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C. Noshi/RASC, Kyoto Univ.

MDP (Mission Data Processor) for BepiColombo MMO Y. Kasaba, T. Takashima, H. Hayakawa (MDP Core Team = JAXA/BepiColombo Project Office). Supported by ISAS Data Handling Group. [MDP team] Core Members PSU NTS & H. Hayakawa (JAXA) IPD NTS & Y. Kasaba (JAXA)

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C. Noshi/RASC, Kyoto Univ.

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  1. MDP (Mission Data Processor) for BepiColombo MMO Y. Kasaba, T. Takashima, H. Hayakawa (MDP Core Team = JAXA/BepiColombo Project Office) Supported by ISAS Data Handling Group [MDP team] Core Members PSU NTS & H. Hayakawa (JAXA) IPD NTS & Y. Kasaba (JAXA) DPU MHI & Y. Kasaba & T. Takashima (JAXA) MPPE (for MDP-1) incl. support to MGF-O T. Takashima, K. Asamura (JAXA) PWI (for MDP-2) incl. support to MGF-I/MSASI/MDM Y. Kasahara, T. Imachi (Kanazawa U) H. Kojima, Y. Ueda (RISH/Kyoto U) Y. Kasaba (JAXA) MMO Mercury Magnetospheric Orbiter C. Noshi/RASC, Kyoto Univ.

  2. Progress from Jan. 2006 [Meetings incl. Payload members] * Large meetings: before the next MMO-Design Meeting & MMO-SWG in May-June. (with the update of “I-ICD FAQ” and “MMO-Payload Action Item List”) [Electrical] * PSU might be independently prepared for the instruments outside of MDP. * Grounding Concept in MDP-2 : It will be fixed based on the EM test by PWI. [Mechanical / Thermal] * Vertical style: It will be studied in detail in 2006FY. [DPU] * SpaceWire I/F : Hardware design is progressed. Test hardware (= E-GSE in future) is in development. * Software : Conceptual design is progressed. [Development Schedule] *Schedule for MDP & Its I/F is updated.

  3. Electrical concept (Old: Jan 2006) Command Command Telemetry Telemetry Power Power Common instruments PI instruments MEA1 (sensor/elec.) Spacecraft System Mission Data Processor [MDP-1] MEA2 (sensor/elec.) MIA (sensor/elec.) DPU: 9 clients [CPU+MEM] MSA (sensor/elec.) HEP-ele (sensor/elec.) IPD [Switcher/ Limiter] HEP-i (sensor/elec.) PSU [DC/DC Converter] ENA (sensor/elec.) MGF-out (sensor) MGF-out MDM (sensor) MDM (elec) MSASI (sensor/elec.) 1 Hz sync Mission Data Processor [MDP-2] MGF-in (sensor) MGF-in PWI EWO-E/B (+AM2P) MEFISTO-E SORBET SC (elec/sensor) DPU: 10 clients [CPU+MEM] MEFISTO (pre/sensor) WPT (pre/sensor) (motor/HK) IPD [Switcher/ Limiter] PSU [DC/DC Converter] MAST/WPT-E MAST-AC/DC

  4. Electrical concept: New (Mar 2006) Command Command Telemetry Telemetry Power Power Common instruments PI instruments MEA1 (sensor/elec.) Spacecraft System Mission Data Processor [MDP-1] MEA2 (sensor/elec.) MIA (sensor/elec.) DPU: 9 clients [CPU+MEM] MSA (sensor/elec.) HEP-ele (sensor/elec.) IPD [Switcher/ Limiter] HEP-i (sensor/elec.) PSU [DC/DC Converter] ENA (sensor/elec.) MGF-out (sensor) MGF-out MDM (sensor) MDM (elec) MSASI (sensor/elec.) 1 Hz sync Mission Data Processor [MDP-2] MGF-in (sensor) MGF-in PWI EWO-E/B (+AM2P) MEFISTO-E SORBET SC (elec/sensor) DPU: 10 clients [CPU+MEM] MEFISTO (pre/sensor) WPT (pre/sensor) (motor/HK) IPD [Switcher/ Limiter] PSU [DC/DC Converter] MAST/WPT-E MAST-AC/DC

  5. MDP Chassis plan (Mar.2006) Mechanical / Thermal

  6. MDP Chassis plan (Mar.2006) Mechanical / Thermal MDP-2 IPD-1 IPD-2 All: <=A5-size DPU-CPU DPU-I/F MDP-1PSU MGF-O-E Digital / Power part should be separated & insulated. 162.5mm(TBD) 25mm(TBD) 179mm(TBD)

  7. MDP Chassis plan (Mar.2006) Order is free. It will be defined by MHI based on the simplification. Mechanical / Thermal MDP-2 MGF-I-E DPU-I/F MAST/WPT-E AM2P DPU-CPU All: <=A5-size EWO-B-field EWO-E-field IPD-2 SORBET IPD-1 MEFISTO MDP-2PSU Digital / Power part: separated & insulated from PWI/MGF 162.5mm(TBD) 50mm(TBD) 30mm(TBD) 25mm(TBD) 334mm(TBD)

  8. MDP Chassis plan (Mar.2006) Mechanical / Thermal *Action Items in 2006FY 1) Establishment of “MDP-Chassis concept” = “Vertical style” Development & Test of “MDP MTM” & “MDP-STM” in Apr-Sep 2006. (No support from each payload team is requested at the moment.) 2) Establishment of “PCB” inside MDP-1 & MDP-2. Following matters will be updated & discussed after the MDP-STM test. - Frame concept - Heat Path concept - Harness & Connector concept

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