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HT Summary Slides

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HT Summary Slides

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  1. HT Summary Slides

  2. TI High Temperature Products • Two HT Product Types • High Temperature (HT) 200°C parts • -55°C to +210°C - 1000 hours • Ceramic & KGD packaging • 175°C Plastic Parts • -55°C to +175°C operation • Plastic surface mount packaging High Temperature • Complete High-Temp (HT) signal-chain solutions for harsh environments • Unique Die and Packaging optimized for HT • Thermal shut-down removal • HT products offerings: • HT Plastic -55C to 175C • HT Ceramic -55C to 210+C • HT Die -55C to 210+C • The are 3 areas TI has developed expertise to guarantee reliability on our released HT products • Initial qualification of process, package and silicon across temperature • Silicon, Package Material set and Process modifications • On-going production quality monitors

  3. TI Enhanced Industrial Packaging Complete signal chain solutions Smallest Footprint Widest Package Type Options Hermetic Packages Ruggedized Packages Up to 175°C Plastic Packaging Up to 210°C Ceramic Packaging Up to 150°C Plastic Packaging Bare Die/Wafers Solutions • Ruggedized Applications • Enhanced Qualification • Extended Temperature • Up to -55°C to 150°C • Multiple Package types • Smallest size • Most Integration • Multiple options • 25°C tested wafers to • -55°C to 210°C Known Good Die (KGD) • Broad portfolio • Ruggedized Applications • Enhanced Qualification • Extended Temperature • Up to -55°C to 175°C • Multiple Package types • Special High Temperature Material Sets • Extreme Applications • HT Qualification • Extended Temperature • Up to -55°C to 210°C • Multiple Package types • Most rugged hermetic material option

  4. High Temperature Offering Interface SN65HVD233-HT Down Hole Signals Temperature Pressure Position Speed Flow Resistivity Rock Density SN65HVD11-HT SN65HVD1040-HT A to D Signal Conditioning ADS1278-HT ADS1282-HT ADS1243-HT ADS8320-HT ADS8509-HT OPA2333-HT OPA211-HT Memory DSP/MCU INA129-HT INA333-HT INA271-HT SM470R1B1M-HT SM28VLT32-HT THS4521-HT SM320F2812-HT OPA820-HT SM320F28335-HT MSP430F2619-HT OMAPL137-HT Power TPS76901-HT TPS62000-HT ISO7221-HT TPS62110-HT TPS40200-HT TPS40210-HT TPS50301-HT ADS6142-HT TPS7H1201-HT TPS54363-HT REF5025-HT Legend 150/175C Plastic 210C Ceramic/KGD

  5. TI High Temperature Products HT Webpage: http://www.ti.com/ht TI HiRel Contact: Mont Taylor mont-taylor@ti.com (903) 868-6316

  6. Comments/Feedback Please Visit : www.ti.com/ht

  7. Full TI High Temperature Products Presentation

  8. HiRel Business Segments Enhanced Products High Temperature Bare Die Space • Commercial-of-the-shelf (COTS) plastic solution for long life-cycle applications • Controlled baseline, traceability • Extended Product Change Notification (PCN) • Extended Temperature (-55C to 125C) • Additional test coverage and characterization • Complete High-Temp (HT) signal-chain solutions for harsh environments • Unique Die and Packaging optimized for HT • Thermal shut-down removal • HT products offerings: • HT Plastic -55C to 175C • HT Ceramic -55C to 210+C • HT Die -55C to 210+C • Ability to support complete signal chain solutions in die form • Full Known-good die (KGD) for military, space and high temp applications • Tested die (TD) for commercial applications • Wafer support and small quantity waffle pack support • Complete signal chain solution for Space environments • QMLV-certified wafer fabs • RHA certification • Radiation hardening IP • TID/SEE testing on products

  9. ProductLongevityAssured TI HiRel Advantage Commitment • 30+ years of experience working with HiRel customers • Largest dedicated organization in the industry • Worldwide sales and support infrastructure • Leading-edge technology and manufacturing • HiRel approved fabs (certified by Defense & Aerospace standards) • Access to latest process technologies (HPA07, BiCom, etc.) • Broad packaging capabilities As short as 9 months As long as 30 years ConsumerLife Cycle • Extended product life cycles • Obsolescence mitigation • Supply beyond commercial availability • Product resurrection HiRel Products Life Cycle Phase Out Decline Growth Maturity Intro • Market expertise • Baseline control and qualification per unique market requirements: TID, SEU, high-temp, ceramic, QML –Q/V, EP, die solutions, etc.

