'Solder alloy' diaporamas de présentation

Physical and Mechanical Characteristics of Pb -free Solder - Copper Joints

275 views • 10 slides

Alchemy Electronics

Area Array Solder Bumping at the Substrate Level. Alchemy Electronics. Solder Bumping Process. Bake. De-Balling. Start. Excess Solder Removal. Re-Balling. Cleaning. Dry Out. End. Alchemy Electronics. Baking Process.

266 views • 8 slides

An Overview of Solder Paste

Printed circuit board (PCB) manufacturing requires a bonding agent to connect the surface mount components to the board’s pads. This bonding agent is known as ‘solder paste’, a material that is not just an adhesive, but a component that can form the mechanical bond and electrical connection between the PCB and the components.

49 views • 1 slides