Packaged dies - PowerPoint PPT Presentation

CSCE330 Computer Architecture

CSCE330 Computer Architecture. Dr. Khaled El-Ayat. أنا إن قدر الإله مماتى لا ترى الشرق يرفع الرأس بعدى إننى حرة كسرت قيودى رغم أنف العدا وقطعت قيدى مصر التى فى خاطرى وفى دمى أحبها من كل روحى ودمى. ٣٠/٦/٢٠١٣. ١٥/١١/١١ الشيخ عماد عفت.

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Chip Manufacturing Process

Blank wafers. Silicon ingot. Slicer. 20 to 30 processing steps. 8-12 in diameter 12-24 in long. &lt; 0.1 in thick. Tested dies. Patterned wafer. Individual dies. Die Tester. Dicer. Packaged dies. Tested Packaged dies. Bond die to package. Part Tester. Ship to Customers.

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