1 / 34

AMICSA 2008 31 August – 02 September Sintra, Portugal

AMICSA 2008 31 August – 02 September Sintra, Portugal.

winda
Télécharger la présentation

AMICSA 2008 31 August – 02 September Sintra, Portugal

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. AMICSA 2008 31 August – 02 September Sintra, Portugal Multi-Gbit/s Capable 65nm CMOS Ser/Des Design Analysis for Space ApplicationDugoujon, L.1; Hili, L.2; Skoulaxinos, S.3; Papadas, C.3; Baguena, L.4; Childerhouse, M.5; Tonietto, D.1; Ramet, S.1; Badets, F.1; Lavastre, S.1; Briand, P.11STMicroelectronics (France); 2ESA (The Netherlands); 3ISD Athens (Greece); 4Thales Alenia Space (France); 5EADS Astrium (United Kingdom)

  2. ST Global Presentation

  3. ST Global Presentation

  4. ST Global Presentation

  5. ST Global Presentation

  6. ST Space & HighRel History & Policy • First space supplier ever SCC-B Qualified (1979) • Major ESA QPL contributor • 1999: Creation of Rad Hard Design Center in ST-Sicily • Expanding product portfolio • ST Space & HiRel Policy: • Wide & stable Product Range offerings • 300krad at High Dose Rate & ELDRS (world leadership). • Top level Heavy Ions requirements • Top Level Space Quality • Develops world business through QML-V Qual (1998) • Full support & commitment to Europe national Space Programs: • « GalileoSat », « NGP », « Digital Divide », « COSMO » , « XMM » • Dedication to custom products support

  7. Space Product Portfolio extract • Available: • Classical bipolar Transistor 2N2222’s series • 300krad ELDRS-free Bipolar Linear Regulators: RHFL4913, L7913 • 300krad ELDRS-free Bipolar Op-Amps: RHF43B • 300krad Bipolar fast Op-AmpsRHF300=>RHF350 series • 100krad Logic series: 54HC00’, CD4000B’s (Escc) • 300krad Logic serie: 54AC00’s (Qml-V) • 300krad 16-bit Bus Interfaces: 54VCXH162244’s (Qml-V) • 300krad 12-bit AD-Converter: RHF1201 (Qml-V) • 300kRad 14-bit ADC RHF1401 Qml-V in 2008. • In the pipe: • Smd Diodes 1N5822-5819-5811-5806 ‘s • 100 kRad PowerMOS • 100kRad ELDRS-free 2N Transistors redesign • 300krad 32-bit Bus Interface 54VCXH322245 EM avail, qual ‘08 • 300krad ELDRS-free Quad Op-Amp RHF484 • 300krad ELDRS-free fast Op-Amp RHFS111 of a new RH-SOI techn • Clock Distributor RHFLVDS111, 650MHz, EM avail

  8. Juno Spacecraft MSL ROVER JWST Telescope L = ~9’ ST INSIDE

  9. Need & constraints for Gbit/s SerDes • Main application: Next Generation Telecom Satellites Digital Payload • Partnering with European space industry primes: EADS-Astrium, Thales-Alenia Space • Key objectives of KIPSAT project (under ESA contract): • Assessment of ST 65nm long term reliability • Demonstration of SerDes 6.25Gbit/s performances • Baseline for a space-grade ASIC technology

  10. System Architecture example

  11. Payload ASICs constraints • Payload Processor ASIC requirements: 10-30 Millions gates- 3-8Mb RAM - 6Gbit/s Serial I/Os – 200-400MHz Processing Clock – Low dissipation – High-Reliability - RadHard – Hermetic Package – Moderate customization costs for Manufacturers • Such performances are only achievable with Deep Sub Micron • ST proposed its CMOS 65nm, commercially qualified in 2007.

  12. 10-30 Mgates 400MHz clock Low power < 10W >20 x 6.25Gbit/s HSSL Available before 2011 Non ITAR TID > 200krad(Si) No SEL 80MeVcm2/mg SEE<10-10/b/day in geo 15 years opl. lifetime Viable business model 750 kgates/mm2 2GHz stdcells 5.7nW/(MHz x gates) 1.25-7.5GBit/s modules Production in 2008 Made in Crolles (Isère-F) No variation 100krad(Si) OK with process option Efforts needed for SEUs Achievable MPW/MLR or Platform ESA Requirements / Intrinsic 65nm

  13. What? 65nm for Space! • Do we risk in such recent technology? • What about: • Rad-hard capabilities • Reliability • Cost • Design flow

  14. Rad-hard maximisation • Rad-hard capabilities measured under ESTEC-ST contracts (ST 130nm, 90nm, 65nm and 45nm) • Usage of process option for SEL (1mask) • Experimental confirmation on worst case supply and Temp • Validation of « analog » HSLL IP (LC-tank VCO) • Re-use of SEU mitigation techniques (ST patented) on Std. Cells and clock-trees specificaly developed for this 65nm platform • Usage of a mix of SRAM or rSRAM (ST patent) cuts to be defined with end-users • RH by design ST (+CERN) know-how enriched by end-users cooperation.

