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Global Business Review 2001

Global Business Review 2001. Organization President Global Overview President Applications & Market Drivers Ind. Mktg. Dir. Segment Overview Mktg. VP Strategies & Challenges President Fiber Optics Review Business VP Operations Direction Operations VP

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Global Business Review 2001

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  1. Global Business Review 2001

  2. Organization President Global Overview President Applications & Market Drivers Ind. Mktg. Dir. Segment Overview Mktg. VP Strategies & Challenges President Fiber Optics Review Business VP Operations Direction Operations VP Financial Plan Controler Agenda

  3. Global Overview

  4. Company - Global Sales 1999 Sales 1,190 M € + 29% 2000 YEF 1,536 M € + 11% 2001 Budget 1,709 M €

  5. Company vs Market MARKET CAGR = 9.2% Source: Bishop Company CAGR = 11.3% 6.4% share 6.5% share

  6. Company - Sales by Channel 1999 Sales 1190 M € 2000 YEF 1536 M € 2001 Budget 1709 M €

  7. Global Top 15 Key Customers(includes CEM derived demand) Top 15 = 64% Std Margin% 34% Sales KK Euros 29% 38% 34% 31% 32% 45% 45% 39% 29% 25% 10% 26% 15% 34% All values in M EUROS

  8. Global Top 15 Key Customers Top 15 = 52% Sales KK Euros CEM DIST All values in M EUROS

  9. Product Groupings Metral Millipacs DIN Fastech PwrBlade Micropax Norcon HPC SCA-2 CPCB Cable Assy BP Assy BusBar D-Sub USB/1394 Combo Serpent PCMCIA Mod Jack VHDCI Metagig SIMM/DIMM Smart Card Basics Sockets Minitek CEE Mini BTB MegArray FFC/FPC

  10. Electronic Cabinet Packaging - Chassis LEVEL 3 LEVEL 4 LEVEL 5 LEVEL 1 & 2 INTERCONNECT LEVELS

  11. Global Sales by Product Groupings 2000 2001 40% Std Margin% Sales KK Euros 27% 25% 25% 24% 16% 14% All values in M EUROS

  12. Global Sales - Top Products Top 15 = 76% Std Margin% 39% Sales KK Euros 13% 37% 18% 44% 33% 23% 24% 32% 7% 39% 19% 26% 26% All values in M EUROS

  13. DATA Segment Summary - Global Market 10B Market Size Mobile Comp PC Servers Storage Peripherals Instrumentation Process Control Embedded Comp Medical Office Equip I&I Telecom Datacom Wireless Infrastructure COMM Mobile Phone Mobile Equip Set Top Boxes Modems DSC CONS 1B Growth Rate 5% 10% Source: Bishop, except Mobile Phone in Consumer, not Communications

  14. Applications & Market Drivers

  15. Market Drivers e-Infrastructure for e-Commerce Network Traffic Data Voice Time 1998 2000 2003 IDC 1998 - 2003 Internet users 4X 1998 - 2003 Data traffic 20X PERFORMANCE REQUIREMENTS DOUBLE EVERY YEAR!

  16. End User Applications

  17. Bandwidth to the Users

  18. Communications Network

  19. CONSUMER WIRELESS Set Top Box/Games DSC/Video/MP3 Cell Phones Modems Residential Gateway CONNECTIONLESS USER INTERFACES LIMITLESS BANDWIDTH DEREGULATION Network appliance PCs Servers DATA RAID Laptops PDA Mobile Commerce Datacom Optical Networking Broadband Access FIBER COMMUNICATIONS Market Trends INTERNET

  20. Network Revolution = Optical BANDWIDTH

  21. Internet Product Trend INSTALLATION POPULATION DEREGULATION IP Networks (packet switched) BANDWIDTH DEMAND Fiber Optics HS Mezz Metral 3000 InfiniBand Metral 2000 MicroCN Metral 1000 HSSDC2 Millipacs Metral Cat 5e Cat 5 Fastech Cat 3 Norcon PSTN Networks (circuit switched) DIN TIME 1975 1985 1995 2000 2003 VOICE E-MAIL FILE TRANSFER GRAPHICS MUSIC VIDEO