  10. High temperature and harsh environments markets • Down hole • Drilling • Logging • Well monitoring • Avionics • Jet Engines • Brakes • Heavy Industrial • Chemical Processing • Sensors • Actuation/Control • Geothermal • Drilling • Well monitoring • Medical • Autoclave • Sterilization Market requirements • Ruggedized packages • Small size • Low power • Qualified operation >150°C 10

  11. TI HiRel High Temperature Products Two HT Product Types • High Temperature (HT) 200°C parts • -55°C to +210°C - 1000 hours • Ceramic & KGD packaging • 175°C Plastic Parts • -55°C to +175°C operation • Plastic surface mount packaging

  12. HT Reliability • There are 3 areas TI has developed expertise to guarantee reliability on our released HT products • Initial qualification of process, package and silicon across temperature • Silicon, Material set and Process modifications • On-going production quality monitors

  13. Parametric Characterization done for each HT Release • Functionality • AC and DC Parametrics • Speed / Performance • Leakages & Power Analysis • IO Peripheral timing / performance

  14. High Temperature 210°C Quality and Reliability • Package Qualification • Bond Strength • Die Attach Strength • Mechanical Shock (1.5K g) • Constant acceleration (30K g) • Technology Verification • Electromigration Design Rule Verification • Voltage Box Characterization • Negative Bias Temperature Instability Rules Verification • Operational Characterization (from three lots) • Life Test (1000Hours/200°C) • By technology node (function, wafer fabrication process, and feature size) • 2,000 hours at 200°C, 1000 hours to release • Static (e.g., Analog) or Dynamic (e.g. DSP/MCU) • Sample size is 15 units minimum (3 lots) with no failures These qualification tests are typically preformed for each new 210°C HT Ceramic product release • Variable Frequency Vibration (20 g peak 20Hz to 2KHz) • Temperature Cycle (-65°C/+150°C 1000 cycles) • Hermetic test (Fine and Gross Leak) • Thermal Shock (-65°C/+150°C 100 cycles)

  15. New Leadform Packages 8-pin Ceramic FP 84-pin Ceramic QFP

  16. Leadformed Releases

  17. 175°C Plastic Packages • There are several ways TI provides a ruggedized plastic package for our 175C offerings • We have a different material set than the commercial/industrial devices to improve reliability at temperature • Special leadframe, mold compounds, and die attach to withstand the stresses from CTE mismatch • Special bonding wires and processes to minimize Kirkendall voiding causing degraded bond strength

  18. Differences in Flows Commercial IC Flow - Cost Driven EP Flow - Quality Driven HT Plastic Flow - Quality and Temp Driven Wafer Fab Wafer Fab Wafer Fab One Wafer Fab One Wafer Fab/HT Die AT Site AT Site AT Site AT Site AT Site Material Set Material Set Material Set Material Set HT Material Set EP products are built in one FAB, one AT site and use one material set for product build Commercial products can be built in multiple FABs, AT sites and may use various material sets for each product build HT products are built in one FAB, one AT site and use one material set optimized for HT

  19. 175°C Plastic Package Qualification The following high temperature plastic package qualification test sequence is required for each pin/package and die technology combination in addition to the EP standard qualification requirements. Data can be combined from different device types from the same pin/package and die technology. • Preconditioning (surface mount packages) • HTSL (Bake): 2000 hours at TA = TJ, where TJ is the maximum recommended operating temperature for the device type • Temperature Cycle: 500 cycles at -65°C to +150°C • Electrical Test: per datasheet at +125°C minimum with additional pin-to-pin leakage testing. • CSAM: 5 units/lot • TSAM (PowerPad packages only): 5 units/lot • Bond Pull: 5 units/lot - 15 wires/device • Bond Shear: 5 units/lot - 15 bonds/device • Cross section: 1 unit/lot - 1 bond/unit or 1 bump/pad

