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FPI Training Material New Product Development Group 1 2015.0 5 . 2 5

FPI Training Material New Product Development Group 1 2015.0 5 . 2 5. Ⅰ What is Fingerprint?.

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FPI Training Material New Product Development Group 1 2015.0 5 . 2 5

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  1. FPI Training Material New Product Development Group 1 2015.05.25

  2. Ⅰ What is Fingerprint? The definition of minutia feature is made from modern fingerprint method by E.R. Henry, a British scholar, which is Henry System Classification. He classified the fingerprint as 2 parts and 8 types. If there are 13 features matching, Henry will consider they are same fingerprint. The gap between 2 ridges are between 300 to 500 μm, while the height difference are between 100 to 400 μm. In order to get enough feature points for identification, the size and resolution of the fingerprint image should be 1cm x 1cm and 500dpi.

  3. Ⅰ What is Fingerprint?

  4. Ⅰ What is Fingerprint?

  5. Ⅱ Fingerprint Identification System and Application

  6. ENROLMENT: Extraction of biometric data and construction of template FTE: Failure To Enrol Template Verification (1:1): User: “I am Christian” System: “Yes you are” or “No, you are not” Identification (1:n) or (1:many): User: “Here I am” System: “You are Christian” or “I do not know you” Ⅱ Fingerprint Identification System and Application

  7. VERIFICATION:Comparison of captured biometric data with one predetermined stored template FRR: False Rejection Rate FAR: False Acceptance Rate Ⅱ Fingerprint Identification System and Application

  8. Ⅱ Fingerprint Identification System and Application IDENTIFICATION:Comparison of captured biometric data with many stored template in database

  9. Ⅱ Fingerprint Identification System and Application Fingerprint Identification provides a safe and convenient method for ID Verification and Management

  10. Capacity Type Trans Capacitive Self Capacitance Optical：Illuminant+CMOS+Lens Ultrasonic：determine the distance Two types: Area vs. Swipe Sensor Ⅲ Fingerprint Sensoring Principle

  11. Self Capacitance Ⅲ Fingerprint Sensoring Principle Sapphire Cover Lens Exciter Ring Sense Pixel Array

  12. Valley Ⅲ Fingerprint Sensoring Principle Ridge Finger is TX Driven by Exciter Each square is pixel RX • Excitation voltage ~1 MHz coupled into finger via Exciter Ring or Bezel • Sense Amps at each pixel measure capacitance between finger and pixel • Very good sensitivity, but active circuitry at each pixel needed

  13. Trans Capacitive Ⅲ Fingerprint Sensoring Principle Valley Ridge RX TX • Very fine TouchPad • Sense trace spacing typically 70-110 um • 16 MHz 3V RF placed onto successively-scanned TX rows

  14. Swipe Type Sensor Ⅲ Fingerprint Sensoring Principle Host Platform Sensor Reconstruct Image Extract Minutiae M1={x1,y1,a1,z1) M2={x2,y2,a2,z2} ... Raw Image Data Fingerprint Template

  15. Area Type Sensor Ⅲ Fingerprint Sensoring Principle

  16. Ⅳ FPI Module Structure and Sensor List IMolding + Ultra thin cover lens II Molding+Thick CoverLens

  17. Ⅳ FPI Module Structure and Sensor List III Molding+Coating IVCoverLens（Independent)

  18. Ⅳ FPI Module Structure and Sensor List VUnder Glass FPI Module RoadMap MP PP MP PP MP R&D PP MP R&D PP MP

  19. Ⅳ FPI Module Structure and Sensor List Molding+Coating Structure FPI Appearance and Surface Magnification

  20. Ⅳ FPI Module Structure and Sensor List

  21. Ⅴ Production Capacity Plan

  22. Ⅵ Market Information

  23. LENS Manufacturing Process： Substrate Cleaning→Silkscreen/Ink Spraying →Solidification→AF Evaporation→Cutting →Splintering→LENS QC Assembly Process： FPC Baking→Solder Paste Printing→Chip Mounting →Reflow Soldering→Gel Filling →Solidification →Washing→LENS Lamination→Autoclave→ Solidification→Semi-finished Product Electrical QC→Holder Attaching→ Solidification →Label Printing →Splintering→Silicone Pad Attaching →Finished Product Electrical QC →Protective Film Attaching→Visual Inspection→OQC→Shipping

  24. SensorSupplier Qualification

  25. FPI Module Manufacturing Ability Matrix

  26. Notes for Design Stage Independent power for FPI Module to make sure pure AVDD without noise. If the FPI module is placed on the back of smartphone, and the rear cover is made of metal(connected to GND), customer need to contact the sensor supplier need to confirm the potential risk. If the FPI module is placed on the front side, and the middle-frame is made of metal(connected to GND), customer need to contact the sensor supplier need to confirm the potential risk.

  27. Debugging Notice Silead Sensor Debugging Suite. The debugging suites for Android 4.2/4.4 are OK The debugging suite for Android 5.0 will be OK by the end of this month.

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