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HIOKI E.E. CORPORATION

HIOKI E.E. CORPORATION. Automatic Test Equipment. Road Map for ATE (Automated Test Equipment). 1117. 1115. 1300. 1110. 1111/12. 1114. 1101. 1102. 1105. PCB. X-Y HiTESTER. 1116. PACKAGE. UNIT HiTESTER. 1107. 1108. BOARD ASSEMBLY. X-Y HiTESTER. PRESS-TYPE HiTESTER. 2000. 1985.

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HIOKI E.E. CORPORATION

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  1. HIOKI E.E. CORPORATION Automatic Test Equipment

  2. Road Map for ATE (Automated Test Equipment) 1117 1115 1300 1110 1111/12 1114 1101 1102 1105 PCB X-Y HiTESTER 1116 PACKAGE UNIT HiTESTER 1107 1108 BOARD ASSEMBLY X-Y HiTESTER PRESS-TYPE HiTESTER 2000 1985 1990 1995

  3. 1105 IN-CIRCUIT HiTESTER • High-speed inspection • Capability of lifted IC lead detection • High-stability measurement • Reversely mounted capacitor detection

  4. 1114 X-Y IN-CIRCUIT HiTESTER • Reduces running costs • Flexibility • Unmanned visual inspection. • Unmanned operation.

  5. 1115 X-Y C HiTESTER • Ultra high speed • High-precision probing • Scratch-less • High accuracy • Gerber data utilization • Unmanned Operation

  6. 1116 X-Y C HiTESTER • Ultra high-speed inspection (4 arms) • High-precision probing • Scratch-less • High accuracy (resolution of 5aF) • Gerber data utilization • Unmanned Operation

  7. 1107 UNIT HiTESTER • High-speed inspection of IC packages, MCM • High-speed measurement • High positioning accuracy: repeatability within +/-3um • Dedicated fixture of minimum 150um pitch • User-replaceable probe

  8. 1107 UNIT HiTESTER Details 1.High accuracy Position repeatability : Within ±3μm 2.High-speed measurement Inspection time : 0.3sec/1024points 3.Fine-pitch probe Minimum pitch : 150μm 4.Component test L, C, R and Diode measurement 5.Insulation test Applied voltage: 1V-step adjustable

  9. 1107 UNIT HiTESTERTwo Inspection Stages

  10. 1108 UNIT HiTESTER High-speed testingfor IC packages,such as MCM, BGA,FC-PGA, FC-BGA, CSP and high-density boards

  11. In Actual Bare Board Inspection … Each pattern has the capacitance that is proportional to its area between probe and electrically isolated inspecting electrode (sensor board). Bare board under test Pattern Probe Capacitance measurement circuit Insulating film Inspection stage Sensor board

  12. Short-Circuit/Disconnected Pattern Inspection with Area (Capacitance) Measurement A: Area ε: Dielectric Constant L: Length εA Capacitance C= L The capacitance between parallel lines is proportional factor to its area. Therefore, capacitance measurement enables to measure its area.

  13. In Actual Inspection … A Flying probe contacts flip-chip side and four-terminal probes contact PGA side with a fixture to measure resistance Bare board under test Four-terminal probe゙ Pattern Resistance measurement Circuit Jig for inspection

  14. How To Measure Electrical Path Resistance Four-terminal measurement method With four-terminal measurement method, accurate resistance value can be measured by getting rid of wiring and contact resistance Resistance measurement circuit Constant current source Voltmeter I E r1~r4: Wiring and contact resistance r4 E0 r3 r2 r1 Resistance: R0 Minute electrical path resistance can be measured with four-terminal method

  15. 1172-67 Double-Link Probe

  16. 1172-41 Four-Terminal Probe

  17. In Actual testing… A probe for reversely mounted capacitor detection contacts the case of a electrolytic capacitor and the probes of a jig contacts the terminals Probe for reversely mounted capacitor detection contacts here Probe for reversely mounted capacitor detection

  18. How To Detect Reversely Mounted Capacitors The voltage drop between the case and the terminals of a electrolytic capacitor is measured to detect its polarity Probe for reversely mounted capacitor detection PCB Voltage measurement circuit Electrolytic capacitor

  19. Road Map Appearance and Internal Inspection 1995 2000 2005 2010

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