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Enhanced Pad TSV Liner Design with 10 Micron Oversizing for Improved Performance
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This document outlines the design enhancements made to the Pad TSV (Through Silicon Via) liner, generated from the input of PCVia1, focusing on a 10-micron oversizing technique. The improvements aim to optimize electrical performance and ensure better reliability in semiconductor device fabrication. By addressing various key parameters, the new design is expected to significantly enhance the durability and functionality of integrated circuits. This approach provides a comprehensive solution for manufacturers looking to improve their TSV technology.
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Enhanced Pad TSV Liner Design with 10 Micron Oversizing for Improved Performance
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“pcvia1” Precedence=1 “diel” Precedence=0 “diel” is generated from “pcvia1” by oversizing 10 micron.
Top Pad TSV liner
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