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Engineering Specification & Design Portfolio

Engineering Specification & Design Portfolio. Engineering Design. System Design. Start Here!. Detail Design. Design Process. Define Functional Needs Functional Specification (Continuous updating) Engineering Specification (Continuous updating) Detail Design Design for Manufacturing

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Engineering Specification & Design Portfolio

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  1. Engineering Specification & Design Portfolio

  2. Engineering Design System Design Start Here! Detail Design

  3. Design Process • Define Functional Needs • Functional Specification (Continuous updating) • Engineering Specification (Continuous updating) • Detail Design • Design for Manufacturing • Design for Assembly and Disassembly • Life Cycle Design • Prototyping • Production • Product Launch • Maintenance and Support • Product Recycling Concurrent and Iterative Activities

  4. Design Procedure Marketing Subsystem Decomposition Functional Needs Functional Specification Design Analysis Engineering Specification Matl. Selection • Detail Design • Life Cycle Design • Design for Assembly and Disassembly • Design for Manufacturing Recycling Maintenance Manufacturing Process Plan Product

  5. Design Specification • Functional Specification • Overall requirements • Key functionalities • Overall dimensions • Key performance characteristics • Layout drawing • Engineering Specification • Detail performance requirements • Subsystems and subsystems detail requirements • All relevant dimensions • Engineering drawings

  6. Design Portfolio • Design specification - Contract • Design Schedule • Functional design • Design alternatives • Design evaluation • Final design solution • Design model and analysis • Engineering drawings • Process Plan • References • Meeting notes

  7. System Design • Define Functional Needs • Functional Specification (Continuous updating) • Review existing information • Existing designs, patents, codes, legislation, literature search • Decomposition into subsystems • Overall layout • Subsystem relationship

  8. Flip Chip Bonder

  9. Functional Specification Development

  10. Process Flow I Silicon Template Step 1a - Pattern developed on bare silicon template • Clean silicon substrate by sulfuric acid & hydrogen peroxide at 120°C for 10mins • Rinse with deionized water and dry clean • Spin coat standard photoresist • Conduct photolithography by UV exposure • Wet etch the pattern by KOH (anisotropic etching) • Photoresist stripping • Rinse with deionized water and dry clean • Dicing

  11. Process Flow II Pressure Silicon Template Polymer Silicon Template Step 1b - Soft mould Preparation • Apply mould release (silicone) on silicon template • Clean another silicon substrate by sulfuric acid & hydrogen peroxide at 120°C for 10mins • Rinse with deionized water and dry clean • Spin coat polymer (PMMA / PDMS)

  12. Process Flow III Heat Heat Step 1c - Pattern transfer to the soft mould • Apply silicon template onto polymer with pressure (<5bars) • Curing polymer with suitable conditions • Release of silicon template • Step 1d - Soft mould fabricated

  13. Process Flow IV Silicon substrate PDMS / PMMA Mould Conductive Polymer Step 2 - Dipping of soft mould on conductive polymer • Apply a layer of conductive polymer into the paste pot • Turning the pot and set the height of the paste by height adjustable blade • Dipping of soft mould on the conductive polymer

  14. Process Flow V Magazine Wafer Step 3 - Die preparation • Dicing • Load into magazine

  15. Process Flow VI Pressure IC die Step 4 - Formation of interconnect • Alignment is conducted between soft mould and IC die • Apply soft mould onto the die (displacement control) • Lifting of the soft mould for next cycle • Soft mould will undergo Step 2 for next die

  16. Process Flow VII Pressure Bumped Chip IC die Sub-mount / substrate Step 5 - Assembly process • Bumped chip is flipped • Alignment is conducted between bumped IC die and substrate • Apply bumped IC die onto the substrate (displacement control)

  17. Process Flow VIII Heat IC die Underfill Heat Step 6 – Curing • Batch if assembled package is collected • Batch curing of conductive polymer in conventional oven • Underfilling is optional

  18. Functional Specification I • Target Package • Base Table

  19. Functional Specification II • Bonding Head • Camera Table

  20. Engineering Specification Development

  21. Polymer Flip Chip Bonder - Schematic

  22. Polymer Flip Chip Bonder

  23. Polymer Flip Chip Bonder Specification - I

  24. Polymer Flip Chip Bonder Specification - II

  25. Polymer Flip Chip Bonder Specification - III

  26. Polymer Flip Chip Bonder Specification - IV

  27. System Design Sub-system I Sub-system II Sub-system III Overall System Relationship B Relationship D Relationship C Relationship A

  28. System Design • Internet • Patent database • http://www.ttc.ust.hk http://www.ttc.ust.hk • IP and Patent Search Links (WIPS) • e.g. printer head + Epson • Research database • http://ustlib.ust.hk http://ustlib.ust.hk • Database List – (SCOPUS) • Printer head (title) + Epson (Affiliation)

  29. Design Evaluation Matrix

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