Lite-On Semiconductor Corp. ( 敦南科技 )

Lite-On Semiconductor Corp.(敦南科技)

LITE-ON GROUP LITE-ON TECH CORP. (LITE-ON ELEC. INC.) (SILITEK CORP.) (GVC CORP.) PC/ INTERNET PLATFORM, COMM & SEMI BUSINESS LITE-ON IT. CORP. LITE-ON SEMICONDUCTOR CORP. DIODE INC. LITE-ON GROUP SINCE 1975 Chairman : Raymond Soong LITE-ON JAPAN LITE-ON AUTO. CORP. LITE-ON ENCLOSURE INC LITE-ON e Segment LITE-ON INC. INVESTMENT BUSINESS & CULTURAL FOUNDATION SILPORT INVEST. CORP. DYNA INVEST. CO., LTD. LITE-ON CULTURAL FOUNDATION.

敦南科技LITE-ON Semiconductor Corp. OUR VISION • TO BE A WORLD CLASS EXCELLENT COMPANY. OUR MISSION TO OFFER BEST QUALITY PRODUCTS AND SERVICES TO MAINTAIN CORPORATE GROWTH AND PROFITABILITY.

Brief of LITE-ON Semiconductor Capital : US$ 88.6M 資本額 Revenue : US$ 194M (Y2003 consolidated) 營業額 Employee : 3,919人 (up to Jul. 31, 2003) Main Products : CIS,Cmos Camera Module, Diodes, Rectifiers, Thyristors, Transistors 主要產品接觸式影像感測器、Cmos 照相模組,二極體、整流器、閘流體、電晶體 Facility : Hisn-Tien, Taiwan (Image) Cavite, Philippines (Image) Wuxi,China(Image) Keelung, Taiwan (Discrete) Shanghai, China (SSEC & KaiHong, Discrete)

Human Resource of LITE-ON Semi. • Shanghai • - Seefull (1073 人) • - Kai Hong (605 人) • Wuxi • - LSC (650人) • Missouri • - Fabtech (186人) • French • - DIC Sales Office (2 人) • Taipei • - LSC (697 人) • - DII (47 人) • Westlake • - DIC (73人) • Philippines • - Dyna Image (586 人) TOT EMPLOYEE 3,919人

KOREA Europe/America JAPAN • SHARP • KME (PANASONIC) • MGCS(PANASONIC) • SANYO • RICOH • BROTHER • KYOCERA MITA • OKI • MURATA • RISO • SAMSUNG • SINDO RICOH • KBT (CMOS) • MAXON (CMOS) • VOXSON(CMOS) • PHILIPS (AUSTRIA) • SAGEM (FRANCE) • HP • ESSNET (SWEDEN) • REINER (GERMANY) • ANATECH (America) • PAN (ITALY) • VISIONEER (America) • DOCUPORT (Canada) MAIN CUSTOMER LIST TAIWAN • BENQ • KIMPO (金寶) • LITEON TECH (SILITEK旭麗) • TECO (東友) • MUSTEK (鴻友) • PLUSTEK (精益) • UMAX (CMOS) • QUANTA (CMOS)

LITE-ON Semiconductor Organization Chart LITE-ON SEMICONDUCTOR CORP. 敦南科技股份有限公司 IMAGE SBG 影像事業群 CIS SBU CIS 事業部 CCM SBU CCM 事業部 Discrete SBU 分離式元件事業部 Wuxi Plant (無錫廠) Phili. Plant (菲律賓廠) Hsin-Tien Plant (新店廠) Wuxi Plant (無錫廠) Phili. Plant (菲律賓廠) Hsin-Tien Plant (新店廠) 上海旭福廠基隆廠

LITE-ON Semiconductor Organization Chart CMOS SBU J.M. Lin G.M. Project Management Jacky Tsai Sales & MKT Steven Cheng Project ENG. Meadi Jeng Process/Test ENG. Vincent Hsiao Procurement S. F. Chang QRA Fumio Chin

LITE-ON Semi. Corp. , Phils. , China

Inside the Factory & the Clean Room (100)

2.1 M module RGB output .18u; 1/2“; 10.5X10.5X7.77mm 1.3 M module RGB output .18u; 1/4“; 9X9X7mm Camera Module for Mobile Phone VGA module/YUV output .35u; 1/4 ”;8.0X8.0X6.0mm (2003-2004) .25u; 1/4.5 “; 7.5X7.5X5.0mm (2004-2005) 1.3 / 2.1 M RGB/YUV Interface: SPI / MMC Camera Module for PDA USB interface SD interface USB1.1 PC Camera USB 2.0 06 04 03 05 Roadmap of CMOS Camera Module

Structure of CMOS Camera Module COB TYPE: Lens Holder Target thickness: <6mm for VGA <6mm for CIF IR Filter Sensor Components 0.25mm PCB FPC 0.50mm

LSC total solution of CCM

COB vs. CSP

COST Comparison

Benefit of Socket solution • Shortening the Lead time of Camera module • Reducing the cost (w/o FPC, higher Yield rate) • Simplifying the production process of Module maker and customer (easier replace and test ) • Standardizing the connector spec of camera module

Lite-On Semiconductor Corp. ( 敦南科技 )