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Fusion of Ultrasound and X-ray Data for Automatic Inspection of Flip Chip and BGA Solder Joints

Fusion of Ultrasound and X-ray Data for Automatic Inspection of Flip Chip and BGA Solder Joints. Ryan Yang 27/02/2009. Presentation Outline. Introduction Acoustic Micro Imaging X-ray Imaging Image Registration Image Fusion Conclusion. Introduction.

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