  20. HT Plastic Qualification Initial X-Ray • Commercial plastic failing HT Qual • Delamination • Bond degradation CSAM Bond Pull Bond Cross Section Before After

  21. 175°C Plastic Package Summary • TI HT Plastic parts use special leadframes, mold compounds, die attach, and bonding • We have a material set different from the commercial/industrial devices to improve reliability at temperature • Special leadframe, mold compounds, and die attach to withstand the stresses from CTE mismatch • Special bonding wires and pad processes to mimimize Kirkendall voiding causing degraded bond strength

  22. High Temperature Wafer Lot Qualification • New qualification test performed on each HT wafer lot • 45 units from every wafer lot used for HT products will be subjected to: • 210C burn in for 240 hours then, • End point electrical testing at operating temperature of -55C t o 210C • Requirement for all to pass standard HT tests • Allows any parametric drifts to be observed • Requirement for all new HT products beginning in 2Q’12. • Allows HiRel to keep a tight monitor on all HT products to control process variations that might affect performance across temperature.

  23. High Temperature Products HT Advantage & Qual DC/DC Controller Power FET Point Of Load Power Voltage Reference H.E.A.T. EVM Precision Op-Amp Processor Communication Interface Flash Memory TI HT Roadmap Power Driver Power FETs or BJTs Analog to Digital Converter Precision Op-Amp Digital To Analog Converter

  24. High Temperature Qualified Data Converters ADS1282-HT High Resolution ΔΣ, 250SPS to 4KSPS ADC ADS1278-HT Octal Simult. Sampling 24-bit, 128KSPS ΔΣ ADS1243-HT Octal Low Power 24-bit ΔΣ ADC 210 °C Ceramic 175 °C Plastic Die Pre-formed lead ceramic 24 210 175 210 DIE 175 210 175 DIE 210 DIE DIE PFLC PFLC ADS8509-HT 16-bit 250kHz CMOS ADC 16 175 ADS8320-HT 16-bit 2.7V to 5V µ-Power Sampling ADC Resolution (Bits) 175 210 ADS6142-HT 14-bit, 65 MSPS ADC w/ selectable outputs 14 PFLC DIE 210 175 DIE DAC Released Development Planned <1 100K 4K 128K 250K 65M Sample Rate (SPS)

  25. High Temperature Qualified Instrumentation Amplifiers INA271-HT Voltage Output Wide Common-Mode Shunt Monitor 10K 210 °C Ceramic 175 °C Plastic Die Pre-formed lead ceramic 210 175 210 DIE DIE PFLC PFLC INA128-HT Low Power Wide-Supply Instrumentation Amp 50 Input Offset (µV) 210 175 INA333-HT Low Power Single Supply Instrumentation Amp Released 25 Development 210 DIE Planned PFLC 130 200 500 1,000 Bandwidth (kHz) for G=100

  26. High Temperature Qualified Amplifiers High Temperature Qualified Amplifiers LM95172 13 to 16-bit Digital Temperature Sensor Temperature Sensors 210 °C Ceramic 175 °C Plastic Die Pre-formed lead ceramic 210 175 210 DIE PFLC THS4521-HT Single-Channel Rail-to-Rail Output Differential Amp Differential Amplifiers 210 175 PFLC DIE OPA2333-HT Very Low Power Zero-Drift Series OPA211-HT 1.1nV/√Hz 45MHz +/-10V OPA820-HT Unity-Gain Low-Noise Voltage Feedback Op-Amp Standard Op-Amps 210 175 210 210 150 PFLC DIE PFLC DIE PFLC DIE Released Development Planned