  22. System Design Challenges • Bandwidth Density • Cost • Time to Market/Volume • Modularity/Scalability • EMI • Power/Cooling • Inter/Intra Cabinet Connection • Design re-use / Standardization

  23. Communications

  24. Communications - FCI Market Position 1999 SAM = $4.70B TOP SUPPLIERS (1999 - Bishop) 1) Tyco 887.5 18.9% 2) FCI 598.7 12.7% 3) Molex 438.6 9.3% 4) FoxConn 226.6 4.8% 5) 3M+RN 187.3 4.0% 6) Amphenol 157.3 3.3% 7) Elco 150.0 3.2% 8) ITT Cannon 146.8 3.1% 9) JAE 140.1 3.0% 10) Radiall 122.6 2.6% 11) Hirose 99.6 2.1% 12) Gilbert 95.0 2.0% 13) ERNI 76.3 1.6% 14) Teradyne 73.1 1.6% 15) T&B 72.0 1.5% Tyco Product Portfolio FCI Molex FoxConn ITT Amph Teradyne 3M Elco Radiall Technology

  25. Communications - FCI Electronics vs Market MARKET CAGR = 10.8% Source: Bishop Company CAGR = 12.0% 14.4% share 14.7% share

  26. Bandwidth expansion in network infrastructure to support Internet growth and data communications. IP standard implementation to support voice over data. Telecom and Datacom convergence. High growth areas in new equipment to support bandwidth expansion. SONET/SDH, DWDM, xDSL, Base Stations Fiber optics moves closer to the home/desk High performance connector and I/O cable assembly needs. Outsourcing trend to CEM to accelerate. Maximum growth rate in 2000 Slowing through rest of forecast due to build-out saturation Communications - Key Market Trends

  27. SONET SDH Base Station RAC ATM DSL IPR DWDM Communications - Sub-Segments Market Size Nortel Lucent Fujitsu Alcatel NEC Cisco Ericsson Nokia Motorola Nortel Lucent 1B SWITCHING TRANSPORT ACCESS Lucent Cisco 3Com Nortel Alcatel Cisco Nokia Cu Mtn Nortel Lucent Lucent Nortel Alcatel Marconi Cisco DLC Cisco Nortel Lucent Juniper Nortel Lucent Ciena Cisco NEC Alcatel Lucent Nortel Marconi AFC DCS Tellabs Alcatel Lucent Growth Rate 10% 20% 30%

  28. SDH Market Share - EU Metral HM FCI Tyco Metral FCI Metral ITT / FCI Metral FCI Metral FCI Marconi includes GPT, Bosch & Nokia Alcatel A1660, A1670 Marconi SMA, MSH Nortel TN4X, TN6X RHK

  29. Base Station Market Share - Global FCI Metral NEC Metral HM FCI Panasonic FCI Metral Metral HM Tyco Metral & HM FCI & Tyco HM ERNI & Tyco Metral & HM Ericsson Pluto, HiCap Nokia UltraSite, Talk, S8000 Nortel Metrocell, S8000 Lucent Flexent, DoCoMo Alcatel BTS 3.5G, A9900 LMDS Samsung, LGIC, ZhongXing VHDM Teradyne FCI & Perlos Dataquest

  30. xDSL Market Share - Global ERNI Metral Lucent FCI + Tyco cPCI RN Metral Metral FCI Metral FCI/Tyco Metral FCI cPCI ERNI Metral Metral Press fit CEE Marconi partner Alcatel A1000 R3, R4, A1540 Nortel UE-IMAS Nokia D50 SpeedLink Ericsson ANX Samsung LGIC FCI & Tyco FCI Dataquest

  31. Communications - Key HPLs Top 15 = 86% 39% Std Margin% Sales KK Euros 44% 33% 32% 7% 39% 18% 16% 19% 37% 27% 26% 13% 28% All values in M EUROS

