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Cmp process - PowerPoint PPT Presentation


Statistical Characterization of the Chemical-Mechanical Polishing Process

Statistical Characterization of the Chemical-Mechanical Polishing Process

Statistical Characterization of the Chemical-Mechanical Polishing Process. A Presentation at the XVI Oklahoma State University Research Week . Prahalada K Rao School of Industrial Engineering and Management. Introduction: Why CMP.

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1.12k views • 45 slides



2004-Apr-07 JaeYeong Kim

2004-Apr-07 JaeYeong Kim

Chap. 8 Chemical Mechanical Polishing (CMP). 2004-Apr-07 JaeYeong Kim. T step i. T step f. Definition of Planarization. No Planarization Smooth only Smoothing and partial planarization Complete Local Planarization Complete Global Planarization. T step f = T step i. T step f.

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579 views • 15 slides


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