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Laser drilling of a Copper Mesh

7 th RD51 Collaboration Meeting 13-15 April 2011 - CERN. Laser drilling of a Copper Mesh. Vincenzo Berardi. U.O.S. Bari, Italy. Dip. Interuniversitario di Fisica “M. Merlin”. Laser Ablation Definition.

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Laser drilling of a Copper Mesh

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  1. 7th RD51 Collaboration Meeting 13-15 April 2011 - CERN Laser drilling of a Copper Mesh Vincenzo Berardi U.O.S. Bari, Italy Dip. Interuniversitario di Fisica “M. Merlin”

  2. Laser Ablation Definition Laser ablation is the process of removing material from a solid surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates. At high laser flux, the material is typically converted to a plasma. Usually, laser ablation refers to removing material with a pulsed laser Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  3. Timescales of the laser ablation process fs ps ns µs energy absorption by free electons electron - lattice energy transfer ablation by phase explosion or evaporation Thermal diffusion Melting and resolidification Mazur et al. Nature Materials 2, 217 (2002) Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  4. Laser drillingstrategiesfor high accuracy Trepanningopticforhelicaldrilling F. Dausingeret al., Springer (2004) Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  5. Cu Parameters • Finding optimal laser process parameters • (pulse duration, wavelength, fluence, drilling strategy) • Copper oxide around the hole walls • (post process cleaning could be required) Advantages Flexible technology: complete control of the hole morphology (taper, diameter) and geometry (density of the holes mm-2, distribution) Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  6. 0.55 m PM-DC mm 5 Watt Pump diode mm 18 Watt 1.5 m PM-PCF Microchip laser fiber amplifier (100 ps) Quasi-monolithicQ-switchedmicrochip laser Yb-dopedphotoniccrystalfiber Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  7. CNR-IFN Bari - Laser materials processing labShort pulse100 ps fiber laser Collaboration CNR-IFN Bari FSU JENA Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  8. Post processAnalysis • Electron Microscopy - Field Emission • EDS (EDX) (Energy Dispersive X-ray Spectroscopy) Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  9. 5m 18m A look at the surface(s) 5mm layerfrontsurface 5mm layerbacksurface Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  10. EDS Metallic surface Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  11. 5m 18m Single layer drilling Array of 400 x 400 holes 1cm x 1 cm (post processing 20 x 20) Average Pitch (center to center) d = 24mm Average size (diameter) = 13 mm Laser Power = 500mW Overall processing time= 2 hours and 30 mins Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  12. 5m 18m Single layer drilling Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  13. 18mm 1 2 3 4 5mm 5mm 18mm Double layer drilling Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  14. 18mm 1 2 3 4 5mm 5mm 18mm Double layer drilling Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  15. 5m 18m EDS Hole edge Between holes Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  16. 5m 18m EDS Near Hole edge Hole edge Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  17. 18m 5m Summary • Cu meshes can be drilled to obtain 12-14 micron diameter holes with a pitch of 20-25 microns (focusing spot down to < 10 μm) • Only percussion drilling can be reliably used and Oxide formation can be limited but not avoided by flowing inert gas on the surface. • Contamination can be reduced by changing the geometry as follows 18m Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

  18. IFN Group INFNGroup Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

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