Ultra-Low Power Bluetooth® Audio SoCs for Wearables & Headsets

1. Ultra-Low Power Bluetooth® Audio SoCs for Wearables & Headsets Reconceptualizing the Future of Connected Audio Experiences Our perception of sound has changed radically in the past ten years. Audio has now been made smarter, more personalized, and immersive, starting with such pure products as entangled cables and going all the way to fully wireless designs. However, what is invisible behind this smooth experience is a massive engineering challenge: the ability to deliver crystal-clear sound, advanced noise cancellation, and AI-enabled intelligence, in the smallest and least power-intensive footprints. That is where Ultra-Low Power Bluetooth® Audio SoCs of T2M SEMI come in - redefining the wireless wearables, TWS earbuds, smart glasses, as well as the gaming headsets. These SoCs are a combination of HiFi 5 DSP and Neural Processing Units (NPUs) to provide processing of advanced audio algorithms with incredible efficiency, providing intelligent sound performance and long battery life on devices.

2. The Evolution of Bluetooth Audio The Bluetooth Audio has come a long way since it was an alternative method of wireless transmission. It has turned into a smart ecosystem controlling quality audio streaming, low latency, and adaptable sound profiles based on the environment that the user is in. The second stage in this development, Bluetooth LE Audio, pushes the limits to the maximum. It has more efficient codecs, has multiple simultaneous connections, and has less power consumption. This gives the device makers the ability to create more durable, intelligent, and receptive audio devices that react immediately to the will of the user. The BLE Audio SoCs of T2M SEMI are at the core of this change and allow the developers to add AI-powered acoustic functions and future-oriented Bluetooth to small but powerful consumer devices. A New Standard for Low-Power Audio Intelligence Milliwatts count when creating a wearable or hearable. Consumers are expecting their wireless earbuds to work throughout the day, their smartwatches to constantly update on their health, and their AR glasses to communicate with their environment. Audio processing must be smarter, not faster, to fulfill these expectations. The T2M SEMI Bluetooth Audio SoCs are meant to meet this challenge. They are based on a HiFi 5 DSP that provides audio signal processing at their core, with an NPU that provides neural inference. The combination of them allows low-power implementation of functions that would otherwise need external processors or cloud computing, such as AI noise reduction, voice keywords, and multi-mic signal processing.

3. The resultant integration enables devices to do complex computations on the processor and consume much less energy. It is the type of innovation that allows two earbuds to provide hours of continuous playback at the highest-quality sound with zero detectable latency. Smarter Sound, Every Second The contemporary user wants their gadget to be able to reason, to change immediately the moment they leave a quiet room and enter a busy street, or whenever they decide to change music during a video call. The audio architecture of T2M SEMI is aimed at providing that type of contextual intelligence. Both SoCs have Hybrid Active Noise Cancellation (ANC), which is a combination of Feedforward (FF) and Feedback (FB) to ensure noise control at a consistent level. This is a two-pronged strategy that allows it to constantly track external as well as internal audio cues with dynamically adjusting so as to remove undesired noise without corrupting the original playout. Practically, it would imply that your earphones would no longer have a hard time balancing between the background noise and the clarity of the music; the chip does it all automatically, on the fly. This is further advanced by the Neural Processing Unit (NPU), which is capable of enhancing AI-based call noise cancellation and environmental awareness. The SoC can distinguish between human voices and background noise, which is suppressed with specific algorithms that produce natural sound quality in the call and the desired difference between the call and disturbances. It could be a gaming session, work call, or a workout playlist, but users get to enjoy audio that is crisp, responsive, and intelligent. Designed for the Future of Audio Connectivity Due to an increasing level of integration and multitasking capabilities, wireless devices are required to operate using the communication technologies capable of managing several streams of data at the same time. The T2M SEMI Bluetooth Audio SoC features the BT/BLE 5.4 dual-protocol stack, enabling the devices to have a stable connection even in highly dense RF conditions. This allows options like a multi-link connection, which allows a user to have two devices connected simultaneously, and they can easily switch between using a smartphone and a laptop without the need to re-pair. It makes integration into the ecosystem simpler, as well as enhances user experience, to product developers.