  15. Reliability maximisation • Analysis of reliability figures from Std qualification • Systematic application of ST DiR methodology (focusing HCI and NBTI) with dedicated tools for ageing simulations • Eventual specific layout rules for reliability enhancement • Study of tighter controls at process level

  16. Reliability summary for ST 65nm • LEVEL1 (Wafer Level Reliability): • Even with Worst Case test conditions, all but two items (NBTI+HCI) exceed 15 years spec on test structures. • NBTI + HCI: Accurate simulation methodology + design guidelines provide means to exceed 15 years on actual IC. • LEVEL2 (Early Failure Rate + Over Life Test ) : • Qualification step: 8 fails out of ~ 6000 samples. All explained by defectivity/SPC. • Post-Qual monitoring: 0 fail (10 years) out of ~4000 samples. • Huge enhancement of D0with the PDF program.

  17. Device Reliability Modeling • Goal: Cover all VG/VD domain VG+ HCI PBTI VG Off-state VD+ NMOS GRILLE GATE VD SOURCE SOURCE DRAIN DRAIN VG+ PMOS SUBSTRAT BULK Off-state VD+ NBTI HCI

  18. Reliability model (Eldo UDRM) Reliability parameters SPICE model • Extended models Description of Transistor Stress as function of Activity Description of SPICE parameters evolution as function of Stress • Age.lib object Library Aged Results Simulate Aged Netlist Simulate Fresh Comparison Model Parameters (Fresh) Updated SPICE parameters Nominal Results Aging related commands Stress analysis Eldo Stress File Optional Transistor-Level Reliability Simulation Flow

  19. At designer end Reliability Modeling/Simulation Flow NBTI, HCI stress experiments NBTI, HCI stress experiments Reliability Modeling Reliability Modeling Multiple Vgs/Vds conditions Multiple Vgs/Vds conditions Model describing the degradation Model describing the degradation f f (Ids, (Ids, Ib Ib ,W) ,W) - - HCI HCI Extraction Extraction of of f f ( ( Vgs Vgs , , Vds Vds ,T,L,t) ,T,L,t) - - NBTI NBTI degradation degradation parameters such as parameters such as Model Model SPICE SPICE Vt, gm and Vt, gm and IV curves IV curves parameter evolution parameter evolution during stress during stress Add to Add to Spice model Spice model Estimation Estimation At designer end At designer end of degradation of Circuit spice n/l STEP 1 Different transistors Different transistors + + Input stimuli Input stimuli Iterative Reliability Simulation Evaluation of Evaluation of degraded degraded SPICE SPICE Running Simulation Running Simulation Compare Compare STEP 2 STEP 2 with degraded models with degraded models

  20. Silicon Validation • Inverter ring in 65nm technology • Simulations similar to HTOL of fab silicon

  21. NBTI simulation: digital buffer Note the delay introduced by the NBTI in comprison to the same buffer without NBTI

  22. NBTI: Vth shift Illustration of the input threshold shift in I/O buffer

  23. /2 I Q Data Slice Data Slice Clock Slice Data Slice Data Slice SERDES principle Ref Clk 3.125GHz RX input offset Cancellation 4 to 10 data Slices per Clock Slice TX output

  24. SerDes features

  25. SerDes Packaging constraints • Bump usage • Power consumption table • Clock + 4 Data slices Bump out Edge of die Core side Core side Update : 1clock slice support 8 data slices (tbv) 12 @7.5G (tbv) 16 @6.25 • Power at Vod peak =400mV • Bump to ball ratio • Package notes • Require 1 Resistor and 1 Cap on package • Designed for FCBGA build up 2-2-2 substrate.

