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A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach

A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach. Presented at the ECEN5005 SEMINAR SPONSORED BY IEEE EDS DENVER CHAPTER UNIVERSITY OF COLORADO, ENGINEERING CENTER, ECEE 265 Thursday March 20, 2003 4:00-6:00 PM. Dave DeWire RJR Polymers Inc.,

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A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach

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  1. A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach Presented at the ECEN5005 SEMINARSPONSORED BY IEEE EDS DENVER CHAPTERUNIVERSITY OF COLORADO, ENGINEERING CENTER, ECEE 265Thursday March 20, 2003 4:00-6:00 PM Dave DeWire RJR Polymers Inc., Oakland, California 510-638-5901

  2. Who is RJR Polymers, Inc. • Headquartered in Oakland California • Technology company • Worldwide Sales and Engineering force • Full service/ solution provider • Electronic Air Cavity Packaging • Pre-Applied adhesives • Air Cavity Lids • Lidding Equipment • Engineered Solutions • Satisfy customer from Prototype to Volume Manufacturing

  3. RJR’S Market Mix • RF/ Wireless • Imaging • Medical • Military • WAN/ LAN/ Broadband • Telecom • Automotive • MEM’s, MOEM’s, sensors, etc.

  4. Let’s talk about RF Packaging • The Perception of RF Power • Handset ~ 1 watt • Base Station ~ 10 to 200 watts • Broadcast transmitter ~ 1 to 100 kilowatts • Radar – kilowatts to megawatts • For “coverage enhancement” applications it’s usually a few watts • Between handset and basestation • The essence of RF Packaging • Electrical and environmental performance is a given • Thermal dissipation is the key element • Manage junction temperature • High performance path(s) to the outside world • Robust and Reliable • In this economy - the lowest overall cost while managing the above is the greatest measure of success.

  5. Common RF Packaging • What types are available to engineers today ? • Metal • Ceramic • LTCC/ Ceramic • Transfer Molded Plastic • No Packaging

  6. Cover material Lid seal Sidewall material Lead seal Lead material and finish Base seal Base material and finish Package Elements to Consider • Plus the process! • Design • Assembly

  7. The Range of Thermal Conductivities Thermal Conductivity W/mK Some significant new materials in the 25 to 75 W/mK range are emerging. Ex. Diemat epoxies and Cool Polymers

  8. Advantages/ Disadvantages • Metal Packaging • Advantages • Hermetic • Thermal • Hi Performance • Large Cavities • Disadvantages • Costly (largely machined) • Expensive to assemble • Seam Seal/ Laser Weld • Not commercially acceptable for many applications • Weight

  9. Advantages/ Disadvantages • Ceramic Packaging • Advantages • Hermetic • Thermal • Die attach up to AuSn Temps • Operating temperatures are high • Disadvantages • Expensive/ Market price • Can be substantial tooling costs • Package is inherently costly • Brazing, etc. • Laser Machining, pressing, etc. • Poor Lid Seal surface • Quality RF feed thru’s are expensive

  10. Advantages/ Disadvantages • LTCC Ceramic Packaging • Advantages • Price • Tooling costs • Good CTE • Multilayering • Low loss conductors (Cu, etc.) • Integrated passives • Miniaturization (small line geometry) • Disadvantages • Price vs PCB’s • Thermal • Higher Dielectric (7.8 > 20GHz)

  11. Advantages/ Disadvantages • Plastic Packaging • Advantages • Price, Price, Price • Standard outlines • Infrastructure advantages • Disadvantages • Tooling costs • Thermal • Very Lossy • Marginal High Frequency Performance • Thermal • Non-hermetic • No Cavity

  12. R-Pak Air Cavity Packages !Adaptable Technology for a broad range of applications So what’s new ? • Plastic backed for low power package applications like sensors • CCD / CMOS for vision and optical sensor applications with glass covers • Thermally enhanced metal backed for microwave and power applications

  13. What is R-Pak ? • A process that takes the most of the best elements of traditional packaging formats and combines them into one • Works in tandem with the benefits provided with the use of LCP (Liquid Crystal Polymers) • Allows the engineer to “Build” a package using all the elements necessary to the device and final product • Allows the designer to manage cost

