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EFW Overview and Status

EFW Overview and Status. Keith Goetz University of Minnesota. RBSP EFW Mission. Axial Booms (1 of 2). Spin Plane Booms (1 of 4). IDPU (inside S/C bus). Instrumentation Designs. IDPU. AXB (1 of 2), Stowed. SPB (1 of 4), Stowed. Instrumentation Engineering Test Units. Block Diagram.

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EFW Overview and Status

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  1. EFW Overview and Status Keith Goetz University of Minnesota

  2. RBSP EFW Mission Axial Booms (1 of 2) Spin Plane Booms (1 of 4) IDPU (inside S/C bus)

  3. InstrumentationDesigns IDPU AXB (1 of 2), Stowed SPB (1 of 4), Stowed

  4. InstrumentationEngineering Test Units

  5. Block Diagram

  6. UC Berkeley (SSL) Contribution

  7. Colorado (LASP) Contribution

  8. Outside Connections

  9. EFW Organization RBSP Project Office APL RBSP SWG EFW PI John Wygant UMN EFW Co-I team EFW PM Keith Goetz UMN EFW CAM Kim Cooper APL LASP lead Bob Ergun LASP UCB lead John Bonnell UCB SE Michael Ludlam UCB SMA Ron Jackson UCB Finance Kate Harps UCB LASP PM Mary Bolton LASP UCB PM John Bonnell UCB DFB SE Susan Batiste LASP Mechanical Paul Turin UCB Electrical Michael Ludlam UCB Flight Software Peter Harvey UCB Ground SW Will Rachelson UCB

  10. Team members Minnesota John Wygant EFW PI JWygant@fields.space.umn.edu Keith Goetz EFW PM Goetz@umn.edu Berkeley John Bonnell UCB Hardware Co-I and UCB PM JBonnell@ssl.berkeley.edu Michael Martin Ludlam EFW System Engineer and IDPU Lead MLudlam@ssl.berkeley.edu Forrest Mozer UCB Science Co-I FMozer@ssl.berkeley.edu Kate Harps UCB Financial Manager Harps@ssl.berkeley.edu Ron Jackson SMA - Mission Assurance and Parts RonJ@ssl.berkeley.edu Jorg Fischer SMA - Parts and Mission Assurance Jorg@ssl.berkeley.edu Christopher Smith EFW Thermal Engineer CSmith@ssl.berkeley.edu

  11. Team members Berkeley Dorthy Gordon IDPU - DCB FPGA Design dag@ssl.berkeley.edu Jane C. Hoberman EE - BEB, EFW-EMF I/F jch@ssl.berkeley.edu Rachel Hochman EE - Preamp RHochman@ssl.berkeley.edu Peter Berg EE - LVPS and Power Control pcb@ssl.berkeley.edu Peter Harvey Flight Software prh@ssl.berkeley.edu Paul Turin ME Lead pturin@ssl.berkeley.edu Gregory Dalton ME - SPBs gdalton@ssl.berkeley.edu Jeremy McCauley ME - AXBs jeremymc@ssl.berkeley.edu Bill Donakowski ME - IDPU Chassis billd@ssl.berkeley.edu Will Rachelson GSE Lead wrachelson@ssl.berkeley.edu Matt Born SDC Lead MattBorn@ssl.berkeley.edu

  12. Team members LASP Professor Robert Ergun LASP Hardware Co-I REE@lasp.colorado.edu Mary Bolton LASP PM Mary.Bolton@lasp.colorado.edu Susan Batiste LASP Sys Eng Susan.Batiste@lasp.colorado.edu Wes Cole EE - DFB Analog Eng Wesley.Cole@lasp.colorado.edu Ken Stevens EE - DFB FPGA Design KStevens@EfficientLogicDesigns.com Magnus Karlsson EE - DFB FPGA Verification Magnus.Karlsson@lasp.colorado.com David Summers EE - DFB FPGA Verification David.Summers@lasp.colorado.edu David Malaspina DFB Science Support David.Malaspina@lasp.colorado.edu Trent Taylor LASP QA Trent.Taylor@lasp.colorado.edu Ex officio Dave Curtis EFW Former System Engineer dwc@ssl.berkeley.edu David Pankow Advising ME - Design and Boom Dynamics DPankow@ssl.berkeley.edu

  13. Team changes since PDR Added a SOC Science Data Center (SDC) developer at SSL Matt Born Changed EFW Systems Engineer From: Dave Curtis moved to another project To: Michael Ludlam formerly IDPU lead Added LASP FPGA verifiers Magnus Karlsson David Summers Added LASP science support David Malaspina

  14. Review History RBSP Mission Concept Review 30-31 January 2007 RBSP Requirements & Mission Definition Review 2-4 October 2007 RBSP/EFW Preliminary Design Review (w/ SOC) 3-4 September 2008 RBSP Mission Preliminary Design Review 14-16 October 2008 RBSP/EFW Peer Reviews AXB, SPB, IDPU structure 28 July 2009 PRE, BEB, DCB electronics, backplane, harness 2 September 2009 DCB FPGA, DCB FSW 3 September 2009 DFB, DFB FPGA 10 September 2009 RBSP/EFW Critical Design Review 30 September 2009 RBSP Mission Critical Design Review 1-3 December 2009 RBSP/EFW SOC Critical Design Review 28 January 2010

  15. ICDR Entrance Criteria A successful IPDR Responses to RFAs in hand ICDR Readiness Meeting Preliminary ICDR Agenda Agreement ICDR Success Criteria Agreement Review Board charge ICDR technical documentation Updated baselined documents Instrument specifications Fabrication, assembly and integration plans Technical data package Operational limits and constraints Command and telemetry lists Verification & Validation plans (SE-001, SW-002, TE-001) Commissioning plans Updated risk assessment/mitigation Updated reliability analyses and assessments (MA-002) Updated logistics documentation (SE-006, TE-004) Software design documentation and specifications (SW-004) Limited life items (MA-002) Preliminary safety analyses (MA-006) Certification plans and requirements

  16. ICDR Success Criteria Design is expected to meet requirements with acceptable margins and risks Interface Control Documents allow fabrication High confidence in instrument baseline; documentation exists or will exist to allow fabrication, assembly, integration and test Instrument verification and validation plans are complete Testing approach is comprehensive; planning for assembly, integration, test and launch and mission ops sufficient Technical and programmatic margins and resources exist to allow development within budget, schedule and risk constraints Risks to success are understood, credibly assessed and manageable Safety and mission assurance have been adequately addressed

  17. ICDR Expectations Engineering model development has proceeded well AXB mechanism has been developed, tested and fully qualified SPB mechanism has been developed, tested and fully qualified ETU electronics have been developed and tested Initial performance looks good EFW system has been integrated with EMFISIS Demonstrates functional interfaces Flight and ground software allow end-to-end data flow We will continue to work with the ETU for the next month or two Characterization Self compatibility Thermal testing EMC testing (conducted emissions) Magnetics sniffing Zap testing Procedures and documentation are in place No major open issues EFW is ready to move into building flight hardware

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