  26. SerDes Terrestrial > Space • Organic fcBGA Pkg, 17x17, 2-2-2, 256 Balls, 1.0 mm ball pitch • Hermetic package solution under analysis • Target BER <10-18 (on CAT4K legacy backplane) • ESA specs of <10-12 (medias to be defined) • 250mW max power @7.5Gbps, 200mW max power @ 5Gbps • ESA spec=200mW, slight power reduction under study • Re-simulations with ageing effects and eventual rework • 15-20 years verification in worst case conditions

  27. SEUs mitigation techniques • Analysis of SerDes critical areas • Replacement of standard dffs by robust dffs (ST patents) • Use of robust clock-trees (ST patents) where critical • Implementation of TMV where necessary • Continuous reading of configuration registers and automatic recovery in case of corruption

  28. Ser/Des Validation (1) • Astrium has evaluated and tested Texas and Xilinx Ser/Des systems. • Texas TLK2711 – 1.6 to 2.5 Gbps • Tested with parallel clock at 1.6Gbps and 2.5Gbps. • Tested with nominal supply voltage (2.5V) +/-0.1V. • No noticeable correlation was apparent. • Tested with various lengths of differential stripline traces and 50 ohm matched length coax cable. • Stripline lengths of 10, 15, 20, 30, 40 inches and combinations thereof. • Tested using built in PRBS (27 -1) in a loop back configuration. • Eye measurements • Jitter measurements • BER measurements • Error free, from 1.6 Gbps to 2.5 Gbps, within a determined distance.

  29. Ser/Des Validation (2) • Xilinx ML321 – 3.125 Gbps • Tested at 3.125 Gbps and 2.5Gbps using on-board and external oscillator. • Tested with various lengths of differential stripline traces and 50 ohm matched length coax cable. • Stripline lengths of 10, 15, 20, 30, 40 inches and combinations thereof. • Tested using built in PRBS generator using various polynomials in a loop back configuration with 33% pre-emphasis. • Eye and jitter measurements. • BER measurements.. • Error free, at 2.5 & 3.125 Gbps, within a determined distance, with short PRBS polynomials. • Xilinx MK322 – 10 Gbps • Tested at 5 Gbps and 10 Gbps with various lengths of differential stripline traces and 50 ohm matched length coax cable. • Tested using built in PRBS generator using various polynomials in a loop back configuration with default and optimised pre-emphasis. • Eye and jitter measurements. • BER measurements. • Virtually error free, at 10 Gbps, over shorter distances.

  30. Ser/Des Validation (3) • “Quatuor” Validation • Test Quatuor configurations that are likely to be used in telecoms payloads. • Test various parametric configurations, e.g. pre-emphasis, output level, equalization. • Consider requirements for autonomous link establishment and maintenance in space environment subject to SEE. • Prove that unidirectional links can be established, that link performance degradations and link loss maybe detected and that links can be re-established. • Test with various media as expected to be used in telecoms payloads. • Test impact of clock quality on measured BER. • Perform eye and jitter measurements. • Estimate best achievable BER (assuming ideal Rx and clock recovery) in the absence of other noise sources. • Measure BER. • Participate in radiation testing of Quatuor • Advise on the design of evaluation board ensuring direct access to parallel digital data. • Consider the design of dedicated test hardware, for BER, for link establishment and maintenance, for SEE testing. • Consider hiring dedicated parallel BER Tester.

  31. Validation with TAS (1/1) • Thales Alenia Space has been implementing such kind of components for a long time, starting with first generation of 400 Mbits/s links, that are now in orbit • More recent payloads required far higher speeds and Serdes components from 1 Gbits/s to over 3 Gbits/s have been evaluated in our labs • We are presently working on last generation of components up to 10 Gbits/s • 2 methodologies are being used: • Elaboration of our own test/evaluation breadboard including proprietary BER measurement environment on specific breadboard • Utilization of commercial tools for BER on breadboard: • BER tester Anritsu 1632A up to 3,2 Gbps • BER tester Agilent N4901A up to 12 Gbps • Thales Alenia Space expertise and means will support the present HSSL development

  32. Cost mitigation Hi-rel Rad-Hard stdcells & IPs selection Metal-Customizable Logic Low troughput/power consumption FPGA Structured ASIC Full cust. ASIC

  33. Conclusions • CMOS 65nm provides needed performances for next generation satellite telecom payload processors • NBTI and HCI are well modeled and simulated • TID is not an issue, mitigation of SEUs needed • High performances SerDes derived from a proven IP used in telecom networking products • Robust dff + clock trees available libraries • End-users participate to demonstrator chip (4x6.25Gbit/s) definition, trade-offs, CDRs and tests • 2sd phase will target to provide ASIC capability

  34. Thank you! • See ST Rad-hard products at www.st.aerospace.com

More Related