  14. The R-Pak Process • Packages are molded around leadframes in a multi-up format • cost effective for molding and downstream assembly • Plastic formulated to match the CTE of copper for low stress and reliability • Leads are coated with moisture resistant polymer before injection molding • RJR ITS equipment supports package assembly and sealing

  15. RJR’s Injection Molded Packages • Package StackupUS Pat 6,511,866 • Thermal Base (Cu, WCu, CuMoCu, AlSiC, etc) • Sidewall with leads • Lids with epoxy (pre-applied) • RJR formulated epoxy as interstitial layers • Plastic alloy formulated to match the CTE of Copper or Copper alloys or Alloy 42 (WCu, CuMo, etc.) • Leads are coated with moisture resistant polymer, then injection moldedUS Pats 5,816,158; 6,214,152 • The 3 layers are bonded together using RJR IsoThermal Sealing (ITS) equipmentUS Pat 5,056,296

  16. RJR Plastic Alloy – HTP-1280 • R-Pak Plastic Body Compound • This custom thermoplastic compound is used in RJR R-Pak plastic body package technology. The following properties are typical for the bulk material molded into standard test configurations defined by the applicable test method. These property values are intended for general engineering purposes and are not intended for establishing product specifications. • Physical: • Density: 1.67 gm/cc ASTM D792 • Water Absorption 0.02% ASTM D570 • Mechanical @ 23C: • Tensile Strength 21,000 PSI ASTM D638 • Tensile Modulus 2.5 X 106 PSI ASTM D638 • Elongation @ Break 1.2% ASTM D638 • Flexural Strength 31,000 PSI ASTM D790 • Flexural Modulus 2.4 X 106 PSI ASTM D790 • IZOD Impact Strength Notched 1.6 ftlb/in ASTM D256 • Thermal: • Melting Point 280C (536F) ASTM D3418 • DTUL @ 1.8 Mpa (264 PSI) 270C (518F) ASTM D648 • Electrical: • Volume Resistivity 1012 ohm-cm ASTM D257 • Surface Resistivity 1017 ohm IEC 93 • Dielectric Strength 766 V/mil ASTM D149 • Dielectric Constant 3.8 @ 1 kHz ASTM D150 3.7 @ 100 kHz 3.7 @ 10 MHz • Dissipation Factor 0.007 @ 100 kHz ASTM D150 0.003 @ 10 MHz ASTM D150 • Arc Resistance 165 Sec. ASTM D495 • Comparative Tracking Index 175 volts ASTM D3638 • Chemical Resistance: • Not affected by: Water, Acetone, MEK, Methyl celusolve, Hexanes, (Sulfuric Acid, Nitric Acid, and HCl) as used in electroplating baths.

  17. Package lid with pre-applied adhesive Lid Material: Plastic, Ceramic, Metal, Glass, etc. Injection molded sidewall Shown with moisture resistant seal encapsulating the leads and pre-applied adhesive on bottom surface Wire Bonds Device Thermally-Enhanced Package Exploded View Solder Preform or Epoxy, etc. Package Base Base Material: Cu, Cu/Mo, Cu/Mo/Cu, WCu, Al2O3, BeO, DBCu, etc. Completed Package

  18. Epoxy Sealing Materials • Common properties • Minimal moisture transmission • Low ionics • Very low volatiles (outgassing) • Cure in minutes for efficient assembly • Lead primer formulation • Adherent to LCP and lead finish • Viscosity supports efficient lead coating process • Sealing epoxy • Uniform cover and sidewall coating • Easily B-staged

  19. Sealing Equipment - ITS(Isothermal Packaging System) • Semiautomatic • Custom Designed and Built Plates • Controls: • Time • Pressure • Temperature • UPH: 600 - 700* • 99% + Yield ** Run Rates are Dependant on Package Size and Configuration

