Semiconductor Manufacturing Equipment Market Is Expected To Grow at the Highest CAGR during 2017-2023

1. MarketsandMarkets Presents Semiconductor Manufacturing Equipment Market Is Expected To Grow at the Highest CAGR during 2017-2023 Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Cleaning Processes), Backend Equipment (Assembly & Packaging, Dicing, Bonding, Metrology), Fab Facility, and Geography - Global Forecast to 2023 https://www.marketsandmarkets.com/Market-Reports/semiconductor-manufacturing-equipment-market-263678841.html

2. The semiconductor manufacturing equipment market was valued at USD 39.07 Billion in 2016 and is expected to reach USD 62.56 Billion by 2023, at a CAGR of 6.86% during the forecast period. The key factors driving the semiconductor manufacturing equipment include progress in research and development (R&D) facilities, growing consumer electronics market, and increase in the number of foundries. The semiconductor production equipment mainly consists of two types: front-end and back-end process equipment. The front-end equipment comprises advanced technology and integration, which require heavy investment. Though expensive, front-end equipment is profitable and adds more value to the final product. Thus, frontend equipment holds a major share in the market compared with back-end equipment. Browse 66 market data tables and 50 figures spread through 159 pages and in-depth TOC on "Semiconductor Manufacturing Equipment Market - Global Forecast to 2023"

3. Lithography equipment to lead the semiconductor manufacturing equipment market in the coming years Lithography held a major share of the semiconductor manufacturing equipment market than other equipment in 2016. Lithography has progressed over the past few years because of extensive R&D in this field. New and advanced technologies are now available to the manufacturers of semiconductor devices, which have enabled them to manufacture high-quality devices. The application of different semiconductor devices such as ICs and transistors in various industries such as automotive, telecommunication, and consumer electronics led to the increased demand for semiconductor devices. Ask PDF Brochure: https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=263678841 Market for bonding equipment to witness a high growth in the near future Today, in the semiconductor manufacturing industry, wafer bonding is rapidly launching itself as a persistent technology. To ensure dependability and efficient productivity, wafer-bonding equipment became a necessity for semiconductor manufacturers. The bonding equipment implements numerous operations such as surface preparation and cleaning, wafer alignment, wafer bonding, and post-bond metrology. Standardization is highly valued by the integrated device manufacturers and silicon foundries. As a result, the demand for bonding equipment is expected to exhibit a high growth in the coming years.

4. APAC held the largest share of the semiconductor manufacturing equipment market in 2016 APAC accounted for the largest share of the semiconductor manufacturing equipment market in 2016 and is expected to grow at the highest CAGR between 2017 and 2023. The growth is attributed to increasing industrialization and urbanization in the region. Furthermore, the increasing semiconductor manufacturing capacity in Japan, China, Taiwan, and South Korea are key factors responsible for the increasing adoption of photolithography equipment. Some major companies such as SCREEN Holdings Co., Ltd. (Japan), Tokyo Electron Limited (TEL) (Japan), and Advantest Corporation (Japan) are also responsible for the dynamic growth of the semiconductor manufacturing equipment market in APAC. Request Free Sample Pages: https://www.marketsandmarkets.com/requestsampleNew.asp?id=263678841 The leading players operating in the semiconductor manufacturing equipment market include Tokyo Electron Limited (Japan), LAM RESEARCH Corporation (US), ASML Holdings N.V. (Netherlands), Applied Materials Inc. (US), KLA-Tencor Corporation (US), Screen Holdings Co., Ltd (Japan), Teradyne Inc. (US), Advantest Corporation (Japan), Hitachi High-Technologies Corporation (Japan), and Plasma-Therm (US).

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