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Direct Plating Neopact Seleo CP Plus

Direct Plating Neopact Seleo CP Plus. Direct Plating Application Guide. Neopact Main Industry Requirements. Reliability TCT 500 – 1000 cycles Thermal shock 3 – 9 x 288°C Functionality Control systems e.g. engine, braking, climate Communication / navigation Entertainment systems Cost

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Direct Plating Neopact Seleo CP Plus

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  1. Direct PlatingNeopactSeleo CP Plus

  2. Direct PlatingApplication Guide

  3. NeopactMain Industry Requirements • Reliability • TCT 500 – 1000 cycles • Thermal shock 3 – 9 x 288°C • Functionality • Control systems e.g. engine, braking, climate • Communication / navigation • Entertainment systems • Cost • Costs of raw materials • OEM demands for lower cost • Environment • RoHS / EU regulations • Recycling regulations • Waste water restrictions Automotive Industry

  4. NeopactBackground • Market release more than 18 years ago • Direct metallization process for flex material and MLB production such as back panels for end- market like automotive and industry • High Pd adsorption of conductor on all types of laminates for good conductivity Conductor Neopact Pd activator type A Pd activator type B 400ppm Pd 90ppm Pd 250ppm Pd Magnification 315000x

  5. MIL P-55110 MIL P-55110 D MIL P-50884 SN 57030 IPC-TM-650 IPC-A-600F Perfag 3 B Bosch K8 (Automotive) NeopactFeatures & Benefits • Tin- free Pd colloidal activation system • Highly versatile, reliable application for different technologies • Suitable for ALL base materials (PTFE / Flex) • Applicable as vertical and horizontal process • Good adhesion of acid copper on surfaces with low roughness • All customer requirements fulfilled

  6. NeopactProcess Sequence – Vertical Process Etch Cleaner Conditioner Selector Pre Dip Conductor Post Dip Acid Cu Plating

  7. NeopactTypical Results – Base Materials PIC 170 Isola DE117Tg = 170ºC DuPont Pyralux AP Rogers R4350Tg > 280ºC

  8. NeopactTypical Results – BMV FR4Ø 4mildepth 65µm RCCØ 4mildepth 65µm

  9. Neopact is a well established production proven process for several applications and end-user markets NeopactReferences Status 03/2010

  10. Seleo CP Plus

  11. Seleo CP Plus – The Plus for your green conscience What is Seleo CP Plus? • Direct Plating process (alternative to electroless copper) for MLB and HDI manufacturing • Based on a conductive polymer as conductive layer • Very GREEN and short process with only 4 active process steps

  12. Why use Seleo CP Plus?Features and Benefits CN– HCHO • Environmentally friendly • Very short & simple process • Low chemistry usage per m² cut board • Low generation of waste water • Low consumption of fresh water • No usage of harmful chemicals as e.g. formaldehyde, cyanide • Economical advantages • No dependence on Pd price • Low space requirement • Reduced investment costs • Low running costs (chemistry / fresh water / waste water) • Technical benefits • Selective process with excellent reliability • BMV & direct pattern plating capable • Horizontal & vertical application possible • Robust conductive layer – 2 time holding time possible • Copper particle free production Pd Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

  13. Metallization (E’lytic Cu) Etch Cleaner MnO2 + 2 + 4H+ + Mn2+ + 2 H2O Conditioner Adhesion Promoter Polyconduct Seleo CP Plus Process Description MnO2

  14. gap In the conductive layer Seleo CP Plus A Truly Selective Process • Seleo CP Plus reduces the risk of a gap developing in the conductive layer near to inner layers which can occur if non selective direct plating processes are used which require etching to clean innerlayers (e.g. carbon/graphite and some conductive palladium processes) Etching

  15. Etch Cleaner(optional) 1 1 3x 10.8 m 2 2 3x 3 3 18.1 m 1x + 3x Conditioner 4 4 Adhesion Promoter Activator 3x 5 Reducer 6 Polyconduct E’less Copper Horizontal Process Comparison Footprint E’less Copper Seleo CP Plus Cleaner 3x EtchCleaner 3x Pre Dip 3x • Reduced line length • 2 less active modules • 1 less cascade rinse 3x 1x + 2x Calculation Basis:Uniplate Seleo CP (UTS-s, 1.5m/min), Triple Rinses