  20. Thermally-Enhanced Package Build Process Process Steps RJR Polymers 2) Leadframe with moisture barrier applied 3) Injection mold sidewall over leadframe 4) Nickel and Gold plate leadframe 5) Epoxy coat molded sidewall 1) Package Base Customer location –or- RJR Location 6) Perform Die attach to base leadframe 7) Using RJR’s ITS system – attach assembled base leadframe to coated injection molded sidewall 8) Wire Bond device to package 9) Using RJR’s ITS system – seal package lid to molded sidewall 10) Trim, Form and singulate

  21. Advantages/ Disadvantages • R-Pak Packaging • Advantages • Low Cost • Prototype tooling cost is low • Cost Control • High Power • High Frequency • Near Hermetic • Lots of options • Less expensive than Ceramic • Thermal • Flat seal surface • Design Flexibility • Additional Elements (Partial Matching) • Disadvantages • Not classically Hermetic • “Near” Hermetic 10-8 • Custom Package Tooling costs (~$60k) • Not the “magic bullet”

  22. 3.9mm The Partially Matched Plastic Package • The RJR partially matched, air cavity plastic microwave power package enables efficient packaging at 5 GHz • integrated matching structures in the package transform very low device impedance to a more friendly higher impedance • metal base provides high power dissipation and eutectic die bonding capability and an excellent ground return • lower cost than ceramic packaging with much more functionality

  23. Some Other Nice Features • Moisture Resistant • pass JEDEC Level I Moisture Pre-Conditioning • Robust • pass –65°C to +150°C temp cycle • Mil-Std 883; Method 1010; Condition C • High performance • typically better electrical performance than ceramic • Lower cost packages but also • substantially lower tooling costs. • rapid prototyping

  24. RELIABILITY TESTING • RESULT • TEST • CRITERIA • SO2F • SO8 • LD2 • V32 • V48 • V52 • THERMAL SHOCKJEDEC A106A, Condition C.15cycles, +125°C to -65°C • GROSS LEAKJEDEC A109, Condition C1&3 • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • MOISTURE SENSITIVEJEDEC A112A / J-STD-20-A+85°C/85%HR, 168hrs • DIE PENETRATIONMIL-STD- 883E, Method 1034 • 20/20 Pass • 20/20 Pass • 20/20 Pass INC INC INC • INTERNAL VISUALMIL-STD-883E, Method 2014 • SOLDER REFLOWJEDEC A112A / J-STD-20-ACONV OVEN MAX. TEMP +220°C • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • PACKAGE COPLANARITYJEDEC B108 • 20/20 Pass • STABILIZATION BAKEJEDEC A103ATEMP +150°C, 200hrs. • PHYSICAL DIMENSIONSJEDEC B100A INC INC INC INC INC INC • TEMPERATURE CYCLINGJEDEC A104B, Condition B100 CYCLES, +125°C to -55°C INC INC INC INC INC INC • PRECONDITIONINGJEDEC A113B+85°C/85%HR, 168hrs • N= 20 20/20Pass INC INC INC INC INC • WIRE BONDABILITY • WIRE PULL STRENGTHMIL-STD-883E, Method 2011.7N= 20 • MAX/MIN10.5g 8.5g12.1g 8.1g • MAX/MINXX.Xg X.XgXX.Xg X.Xg • MAX/MINXX.Xg X.XgXX.Xg X.Xg • MAX/MINXX.Xg X.XgXX.Xg X.Xg • MAX/MINXX.Xg X.XgXX.Xg X.Xg • MAX/MINXX.Xg X.XgXX.Xg X.Xg • DIE ATTACHABILITY • INTERNAL VISUALMIL-STD-883E, Method 2010.10 & 2017.7N= 20 • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass

  25. Eutectic Die Attach in an Air Cavity Plastic Package ! In Summary • Features: • Eutectic Die attach • Moisture resistant • Low CTE • CTE matched package • Low Dielectric • Low Parasitics • High Power • High Frequency • Low Cost ! The R-Pak low cost injection molded packaging process combines the thermal advantages gained by using a eutectic die attach material between die and backplane with a moisture resistant plastic sidewall specifically designed to manage higher frequency and power. • Package Applications: • RF/ Microwave • WLAN/ LAN • Short Range Wireless • MEMS/ MOEMS • LDMOS • CCD/ CMOS

  26. Thank You

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