Particles and Fields Package Monthly Status Review (MSR) November 15, 2011

1. Particles and Fields Package Monthly Status Review (MSR) November 15, 2011 Dave Curtis, PFP PM

2. Schedule Status STATIC, SWIA on critical path 9.6 weeks margin to delivery to LM Critical Path runs through electronics fab & test Boards are starting to come out of PWB fab, getting ready to start loading at JPL (who is quoting better delivery times than other subcontractors) Holding PFP package integration date for now April 2012 SWIA/STATIC calibration will not be complete at that time, get completed after package I&T (which hurts delivery margin) Note that STATIC takes the longest to qualify. If STATIC schedule deteriorates we could consider delivering that separately; the rest of the package has 12 weeks of margin Changed FSW Build 3 delivery from just before to just after PFP Environments Gives more time to include any changes/fixes required based on package level testing

3. Accomplishments EM progress: All EM testing complete except: STATIC calibrations REG #2 testing FM Electronic Progress: 17 PFP flight PWB fabricated, 7 loaded and in test MAG MAD & ACHE boards, SWEA IRAP boards in test 9 boards in PWB fabrication 3 boards through review and in final adjustments before fab 3 boards still in final layout REG, STATIC LVPS, STATIC ACC/MCP FM Mechanical LPW, SEP, MAG, SWEA, SWIA, STATIC mechanical parts all out to fab Most parts received and in assembly PFDPU getting out to fab now Flight harness fabrication started, fit-checked on Spacecraft mock-up More in instrument sections…

4. PFP Harness Fit Check PFP Flight harnesses fit-checked on the LM harness mock-up 2011-11-08

5. Ongoing Work Supporting Project planning process Supporting EMC, Payload, SIT working groups Get last of FM PWBs out to fab Get FM PWBs loaded Get board level thermal and PSA complete

6. PFP RFA Status

7. Trades, Issues Working on an analysis to decide if the PFDPU mechanical design needs to be augmented to support the PWBs to avoid excessive displacements in vibe Reached agreement on solution (DFB stiffener characteristics) Adds mass to PFDPU to enhance stiffness of chassis. CLOSED PFDPU Thermal conduction to deck Current design does not meet ICD Modifying deck mounting to increase conductivity Open issue with Deck Temp at start of cruise 40C, at top of AFT for PFDPU

8. Thermal Status Working on board level thermal analyses Board analysis model in place and providing results and feedback into layouts Some thermal data and final layouts from a few board leads still outstanding Submit current status, minus a few boards? Working on updated instrument thermal models for submission in December Held a review of PFP Instrument-level Thermal Balance plans with Project participation MAG, SEP, SWEA, and STATIC will get instrument-level thermal balance tests PFDPU, LPW booms, EUV, and SWIA will not

9. Top Risks LPW Sensor Coating concern new Parts qual almost complete; retire next month?

10. Risks List

11. PFP Mass No change this month

12. Mass Tracking Chart

13. PFP Power Measured IIB EM power converter efficiency improved efficiency slightly New Peak and Standby allocations per ECR203E Reallocated power NTE between boxes Positive margins throughout

14. PFP Power Trend

15. PFP Data Rate Latest allocations per TRAS Including pending CCR364

16. Life Testing SEP Attenuator life test complete SWEA door mechanism identical to STEREO LPW relay life test complete LPW deployment life test completed SWIA, STATIC attenuator life test completed SWIA, STATIC door mechanism functional, life test completed

17. Requirements Verification Status Boot software Acceptance Test completed Flows up to a few ICD and FRD requirements verified All life tests completed

18. MAVEN PFP MAG Status November 2011 Jack Connerney, MAG Lead

19. GSFC/MAG - Accomplishments Last Month MAG flight sensors (FM1 & FM2) thermal stress relief completed. FM1 (Flight #1) MAD (Magnetometer Analog & Digital) circuit board initial tuning is completed (minus FPGA). FM2 (Flight #2) MAD circuit board initial tuning is completed; initial scale factors determined at 22’ GSFC facility (rev02 FPGA installed). FM1 ACHE (AC Heater Electronics) circuit board completed, on bench in test; FM2 ACHE circuit board assembly nearing completion. FPGA (rev 3) code in simulation and test. First set TAYCO flight a/c heater elements scheduled for delivery in Lab on or before 12/12/2011. GSFC provided to LM complete drawings for sensor attachment bracket & solid model of sensor. Sensor bracket, sensor EMI cover (shielded), thermal blanket mold in fabrication. Supported ATLO TIM at LM Denver 10/25-26. GSE (UCB emulator) development continues; display options, instrument housekeeping telemetry conversion to EUs, etc.