4. The SoC is also compatible with Google Fast Pair, Apple and Google Find My Device (FMD), and LE Audio functions. This guarantees quicker matching, reliable location assistance of devices, and steady operation of operating systems and shape factors. Channel Soundin, together with the presence of Spatial Audio, has new opportunities to produce 3D sound and immersive AR/VR experiences. It is not merely about networking equipment but about matching it so that it delivers lively sound. Power Meets Precision: The Technical Foundation The core of the solution of T2M SEMI is a strong belief in technical excellence. Bluetooth Audio SoC is not a chip; it is a highly integrated platform that is designed to speed up the development cycle, but at the same time be adaptive to innovation. It also favors the higher audio codecs such as LDAC and LC3, so high-resolution sound at reduced bitrates should be guaranteed. LDAC allows TV to stream audio at 990 kbps, with the provision of Hi-Res Audio on Bluetooth with negligible compression artifact. The LE Audio next-generation codec, LC3, is a higher-quality codec that is half the bit rate of SBC, which is a great improvement in terms of energy consumption. The SoC is based on a combination of HiFi 5 DSP accuracy along with on-chip power management to achieve a combination of performance and power efficiency. The outcome is low latency - down to 10 milliseconds - and still, without interruptions or jitter, continuous streaming. This has the effect of optimal synchronization of audio and visual in gaming or in rendering media plays. When used in communication equipment, it makes speech and other background noises appear natural and realistic. Engineered for Every Experience T2M SEMI miniaturized SoCs are scaled to the industrial-level headsets. They are easy to adapt to any category of products where performance and endurance a major factors. The SoCs in true wireless stereo (TWS) earbuds give them seamless left-right synchronization, increased playback time, and increased in-call clarity. In headsets used in gaming, they provide sub-10ms latency, which is a necessary feature of immersive and real-time gaming. In the case of smart glasses, spatial sound and continuous voice commands can be integrated into the low-power architecture without increasing bulk and heat. The high-impact DSP in the SoC is available even in the personal sound amplification products (PSAPs) or assistive hearing devices that enable the amplification of speech, but still manages to provide comfort during the process of natural listening.

5. All the designs, all the circuits, and all the firmware features are optimized in order to render wireless as seamless as it is smart. The Star Behind the Sound THE T2M SEMI Bluetooth Audio SoC family is a revolution in the chip design of consumer audio. Both versions incorporate signal processing, AI computation, RF control, and power management on the same architecture, reducing the number of external components and simplifying PCB design. The conveniently located Neural Processing Unit within the SoC performs AI operations, which could not be done without a dedicated microcontroller before. Together with the HiFi 5 DSP, it provides hardware-level computerization of algorithms such as beamforming, echo cancellation, and voice activity detection. Native wear detection, adaptive equalization, and spatial sound rendering are additional features that enable the improvement of the user experience in all use cases. This same platform, to the developers, is a shortened development time, simpler certification, and a shorter time-to-market, without any quality or performance sacrifice. Bringing AI Audio to the Edge Edge AI is changing the audio world a rapid manner. The devices are no longer dependent on the cloud services to provide intelligence; the device processes information on-site to deliver quicker, more confidential, and more certain outcomes.

6. Bluetooth Audio SoC of T2M SEMI adopts this paradigm. Keywords and voice recognition, as well as classification of sounds in the environment, are examples of tasks that the on-chip NPU can infer in real-time without connecting to the cloud at all times. This architecture not only enhances response time but also protects the user information, hence it is a good fit in privacy-centered wearable technologies. Think of earbuds that will identify your voice immediately and no data will be transferred to a remote server, or a pair of AR glasses that will adjust ambient sound depending on what is in your immediate environment, all at a few milliwatts of energy. That is what T2M SEMI is making possible in the future. Technical Highlights at a Glance While the technology runs deep, its brilliance lies in simplicity. The chipset’s highlights include: ● Bluetooth Version: Dual BT/BLE 5.4 protocol stack ● Audio Codec Support: BLE Audio, LDAC, LC3 ● Noise Cancellation: Hybrid Active Noise Cancellation (FF + FB) ● Processing Power: HiFi 5 DSP + NPU ● Low-Latency: Up to 10ms for gaming and streaming ● Smart Features: LE Audio, Google Fast Pair, Apple/Google FMD, Spatial Audio, Native Wear Detect ● Connectivity: Multi-link pairing for dual-device operation This combination of advanced hardware and intelligent firmware creates a platform that’s not just powerful — it’s adaptable for evolving consumer and industrial needs. Building Tomorrow’s Audio Products, Today T2M SEMI not only offers silicon but also offers comprehensive support to the OEMs and developers. Every chipset is accompanied by a full-fledged SDK, a production-ready reference design, and tailor-made product requirements. T2M SEMI engineering and ecosystem solutions can be used by any partner to develop a flagship TWS earbud, a professional headset, or a fitness wearable, making development simpler and faster to be ready to market the product.

7. The design philosophy is quite simple: the company allows connecting more smartly and efficiently without being complex. T2M SEMI has been able to leverage artificial intelligence acceleration, wireless innovation, and low-power design capabilities to enable brands to create differentiated audio products with real-world impact. Conclusion: The Sound of the Future Is Smarter The era of intelligent audio has come- the time when all the beats, voices, and ambient sounds are intelligently treated in order to provide richer and natural sound experiences. The next generation of this revolution is the Ultra-Low Power Bluetooth Audio SoCs by T2M SEMI. They add intelligent sound to all the form factors, including earbuds or even AR glasses with AI-powered processing, hybrid ANC, and super-efficient architecture. This is not merely wireless audio to a much better degree, but creating listening, learning, and adaptable devices. And in that quest, T2M SEMI keeps on driving the next generation of connected and context-oriented sound. Contact Us T2M Technology India Private Limited Address: 4th Floor, C-56/30, C Block, Phase 2, Industrial Area, Sector 62, Noida, Uttar Pradesh 201301 https://maps.app.goo.gl/yoPWxLkmAysKCEor7 Contact Number: +919923060006 Email ID: contact@t2m-semi.com Website: https://t2m-semi.com