  32. BP PRODUCTS

  33. Communications - Product Success Factors • New product introductions • Fiber Optics - multi-fiber array connector • High Speed Mezzanine • High Speed backpanel products to volume • Leverage BGA technology • Increase capacity to match demand • Implementing Fiber Optics strategy • Roadmapping to match technology requirements • Continued focus on cost reduction • Technology (Am Ni); Location (low labor regions); Systems; Prod/Proc Tech • Time to market improvement (PACE)

  34. Communications - Product Roadmap MATURE GROWTH EMERGING MegArray Brd to Brd 0.8 mm BTB Conan HS Mezzanine HS HM Metral/Millipacs Backplane Series 1000/2000 0.1” Systems cPCI Series 3000 SFF FO Multi Fibre Array Fiber Optics BP adapters SC GBIC Cat 3 SMT, LED, Mag RJ11 Mod Jacks Cat 6 & 7 RJ45 Cat 5/5e Series 1000/2000 Gigabit Link HS cable Metral Series 3000 MetaGig No active FCI program PACE program

  35. Communications - Key Accounts(includes CEM derived demand) Top 11 = 87% Sales KK Euros All values in M EUROS

  36. Communications - Account Success Factors • Design wins/shipments to high growth equipment • SONET/SDH, DWDM, xDSL, Base Stations • Leverage existing relationships • OEMs - L, N, A, E, CS • CEMs - S, Sn, Cl, Sc, J, V • Provide complete solutions • platform design-in • Monitor equipment start-ups • acquisition targets for large OEM portfolio completion • Operational excellence • Global account management • Gain market share through capital investment

  37. Communications - SWOT STRENGTHS WEAKNESSES • Product breadth • OEM relationships -Customer Intimate • Lucent, Nortel, Alcatel, Ericsson • 2mm Futurebus (FB/Metral) market leader • Value added capabilities • CEM relationships • Signal Integrity expertise • Automated assembly systems • Fiber optic portfolio • Lack of backpanel (BP) design expertise/partner • Late to market with high speed BP connectors • Mature high margin products • Lack of RF solutions and focus • Hard Metric position • Capacity constrained: 2 mm • not enough FB suppliers, FB share shrinking OPPORTUNITIES THREATS • Fiber optics value added • High Speed BP design-ins for next gen platforms • HS backpanel alliance/partner • PCB/backpanel/cable assembly • OEMs outsourcing FO /box build • Time to capacity • Amorphous Ni & BGA technology • Low-cost capability/Am Ni& automated assy • A/P Hard Metric market • Lose technical leadership • Teradyne/Molex VHDM alliance • Foxconn entering Comm market • CEMs & Cable mfrs entering assembly business • Trend to outsourced bp turn-key design & build • Time to capacity to support A/P demand • CEMs threaten OEM relationships • Gaps in customer coverage • Hard Metric dominance

  38. Data

  39. FoxConn F Data - Company Market Position TOP SUPPLIERS (1999 - Bishop) 1) Tyco 934.8 14.1% 2) Molex 667.4 10.0% 3) FCI 502.4 7.6% 4) FoxConn 491.1 7.4% 5) 3M+RN 351.0 5.3% 6) Hirose 210.3 3.2% 7) Yamaichi 206.7 3.1% 8) JAE 198.9 3.0% 9) Amphenol 168.9 2.5% 10) T&B 160.1 2.4% 15) Teradyne 44.2 0.7% 1999 SAM = $6.65B Tyco Product Portfolio Molex Hirose JAE 3M Teradyne Amph Yama Technology

  40. Data - Company vs Market MARKET CAGR = 10.7% Source: Bishop Company CAGR = 1.7% 4.1% share 3.8% share

  41. HDD RAID STORAGE Servers Data - Sub-Segments Compaq Dell IBM HP Market Size PC Compaq Dell IBM HP SUN Compaq IBM Dell HP SUN EMC 1B Toshiba Compaq IBM Dell Fujitsu Seagate Quantum Maxtor Fujitsu IBM WD Mobile Computing Palm Handspring SONY Compaq Casio HP Peripherals HP Lexmark Canon Handheld 5% 10% 15% Growth Rate

