHTRA Sp. z o.o.ul. Muchoborska 18,  54-424 Wrocław, PolandTel: +48 71 798 58 85Fax: +48 71 798 58 86e-mail: techtra@techtra.pl RD51, CERN, April 2013

More Related