20. MAVEN MAG FM1 ELECTRONICS (ACHE)

21. MAVEN MAG FM1 HARDWARE MAVEN MAG FM1 SENSOR FM1 ELECTRONICS (MAD) BOARD

22. GSFC/MAG Near Term Plans & Open Issues GSFC to complete a review of revised MICD when available (LM). Attachment bracket Position pigtail connector Position ground wire and cable attachment(s) Re-run thermal model (w/3-layer thermal blanket on 0.66 m extension aka “boomlet”) prior to ACHE board completion. Complete fabrication of sensor mechanical pieces (thermal stand-offs, base plate, etc) and mechanical GSE for MAG test facility. Complete physical model(s) of sensor assembly and attachment bracket for thermal blanket shops at GSFC (sensor) and LM (boomlet). Design and fabrication of sensor thermal blanket. Need commitment from Project and LM on hours of operation PFP instrument package will receive after delivery to LM; similarly, need commitment from UCB on hours of operation MAG will receive after delivery to UCB.

23. MAVEN PFP SWEA Status October 2011 Dave Mitchell, SWEA Lead

24. SWEA Status - IRAP • FM calibration in progress • Azim/Elev response for upward deflections measured. • Azim/Elev response for downward deflections in progress. • Energy and UV responses scheduled for Nov. 17-18. Elevation = 0

25. SWEA Status - SSL • FM Digital fab complete, coupons sent out for testing. • Part loading instructions & board level procedures complete • Flight design FPGA tested on EM (don’t expect any more changes prior to burning the flight part). • FM LVPC magnetic wind & test (in progress) • Board level procedures complete • EM LVPC integrated and tested in vacuum SWEA ETU IRAP analyzer IRAP front-end electronics Digital board installed into pedestal SSL pedestal (LVPS & Digital)

26. SWEA Issues • Further investigation of charging anomaly • Both SSL and IRAP EM’s exhibit the charging anomaly. • For the SSL EM, Nuflon removed from the top cap and then the entire part was plated with gold. Tests were repeated, and the same charging anomaly was observed. • For the SSL EM, top cap, deflectors, and outer hemisphere removed. • Testing at IRAP shows that MAVEN FM does not exhibit this behavior. • Testing planned for STEREO flight units. • Vacuum tests repeated. • Lower portion of SSL EM does not exhibit the charging behavior. • Anomaly is associated with upper part of the sensor.

27. MAVEN PFP SWIA Status November 2011 Jasper Halekas, SWIA Lead

28. SWIA Progress • Electrical Progress • EM noise issues solved • FM layouts in progress • All FM layouts out to fabrication • Digital and Anode PWB fabrication complete • Coupons in analysis at GSFC • FM kitting in progress for all boards, mostly complete • Mechanical Progress • All FM drawings complete • All FM parts in fabrication • Calibration/Testing • EM Testing complete • New cal chamber and manipulator ready for FM testing • Some testing with SWEA currently shaking out a few remaining issues with manipulator, but by and large, calibration setup looking good • New ion gun in assembly, expected complete before end of the year • Plan to use EM to check out ion gun and test out manipulator scripting for FM calibration

29. SWIA Issues • EM electronics noise issue solved • Tracked down to poor ground connection between chassis and preamp analog ground • Solved by using a shim to make good ground connection between standoff and ground pad on EM, solved by design on FM • Coupon testing and board loading next • Hoping these won’t be chokepoints • May be able to utilize JPL excess capacity for some of the board loading tasks

30. MAVEN PFP STATIC Status November 2011 Jim McFadden, STATIC Lead

31. STATIC Accomplishments FM carbon foil mounting begun Sensor and EM electronics, minus LVPS, tested in vacuum Anode, Preamp, TDC, HV Sweep, and Digital FM PCB fabrication packages being prepared. LVPS modified to reduce power dissipation FM mechanical drawings completed, reviewed and approved. Mechanical parts being ordered for FM fabrication Ion feedback in Z-stack MCPs observed. HV testing procedures modified to avoid this issue.

32. STATIC Plans TDC EM2 PCB fabricated, loaded, in test Modified LVPS needs vacuum testing with EM electronics & sensor Acc/MCP HVPS Board needs layout modifications for FM PCB High level data products generated by FPGA still need validation TDC ADC latch-up protection needs testing in next version of FPGA Ion Gun integration with new cal chamber in process. Mechanical parts fabricated to allow testing of TOF with increased distance between TOF and MCPs to reduce field emission - in test. Vacuum sensor testing continuing

33. STATIC Open Issues EM Sweep HVPS developed problems during vacuum testing, Vgrid OpAmp failed, circuit modified to prevent current surge at +28V turnon to prevent future failure. EM LVPS ~200 kHz noise needs testing with SWP HVPS Encoder failure on new manipulator –– being evaluated and fixed

34. MAVEN PFP SEP Status October, 2011 Davin Larson, SEP Lead David Glaser, SEP ME Miles Robinson, SEP EE

35. SEP Status DFE (sensor preamps) PWB fabricated, waiting on coupon results Will load these boards at SSL DAP (analog electronics in PFDPU) PWB in fab Sensor Mechanical parts in house Working on painting of parts Tricky GSFC conductive white paint, practice on EM