  42. Price pressures and erosion approaching “low end” consumer Accelerating shifting of manufacturing to: low cost regions & CEMs Explosion of Internet globally driving segment growth High growth in entry/mid-level servers for data management Double digit growth for storage systems Bandwidth expansion between servers/storage/networks High performance connector and I/O assembly needs Reduced life cycles, standardization of components and rapid growth of CEMs have changed “Rules of the Game” Data - Key Market Trends

  43. Data - Key HPLs 13% Top 15 = 86% Std Margin% 38% Sales KK Euros 18% 39% 2% 37% 31% 26% 23% 32% 13% 8% 38% 38% All values in M EUROS

  44. Data - Product Roadmap MATURE GROWTH EMERGING RIMM DIMM Memory SO DIMM DDR DIMM InfiniBand USB MetaGig HS Cable SCSI Serial ATA Mini USB D-subs DVI VHDCI 1394 Metral 1000/2000 2mm Systems Backplane Metral 3000 0.1” Systems InfiniBand PCI MiniPCI Card Edge VRM9 Slot 1 CardBus LGA Combo PwrBlade SCA2 UDS Sockets MegArray Other Merced PowerPod PwrBay No active FCI program PACE program

  45. Data - Key Accounts(includes CEM derived demand) Top 11 = 47% Sales KK Euros All values in M EUROS

  46. Data - Key Success Factors • Focus on standards activity • InfiniBand (BP & IO), Serial ATA • SCSI (VHDCI), FibreChannel (MetaGig) • JEDEC (DDR DIMM) • Cost reduction efforts for commodity products • Focus on profitable area of market • Notebook, Servers, Storage • Work closer with Intel competitors - • AMD, Transmeta, others • Stronger & more integrated relationship with A/P

  47. Data - SWOT STRENGTHS WEAKNESSES • Cannot and will not compete on price (Foxconn) • Limited high volume/low cost capabilities • Weak product position in desktop PCs and peripherals • TTM/TTV vs competition • Lack of top tier private label supplier alliances • Weak position with leading Japanese OEMs • Not viewed as technology leader • Position with ODMs in Taiwan • Ability to serve/supply globally • Leading position with HDD OEMs • Focused product positions • PCMCIA, CardBus, Metral, MegArray, DIMM/DDR, Combo and compression, Pwrblade, SCA2 OPPORTUNITIES THREATS • Foxconn position, relationships and focus • Foxconn box build strategy and focus on 2 mm • “New Tyco/AMP” aggressiveness • Reduced life cycles and standardization of components reduce margins and ROIs • Growth and expansion of low cost niche suppliers • Open market bidding for conn and cable assys • Attraction/retention of key personnel in A/P • Trend toward reduced supplier base and pkg deals procurement • Double digit CAGR’s • Wins in Korea, Japan, Taiwan can be leveraged • Localized design+competitive production in Taiwan and China • Increased bus speeds driving to Communications solutions • Cable assembly upside • expansion of ODMs in A/P

  48. Consumer

  49. Consumer - FCI Market Position 1999 SAM = $0.9B Note: Bishop estimates excludes Mobile. TOP SUPPLIERS (1999 - Bishop) 1) Molex 267.0 28.8% 2) Tyco 126.8 13.7% 3) F 40.4 4.4% 4) JAE 36.2 3.9% 5) Hirose 33.2 3.6% 6) Elco 30.0 3.2% 7) Hosiden 25.6 2.8% 8) FoxConn 22.7 2.4% 9) Amphenol 11.8 1.3% 10) 3M 8.2 0.9% (stimates $1.5B including MP * Molex Product Portfolio Tyco *includes Mobile Phone FoxConn Hirose JAE Elco Amph 3M Hosiden Technology

  50. Consumer - Company vs. Market MARKET CAGR = 8.5% Source: FCI Company CAGR = 23.2% 7.6% share 8.6% share

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