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Low Power Design for Sensor Networks: 4-Layer PCB for Tubular Enclosure Applications

Discover an innovative electronic low power design tailored for sensor network elements. This project features a 4-layer slimline PCB design compatible with a 20mm diameter tubular enclosure, enabling efficient integration into various applications. It supports automated serial engineering processes, making it ideal for modern engineering projects. The additional user-defined pulse shape and multi-DAC module capabilities allow for advanced signal generation, interfacing seamlessly with PC Labview applications and providing robust control with RS232 to fiber link conversion.

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Low Power Design for Sensor Networks: 4-Layer PCB for Tubular Enclosure Applications

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  1. GeoBeads 2009 TNW R. van den Berg • Electronic low power design for a sensor-network element • 4-Layer slimline PCB design for use in a tubular-shaped, 20mm diameter enclosure • Compatible for automatic serial engineering For more information: E-mail: r.e.vandenberg@tudelft.nl Internet: www.demo.tudelft.nl Dienst Mechanische en Elektronische Ontwikkeling

  2. DAC Pulsmodule 2009 TNW R. van den Berg • User defined puls-shape • Multi DAC-module • Labview application in PC • RS232 to fibrelink converter with microcontroller • 1 optical controlled distribution module • 16 DAC’s per module • Up to 7 modules per rack • Compatible with IVVI rack

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