36. MAVEN PFP DCB, Power Converter & GSE Status November 2011 Dorothy Gordon Timothy Quinn Peter Berg Chris Tiu

37. DCB Status DCB and FLIGHT FPGA Daughter Boards Flight PCB Layout Flight DCB is in fabrication – due in 11/16/11 Flight FPGA daughter board fabrication Delayed in order to meet the board thickness (0.063”) requirement (new material ordered by the Fabrication Facility) DCB FPGA Rev 11 has been released, and is installed on both DCB-ETUs DCB Diagnostics Most recent functions added to DCB Diagnostic Test Suite (Memory Pattern and Address Tests) complete the functionality for the Flight Test Procedure This release will programmed into the “Diagnostic Section” of the DCB Boot ROM

38. Power Converter Status REG board REG1 board used for the ETU-PFDPU test will eventually be replaced by REG2 Revised Instrument Current Monitor subsystem installed on REG2, checkout/verification in process Continuing optimization of the power converter efficiency IIB Board Revised converter design (increased fault tolerance) tested in the ETU PFPDU during the MAG reintegration FM layout review completed Thermal Review passed Flight board is in fabrication

39. PFDPU & GSE Status Reintegrated MAG and LPW with the ETU PFDPU MAG FPGA upgrade LPW retest with most recent FPGA MISG Hardware/Firmware Six new MISG Boards have been tested One to be included in the PFP-HFS Two in use for Instrument Mode Development/Support GSEOS Manipulator control subsystem in test/development Continuing support for Flight Instrument GSE functions Supported instrument “reintegration” (MAG and LPW) High Fidelity Simulator (PFP-HFS) Most parts are in, chassis and cabling in process

40. MAVEN PFP Flight Software Status November 1 2011 Peter Harvey

41. Boot Status • Interface Documents, Meetings • None • IV&V • None • FSW Development • Modified APID 23 to have 24 instead of 32 mux values • Rolled the version to 1.03. • Test Status (FPGA revision 11) • Long Duration Stress Test, MAVEN_PF_FSW_025_LDS_110917.doc • Boot Inspection Report, MAVEN_PF_FSW_024_Inspection.doc • Repeated Comprehensive Performance Test, MAVEN_PF_FSW_023_CPT_111024.doc • Wrote Version Descriptor, MAVEN_PF_FSW_027_VDD_V103.doc • Saved all Relevant Files on the FTP site ftp://apollo.ssl.berkeley.edu/pub/prh/MAVEN/fsw/4.1%20Boot/ • Dates coming up • 11/15 – Boot FSW ATR • TBD – Boot Test with Actuators • TBD - PROM Burn

42. Operational Status • Interface Documents, Meetings • Reviewed SEP specification. Will need to revise requirements • New Requirements • Monitor Actuator status (2-bit version) being added to Level 5 • Modifying actuator duration requirements • Modifying SEP requirements • Placing requirements on RTS sequences • IV&V • Reviewed schedule of development for code review next year • FSW Development • DCB HSK from 32 to 24 qty -> Mod to Ap23, CTM, Code • Developed Solid State Recording Module (SSR) to verify DCB Flash Hardware • Developed AP21 & table 9 to be able to watch SSR read/write positions • Updated IO HSK to return Flash settings • Test Status/Tools • Updated instrument simulator for LPW simulation • Issues • FLASH memory & computer speed are not the same as in RBSP! • Currently, NULACCERR flag is reported by FPGA possibly indicating race condition between FSW and FLASH. To be diagnosed next.

43. Test Environment • GSEOS Status: • Instrument simulation (still in work) • Limit checking error messages (uses raw values, not converted) • GSEOS Python Test Scripts, Displays • Need to Build Operational Test Scripts • FSW Development Platform: • Configured for Boot Testing • Instrument CDI Recording Added • Need to Configure with Attenuator simulation for Operational Testing • Need to Configure with Instrument simulation for Operational Testing • Testing Personnel: • No changes

44. SPRs and SCRs

45. Metrics Chart

46. Defect Chart

47. Safety and Mission Assurance Quarterly Status Report (QSR) NOVEMBER 2011 Jorg Fischer, PFP SMA

48. SMA SUMMARY OCTOBER 2011 SMA received FM parts from GSFC and started on FM parts kits, prepared and supported layout reviews, SOW, and PWB fabrication and assembly preparation efforts; supported ESD and calibration checks. Alert checks were performed – no new issues. We received the first flight fastener order and QA is in process of incoming and dimensional inspections.

49. SMA SUMMARY SMA support of FSW reviews and inspections was provided. Operators attended NASA workmanship training classes. The QA team provided follow-up support for the MAVEN Travel Book Documentation to the EEE and Mechanical teams. QA provided an incoming inspection report sheet and updated PFR form. Also, QA attended the NASA supply chain conference held on October 18th-20th, at GFSC.

50. SMA SUMMARY - MAVEN FLT KITS FLIGHT kits for SWIA Digital, SWEA Digital, SWIA Anode, PFDPU DCB, IIB, SWEA LVPS, SWIA LVPS, SWIA Sweep, STATIC Sweep, SEP DFE, LPW Axial Boom Unit Wiring, Frangibolt SIM Wiring, and Harnesses.