  16. Environmental BenefitsTotal Chemistry & Water Consumption Uniplate (UTS-s, 1.5m/min), Triple Rinses + 27% • 60% less chemistry consumed • 28% less fresh water consumed (5.2kg/m²) - 69% - 100% - 31% - 93% - 100% - 100% - 82% - 90% - 97%

  17. Environmental BenefitsTotal Wastewater Generated Rinses & Active Modules Uniplate (UTS-s, 1.5m/min), Triple Rinses + 34% - 69% • 29% less generated wastewater (5.5kg/m²) - 12% - 97% - 100% - 75%

  18. No ICDs! No ICDs! Hole diameter 1.0mm 9x @ 288°C (ISOLA E-Cu 114) Hole diameter 1.0mm 6x @ 288°C (acc. IPC-TM-650 #2.6.7.1) Reliability – SST Solder Shock Test&ICD Performance Solder shock test, up to 9x at 288ºC, passed !

  19. Reliability – TCT Temperature Cycle Test1000 cycles & ICD Performance No ICDs! No ICDs! • 1.0mm ML 1.7mm (Panasonic R1566) • 1000 cycles TCT and soldering • 1.0mm ML 2.4mm (ISOLA IS 400) • 1000 cycles TCT and soldering Temperature cycle test, up to 1000cycles and soldering, passed !

  20. Reliability – IST Post interconnect (power circuit) Interconnect Stress Test &ICD Performance No ICDs! Hole diameter 1.0mm 2000 cycles IST (Shengyi S1000) Interconnect stress test, up to 2000 cycles, passed !

  21. ReliabilitySeleo CP Plus Summary

  22. Customer ExperiencesHorizontal / Panel Plating 2.0mm / 0.11mm AR 1:18 6 layers 1.6mm / 0.9mm AR 1:1.8 16 layers 3.2mm / 0.65mm AR 1:5 8 1.6mm / 0.2mm AR 1:8 layers 4 layers 1.6mm / 1.1mm AR 1:1.5 • Seleo CP Plus and smooth leveling down the hole

  23. Compatible with Direct Imaging Customer ExperiencesHorizontal / Full Pattern Plating 10 layers 1.6mm / 0.3mm AR 1:5.3 6 layers 1.6mm / 0.35mm AR 1:4.6 6 layers 1.6mm/0.7mm AR 1:2.3 detail 4 layers 1.6mm / 0.3mm AR 1:5.3 Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

  24. Customer ExperiencesHorizontal / Mechanical Drilled BV 400µm / 500µm 90µm / 100µm 1.0mm / 1.2mm µ 90µm / 100µm 250µm / 250µm 300µm / 300µm Panel & Pattern Plating

  25. Customer ExperiencesHorizontal / Laser Drilled BMV 100 / 75 µm Large Window 100 / 75 µm µ m 100 / 75 µm 1.0 / 1.2mm Inpulse 2HF 100 / 75µm 100 / 75µm 2 A/dm , 10 minutes , 4 ² m Copper µ 100 / 75 µ m 100 / 75µm

  26. Customer Experiences Horizontal Qualification Results 6 layer 4 layer 8 layer • 1 week, 3 shifts • 13380 panels ~1915 p./day • 4335 m² ~620 m²/day 10 layer 12 layer Thickness: 1.0  2.4 mm Drill dia: 0.25  ~4.0 mm Aspect ratio: 1:10 MLB: 2  12 layer Basematerial: Tg130  Tg170

  27. Customer ExperiencesBase Material Compatibility All material tested or produced with standard Seleo CP Plus process parameter

  28. Customer Reference Horizontal Lines Seleo CP Plus (1)

  29. Customer Reference Horizontal Lines Seleo CP Plus (2) Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

  30. Customer Reference Vertical Lines Seleo CP Plus (1)

  31. Customer Reference Vertical Lines Seleo CP Plus (2)

  32. OEM Reference

  33. Thank you for your attention! For more information contact : Jaime PerazaOrdaz PMM Atotech Europe Mobile: +34 606 372 364 Email: jaime.peraza@atotech.com CyrilChampionProduct Marketing Manager EuropePTH-PP Mobil : +33 6 20 14 79 78 Email: cyril.champion@atotech.com Tobias Sponholz Global Assistant Product Manager BTT PTHMobile: +49 (0)173 - 628 64 80 Email: tobias.sponholz@atotech.com

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