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ITS SSD in 2003 PowerPoint Presentation
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ITS SSD in 2003

ITS SSD in 2003

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ITS SSD in 2003

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  1. Gert-Jan Nooren

  2. ITS SSD in 2003 Gert-Jan Nooren

  3. SSD modules on ladder Gert-Jan Nooren

  4. highlights in 2003 start of module production assembly robot for ladders control, read-out, DAQ beam test Gert-Jan Nooren

  5. HAL25 status • Design parameters ‘on the edge’ -> highly sensitive to process parameters -> MPW yield 50, 98, 8 % • Improved process control -> Engineering run yield 85 - 95 % • Thinning down to 150µm for better radiation length in progress Gert-Jan Nooren

  6. components of the modules HAL25-chip TAB-bonded on its Al chipcable (6 chips/hybrid) 2.Hybrids (2 hybrids/mod) 3.sensor (768 strips/side) Gert-Jan Nooren

  7. ALICE SSD Module Gert-Jan Nooren

  8. Module scanner • laser 1.06 mm wavelength • positioning ~1.5 mm • spot diameter < 20 mm Aleksey Sokolov

  9. Readout of the modules P-Hybrid control ALCAPONE ALCAPONE Sensor Vbias analog out N-Hybrid ALABUF ALCAPONE EndCap FEROM Gert-Jan Nooren

  10. Assembly robot Pick & place robot for modules Automatic positioning to a few micrometers Acceptance test 19 December Gert-Jan Nooren

  11. September 2003 beam testPrototype 4-module EndCap Gert-Jan Nooren

  12. September 2003 beam test5 module telescope Gert-Jan Nooren

  13. September 2003 beam testsS/N for 4 modules Canberra sensor ITC sensor P P P P Module SN0002 Module SN0003 Module HN0001 Module HN0002 N N N N Very preliminary - provided by Trieste team Gert-Jan Nooren

  14. Status and plans Beam tests • Integration in real Cern environment: read-out chain proven up to ADC • Sensor quality problem revealed: Canberra takes action • ITS = SPD + SDD + SSD beamtest end 2004 Gert-Jan Nooren

  15. Status and plans Beam tests • Integration in real Cern environment: read-out chain proven up to ADC • Sensor quality problem revealed: Canberra takes action • ITS = SPD + SDD + SSD beamtest end 2004 Module production • Helsinki is bonding chips at production speed • 2 + 7 modules produced, yield and speed ‘unknown’ • Testing infrastructure for chips and hybrids fully operational • Strasbourg and Trieste (MIPOT) starting in Q1 Gert-Jan Nooren

  16. Status and plans Beam tests • Integration in real Cern environment: read-out chain proven up to ADC • Sensor quality problem revealed: Canberra takes action • ITS = SPD + SDD + SSD beamtest end 2004 Module production • Helsinki is bonding chips at production speed • 2 + 7 modules produced, yield and speed ‘unknown’ • Testing infrastructure for chips and hybrids fully operational • Strasbourg and Trieste (MIPOT) starting in Q1 Read-out • EndCap ready for mass production • FEROM design ready, first prototype Q2 • Patchpanels and cables layout almost frozen Gert-Jan Nooren

  17. Status and plans Beam tests • Integration in real Cern environment: read-out chain proven up to ADC • Sensor quality problem revealed: Canberra takes action • ITS = SPD + SDD + SSD beamtest end 2005 Module production • Helsinki is bonding chips at production speed • 2 + 7 modules produced, yield and speed ‘unknown’ • Testing infrastructure for chips and hybrids fully operational • Strasbourg and Trieste (MIPOT) starting in Q1 Read-out • EndCap ready for mass production • FEROM design ready, first prototype Q2 • Patchpanels and cables layout almost frozen Assembly • First ladder Q1/Q2 • Module testing with laser set-up Gert-Jan Nooren

  18. June 2003 beam testsmodule SN0003 Charge matching P N Gert-Jan Nooren