3d interconnect - PowerPoint PPT Presentation

Interconnect Working Group

Interconnect Working Group. 2009 Edition (draft) 15 July 2009 San Francisco, CA US Christopher Case, Chair Osamu Yamazaki , Shuhei Amakawa , Larry Smith, Scott List, Philip Pieters , Didier Louis. ITWG Regional Chairs. Japan Hideki Shibata Masayuki Hiroi Taiwan Douglas CH Yu.

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Delay and Power Optimization with TSV-aware 3D Floorplanning

Delay and Power Optimization with TSV-aware 3D Floorplanning. M. A. Ahmed and M. Chrzanowska-Jeske Portland State University, Oregon, USA. ISQED 2014. Outline. Introduction Electrical Characteristics of 3D Interconnect 3D-Interconnect Electrical Performance TSV Aware 3D Floorplanning

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372 views • 18 slides

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