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Basic Die Bonding Process & Quality

Basic Die Bonding Process & Quality. Typical Die Bonding Sequence. Epoxy dispensed on L/F. Die is bonded onto L/F. L/F. L/F index to bond position. x. x. Wafer. Die is picked up. Pad. Collet lower down to pick position. Collet at home position. Collet lower down to bond position.

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Stamping pin - PowerPoint PPT Presentation

Basic Die Bonding Process &amp; Quality

Basic Die Bonding Process & Quality