  27. High Temperature Qualified Power Management High Temperature Qualified Amplifiers LM5116WG-HT Wide Range 100V Synchronous Buck Controller TPS40200-HT Wide Input, Low-pin Buck Controller TPS40210-HT 4.5 to 52V Input Current-Mode Boost Controller DC/DC Controllers 210 °C Ceramic 175 °C Plastic Die Pre-formed lead ceramic 210 210 DIE 210 175 175 210 DIE DIE DIE PFLC DRV8332-HT Motor Driver PFLC Motor Driver DIE 210 175 REF5025-HT 2.5V Precision Voltage Reference Voltage References 210 DIE PFLC TPS50301-HT 3Amp, 3V to 7V Step-Down SWIFT DC/DC Converter TPS54362-HT 1Amp, 48V Step-Down SWIFT DC/DC Converter TPS62110-HT Adjustable, Step-Down Converter DC-DC POL Converter DC-DC POL Converter 175 175 210 Released TPS7H1201-HT Single-Output 500mA Adjustable LDO TPS76901-HT Single-Output 100mA Adjustable LDO Development LDO Planned DIE 210 210 175 PFLC DIE

  28. High Temperature Qualified Processors and Memory High Temperature Qualified Amplifiers SM470R1B1M-HT ARM 7 Microcontroller SM320F2812-HT Digital Signal Controller MSP430-HT 16-bit Ultra Low Power MCU SM320F28335-HT Digital Signal Controller Embedded Controllers 210 150 220 210 150 150 PFLC DIE DIE DIE DIE OMAPL137-HT C674x DSP + ARM9 Processor Embedded Processors 175 DIE SM28VLT32-HT 4MByte FLASH Storage Device Memory Memory 210 Released PFLC DIE Development Planned

  29. High Temperature Qualified Interface Products High Temperature Qualified Amplifiers SN65HVD1040-HT Low-Power CAN Transceiver with BUS Wake-Up SN65HVD233-HT CAN Transceiver with Diagnostic Functions CAN 210 210 175 PFLC PFLC DIE DIE ISO7221C-HT Dual High-Speed Digital Isolator Isolators 175 SN65HVD11-HT 3,.3V RS485 Single Half-Duplex Transceiver RS485 Released 210 175 PFLC DIE Development Planned

  30. Introducing the H.E.A.T. EVM Harsh Environment Acquisition Terminal (H.E.A.T.) EVM Features and benefits • Full high-temperature data acquisition system utilizing TI’s comprehensive signal-chain product portfolio • Eight Analog Input Channels • Six channels optimized for temperature, pressure sensors and accelerometers • Two general-purpose channels (fully differential and single-ended) • Comprehensive set of TI components qualified for • Operating temperatures from -55ºC to 210ºC • Minimum 1,000 hours operating life • Board is made with polyimide material, and incorporating high-temperature rated passive components and solder materials • EVM is test oven ready and can withstand temperatures up to 200°C for 200 operating hours.

  31. H.E.A.T. EVM high-temperature components • OPA2333-HT – low power zero-drift series operational amplifier • INA333-HT – zero drift, low power, single supply instrumentation amplifier • THS4521-HT – low-power fully differential amplifier • REF5025-HT – 2.5V precision voltage reference • SN65HVD233-HT – CAN transceiver • SN65HVD11-HT – RS485 transceiver • SM470R1B1M-HT – ARM7 microcontroller • ADS1278-HT – octal simultaneous sampling 24- bit 128KSPS ADC • OPA211-HT – low-noise operational amplifier

  32. New HT Design Support for 2013 • H.E.A.T. Power Reference Design • Demonstrating TI HT power solutions • Sequencing • TPS50301-HT POL Evaluation Board • Standard temperature board and evaluation • Spot for TPS7H1201-HT LDO when available • HT FLASH EVM • Generic HT Op Amp Board

  33. PowerHEAT EVM w/ Voltage Sequencing • Output Voltages: • 3.3V uP • 3.3V Adc ( Analog) • 1.8V uP • 1.8V Adc (Analog) • 5.0V Adc (Analog)

  34. HIGH TEMP POL EVM

  35. Generic HT Op Amp Board • Unpopulated HT board for oven evaluations • Options for multiple configurations

  36. 4MB HT Flash EVM Board • Simple HT board allowing oven testing of 14-pin ceramic package

  37. TI High Temperature Products HT Webpage: http://www.ti.com/ht TI HiRel Contact: Mont Taylor mont-taylor@ti.com (903) 868-6316

  38. Comments/Feedback Please Visit : www.ti.com/ht

  39. HT Product one page overview slides

  40. ADS1278-HT Octal Simultaneous Sampling 24-Bit 128KSPS ADC Released Features Benefits • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Selectable Operating Modes: • Simultaneous Sampling of 8 inputs up to 128KSPS Data Rate @ 103 dB SNR • Low-Power: 52 kSPS, 57 mW/ch • SPI or Frame-Sync Serial Interface • AC Performance: • -96 dB THD • 101 dB SNR (High Resolution Mode) • Linear Phase Digital Filter • Modulator Output Option (digital filter bypass) • ENOB = 16.9 bits at 210C Applications • Down-Hole Drilling • High Temperature Environments • Vibration Analysis • Pressure Sensors • Acoustics Temperature Range and Package • -55°C to +175°C (64-pin Plastic QFP (PAP) – 1Q13 • -55°C to +210°C (84-pin Ceramic QFP (HFQ) & KGD) • -55°C to +210°C (4Ceramic Lead-formed FP (HKP))

  41. ADS1282-HT Ultra-High Performance ΔΣ ADC with Low-Noise PGA Released Features Benefits • Extremely High Resolution • 122-dB SNR (250 SPS, High-Res. Mode) • 119-dB SNR (250 SPS, Low-Power Mode) • Ultra-Linear – THD: –101 dB, INL: 0.5ppm • Flexible Data Rate: 250SPS to 4KSPS • Onboard High Performance Digital Filter: • SINC + FIR + IIR (selectable) • Linear or Minimum Phase • 0.5Hz to 7.5Hz High Pass • Filter Bypass Mode • Low Power: 56.1 mW (High-Res. Mode) and 46.1 mW (Low-Power Mode) • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability AVDD VREF DVDD CLK SYNC ADS1282 Applications MUX PWDN RESET • Down-Hole Drilling • High Temperature Environments • Vibration Analysis • Pressure Sensors • Acoustics In1 Programmable Digital Filter & Calibration Serial Interface I/O 4th order ∆Σ Mod. SPI PGA In2 1 to 64 3 Mod. Out Over-Range Temperature Range and Package AVSS DGND • -55°C to +175°C (28-pin Plastic TSSOP (PW)) – Released • -55°C to +210°C (28-pin Ceramic DIP (JDJ) & KGD) – Released

  42. ADS1243-HT Octal Low Noise Low-Power 24-Bit ADC Released Features Benefits • 24-Bits No Missing Codes • Up to 8 Inputs Channels and Eight Data I/Os • Programmable 15SPS Data Output Rates • Internal Input Buffer and PGA • 21-Bits Effective-Resolution (PGA=1) • On-Chip Calibration • Highly linear (no linearity below 15ppm) • Simultaneous 50 Hz and 60 Hz Rejection • Single-Cycle Settling • External Differential Reference of 0.1V to 5V • SPI Interface Compatible • 1ppm of full-scale Noise Performance • 600 µW/ch power consumption • 20-pin Ceramic FP (SJD), KGD and PW packages • Multiple transducer signals can be easily sampled using the internal multiplexer • Allows user to measure input signals from 20mV (full-scale) to VDD • Allows user to easily correct for off-set errors by issuing a calibration command • Enables high accuracy measurements throughout entire input range • Excellent 50 and 60Hz Rejection • Controlled Baseline • One Assembly/Test Site & Fabrication Site • Extended Product Life Cycle • Product Traceability ADS1240/41 AVDD AGND DVDD DGND VREF+ VREF- XIN ClockGenerator MUX Offset DAC XOUT AIN0 / D0 Applications AIN1 / D1 CS SPISerialInterface AIN2 / D2 • Down-Hole Drilling • High Temperature Environments • Vibration Analysis • Pressure Sensors • Acoustics DRDY AIN3 / D3 ADC BUF SCLK PGA AIN4 / D4 POL AIN5 / D5 DIN 1:128 AIN6 / D6 DOUT AIN7 / D7 RESET Control Temperature Range AINCOM SYNC • -55°Cto +210°C – Released • -55°Cto +175°C – Potential PWDN

  43. ADS8320-HT 16-Bit High-Speed, 2.7 to 5V microPower Sampling ADC Released Features Benefits • Pin-out compatible with ADS7816 and ADS7822 • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • 16-Bit, 100kHz Sampling Rate • MicroPOWER: • <4mW at 100kHz and 2.7V • Power-Down: <60 uW • Serial SPI and SSI Interface • 8-pin Ceramic FP (HKJ) Package and KGD Applications • Down-Hole Drilling • High Temperature Environments • Vibration Analysis • Pressure Sensors • Acoustics Temperature Range • -55°C to +210°C (8-pin Ceramic FP (HKJ) and KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released

  44. ADS8509-HT 16-Bit 250KSPS True Bipolar Serial ADC Released Features Benefits • Pin Compatible With ADS7809 • Low Off-Set • Very Low Off-set Drift • Data can be read during device power-down • Highly Integrated- with onboard reference, reference buffer and conversion clock • Long-term stability from No Probing Laser Trim • Controlled Baseline • One Fabrication and Assembly/Test Sites • Extended Product Life Cycle • Product Traceability • Selectable Operating Modes: • 250-kHz Sampling Rate • 4V, 5V, 10V, ±3.33V, ±5V, ±10-V Input Ranges • SPI Compatible Serial Output • Daisy-Chain (TAG) Feature • On board reference, reference buffer & Clock • Internal or External Reference • Low Power Dissipation at 250 KSPS • Simple DSP Interface • 20-pin Plastic (DB) Package Applications • Down-Hole Drilling • High Temperature Environments • Vibration Analysis • Pressure Sensors • Acoustics Temperature Range • -55°C to +175°C – Released

  45. ADS6142-HT Low-Power High-Performance 14-bit, 65 MSPS ADC w/ Selectable outputs Released Features Benefits • Highest performance 14-bit available gives best performance in extended temperatures • Better dynamic performance, Gain, and programmability enables more margin • Low power enhances battery life and reduces thermal effects • Gain and other programmable settings allow device to be optimized to your needs • Controlled Baseline • One Fabrication and Assembly/Test Site • Product Traceability • Extended Product Life Cycle • Extended Product-Change Notification • 14-bit resolution with No Missing Codes • Maximum Sample Rate: 125 MSPS • Selectable LVDS or CMOS outputs • No External Decoupling required for Reference • 74.7 dBFS SNR, 95 dBc SFDR at 50MHz IF • Internal coarse and fine gain settings • 73.5 dBFS SNR, 96 dBc SFDR @ 50MHz IF • 70.4 dBFS SNR, 80 dBc SFDR @ 170MHz IF • Low power dissipation: 285mW (CMOS) • Programmable Output Clock Position and Drive Strength to Ease Data Capture • 32-pin plastic package and KGD Applications • Down-Hole Drilling • High Temperature • Vibration Analysis • Pressure Sensors • Acoustics Temperature Range • -40°C to +210°C KGD – Released • -55°C to +175°C (Plastic) – RTM 2H13

  46. LM9517213-Bit to 16-Bit 200°C Digital Output Temperature Sensor with 3-Wire Interface Released Features Benefits • Analog and Digital Supply Voltage: 3.0V -5.5V • Total Operating Supply Current: 400 μA (Typ) • Shutdown −40°C to +175°C → 12 μA • Shutdown −40°C to +200°C → 28 μA • Temperature Accuracy: • +175°C to +200°C → ±3.0°C (max) • +160°C to +175°C → ±2.0°C (max) • Temperature Resolution: • 13-bit: 0.0625°C/LSB • 16-bit: 0.0078125°C/LSB • Conversion Time: • 13-bit: 43 ms (Max) • 16-bit: 350 ms (Max) • 10-pin Ceramic Dual Flat-Pack Package • Shutdown mode saves power yet wakes up for one-shot temperature update • Integrated linear ΔΣ ADC produces high accuracy, fast conversion rates and extremely low output noise which improves system performance • Universal SPI and MICROWIRE Bus interface standards provides flexibility • High noise immunity of the Serial I/O (SI/O) output is ideal for challenging electromagnetic environments • Controlled Baseline • One Fabrication and Assembly/Test Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification Applications • Down-Hole Drilling • Automotive high temperature applications • Heavy Industrial Power Controllers • Heavy Industrial motors, gear boxes • Geothermal instrumentation • High Temperature Test Equipment Temperature Range • -40°C to +200°C

  47. INA129-HTPrecision, Low Power Instrumentation Amplifiers Released Features Benefits • Low Offset Voltage • Low Drift: 1μV/C max • Low Input Bias Current: 50nA max • High CMRR: 110dB min • Inputs Protected To 40V • Wide Supply Range: 2.25V to 18V • Low Quiescent Current: 2mA • 8-pin Ceramic Dual FP (HKJ) and Ceramic DIP (JDJ) Packages and KGD • Ideal for Bridge, Thermo-couple, and RTD Sensor, Amplifier and Data Acquisition applications • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification Applications Bridge Amplifier • Down-Hole Drilling • High Temperature • Vibration Analysis • Pressure Sensors • Acoustics INA129 Temperature Range • -55°C to +210°C (8-pin Ceramic Dual FP (HKJ)) – Released • -55°C to +210°C (8-pin Ceramic DIP (JD) & KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released

  48. INA333-HT Micro-Power, Zero Drift, Low Power, Single Supply Instrumentation Amplifier Released Features Benefits • Creates excellent accuracy • Ideal for maximum power efficiency • Easy compatibility for battery powered apps • Great for high impedance applications • Low Noise • Enables high accuracy • Enhances noise immunity • Controlled Baseline • One Fabrication and Assembly/Test Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification • Low Offset Voltage: 15uV • Low Drift: 0.2uV/C • Low Input Bias Current: 2044pA max • Input Voltage Noise: 55nV/rt-Hz, 1kHz • Supply Current: 345uA max • Wide Supply Range: 1.8V to 5.5V • RFI Filtered Inputs • 8-pin Ceramic Dual FP (HKJ), Ceramic DIP (JD) Packages, KGD, and Plastic SOIC (D) Applications • Down-Hole Drilling • High Temperature • Vibration Analysis • Pressure Sensors • Acoustics Temperature Range • -55°C to +210°C (8-pin Ceramic Dual FP (HKJ)) – Released • -55°C to +210°C (8-pin Ceramic DIP (JD) & KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released • -55°C to +175°C (8-pin Plastic SOIC (D)) – Potential

  49. INA271-HT Voltage Output High-Side Current Shunt Monitor Released Features Benefits • Eliminates need for additional protective components in the event of supply reversals • Buffered output with filtering for simplified use in current control loops • Preserves buffered voltage output • Saves using an additional Op-Amp • Controlled Baseline and Product Traceability • One Fabrication and Assembly/Test Site • Extended Product Life Cycle • Extended Product-Change Notification • -16V to 80V common-mode range • Extended Bandwidth: Up to 130kHz • Split stages for filtering • Two gain option family • INA270: 20 V/V (potential) • INA271: 14 V/V Applications • Down-Hole Drilling • High Temperature • Vibration Analysis • Pressure Sensors • Acoustics Temperature Range • -55°C to +210°C (8-pin Ceramic Dual FP (HKJ) & KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released • -55°C to +175°C (8-pin Plastic SOIC (D)) – Potential

  50. THS4521-HT One Channel RRO Ultra Low Power Fully Differential Amplifier Released Features Benefits • Low quiescent current • Delivers high accuracy for 24-bit conversion • Allows easy DC coupling to ADC • Larger outputs with low voltage applications • Flexible supply for power sensitive apps • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification • Low Iq, Power-Down mode • Bandwidth: 145 MHz, Slew Rate: 490 V/μs • Low Input Voltage Noise • Negative rail input & output Common-Mode Control • RRO – Rail-to-Rail Output • Single, Dual and Quad options • 2.5 to 5.5 (or ±1.25V to ±2.75) Supply Operation • 8-pin Ceramic Dual FP (SHK) and KGD THS4521 Driving a 24-bit Delta Sigma ADC Applications • Down-Hole Drilling • High Temperature Environments • Vibration Analysis • Pressure Sensors • Acoustics Temperature Range and Package • -55°C to +175°C (8-pin Plastic SOIC (D)) • -55°C to +210°C (8-pin Ceramic Dual FP (SHK) and KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released