Pixel Electronics slides for UCSC

1. Pixel Electronics slides for UCSC Cover 0.13 FE chip ROD Other Activities (except DC-DC) Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

2. Progress in FY07 • Epilogue from 2004 test chip • Preamp chip submission & testing • Workshop at CERN • Work-plan for full size chip submission • Includes non-US manpower • CPPM: • Bonn: • Genova: • US to focus on unique capabilities • Analog design • Architecture • Full chip integration Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

3. 2004 test chip epilogue • CPPM has prepared an SEU measurement setup using the LBNL 2004 0.13um test chip. • They are irradiating with 20GeV protons at CERN right now to extend the studies done at the LBNL 88” cyclotron in FY06. • LBNL simply provided test boards, a few chips, and advice, but we are getting a great deal in return • More on collaboration with European institutes later… Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

4. Analog test chip submitted Feb. 07 • 130nm bulk CMOS • 840 pixels complete with threshold and bias registers. • 2 basic charge-integrating amplifier designs: • resistor continuous reset. • current source continuous reset. • nominal current 22mA/pixel • Goal for final chip is ~10mA/pixel • Simulated ENC ~200e- for 400fF input load and ~20ns peaking time • Exact value depends on many tunable parameters 3.6mm 2.8mm Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

5. Analog test chip plans • Expected chip delivery late May • Test board in fabrication now • Initial “checkout” by Abder at LBNL • Distribution of chips to other test efforts in June/July • Interest from European collaborators to participate in testing • Some irradiation possible in FY07, but mainly in 08 • Hope that European colleagues will set up irradiation tests in FY08- no project fund request for this. • Note that all transistors are linear (with guard rings around Nmos) • Critical initial measurements expected • Threshold dispersion • Uniformity across array. Operating margin. • Current consumption, noise and timewalk Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

6. Pixel Upgrade Electronics Workshop • Held on March 22 at CERN following ATLAS-CMS Electronics (ACES) workshop. http://indico.cern.ch/conferenceDisplay.py?confId=13957 • 7 electical engineers not presently involved in pixels attended this meeting • CPPM, Bonn, Nikef, Genova • Clearly there is interest • Work Plan drafted in April to foster efficient collaboration • First global chip designers’ pone meeting to go over this plan isnext week Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

7. Plans for FY08 • Work-plan milestones • Architecture definition: September 2007 • Initial Design review: January 2008 • Final Design review: September 2008 • First full size chip submission: December 2008 • LBNL engineering manpower • 100% Abder Mekkaoui: Lead IC designer, analog front end, integration • 40% Dario Gnani: IC designer, High level description, readout logic • 30% George Chao: Pad frame • 10% Peter Denes: Organization, pads. (no cost to project) • LBNL purchases/fabrications • Assume a second iteration of front end design (if nothing else to fine tune lower current modifications): $65K including test board. Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

8. FY09 • Continue same level of design effort until submission • For Dec. submission this is 25% of FY08 manpower cost • Reduced effort still needed after submission in FY09 for simulation and testing • Take 50% of FY08 cost for remaining 75% of FY09 • Finally need to cover test board design (based on existing TPLL) and fabrication • EE, drafter, and board fab cost. • Student-like personnel to operate test setup • Cost of engineering run to be paid out of BL replacement ATLAS project, which is M&O-B with the usual sharing. • 20% of $400K Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

9. LBNL FE chip Cost breakdown FY08-09 Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

10. Chip Requirements Very difficult. Critical for power distribution and material High luminosity and small radius. Wants new ROD * Low value given by planar sensors and high value by 3D. Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

11. ROD development • ROD total bandwidth limited by output s-Link at 1.28Gb/s. • This is only enough for 8 chips at 160Mb/s each. • This would have to fed into the ROD on 32 40Mb/s inputs. • To read out a single R=4cm layer would need 94 RODs! • It would be much cheaper and reliable to build fewer new, faster RODs using modern components • Can keep the basic data flow architecture, but simply implement within new FPGA. • This is NOT yet an urgent need. Could in principle start in FY09 instead of FY08, but • There is available manpower in FY08 • Early design would feed-back into chip I/O architecture, leading to a better system • There is synergy with PLL-based test setup needs Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

12. ROD & PLL test setup • Interface definition is common to ROD and PLL test setup work, and is needed for chip architecture design. • Expertise at LBNL is common to ROD and PLL test setup (same people) • FY08 Tasks to be covered in the ROD/PLL area are: • Interface definition • Schematic layout of revised PLL test card • Initial look at new generation candidate FPGA for replacement ROD. • FY08 requested resources (split between chip and ROD) • 0.2 FTE under 4.1.2.1 • 0.083 FTE under ROD • 10K M&S under ROD (Xilinix evaluation boards) • FY09 requested resources (split between chip and ROD) • 0.53 FTE under 4.1.2.1 (includes PLL test card layout & fab) • 0.3 FTE under ROD (prototype BOC and ROD design) • 30K M&S under 4.1.2.1 (PLL test card fab) Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

13. LBNL ROD Cost breakdown FY08-09 Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

14. Other LBNL activities • Progress in FY07 in • 3D sensor testing and • Nanowire carpet hybrid pixel development • 3D sensor testing • Minor involvement but very positive impact • Established characterization setup at CERN enabling test work by U. of Oslo • Provided test boards and debugging help • Results from this work used to specify load requirement on new 130nm amplifier. • Will need to increase involvement in FY09 once first 130nm full chip is available • Note request for “tester” support in FY09 4.1.2.1. Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

15. Nanowire carpet hybrid pixelsW. Kim (molecular foundry), C. Tindall (eng.), H. Spieler (phys.), M. Garcia-Sciveres (phys.), and brand new addition CERN Medipix group Concept shown at UCSC upgrade meeting Nov. 2005 2007 Realized implementation Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres

16. Nanowire carpet hybrid pixels (cont.) • Funding sources so far • LBNL molecular foundry (FY06) • LBNL LDRD “surplus” (FY06) • ATLAS project R&D 0.07FTE (FY07) • No explicit ATLAS R&D request for FY08 Diode behavior of NW carpet sample fabricated by C. Tindall in FY07 Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres