'Lead free solder paste' diaporamas de présentation

Electronics Assembly

Electronics Assembly. by Brent Staley. Materials & Design, Volume 30, Issue 10, December 2009, Pages 4502-4506 S. Mallik a,*, N.N. Ekere a, R. Durairaj b, A.E. Marks a, A. Seman a. Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications.

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How To Design High Temperature PCBs? - Miracle Electronics

Although PCBs are designed to be used in electronics that can heated up during operation, those PCBs that need to be used in extremely high environments need to be designed with special considerations.

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