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Reports 3d tsv packages - PowerPoint PPT Presentation

Market Research on 3D TSV Packages Market 2016 and Analysis to 2026

Currently, 3D Packaging using Through Silicon Via technology (3D TSV) is one of the hottest topics in the semiconductor ecosystem. 3D TSV is vertical electrical connection (via) passing completely through a silicon wafer or die. These short vertical interconnects are replacing the long interconnects of 2D packaging technologies including wire-bond and flip chips.

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Reports 3d tsv packages - PowerPoint PPT Presentation

Market Research on 3D TSV Packages Market 2016 and Analysis to 2026